Intel® Pentium® 4 Processor in the 423-pin Package Thermal-Mechanical Support Design Guide Version 1.
Intel® Pentium® 4 Processor in the 423-pin Package Thermal-Mechanical Support Design Guide Version 1.0 DISCLAIMERS 1. INTEL CORPORATION (AND ANY CONTRIBUTOR) IS PROVIDING THIS INFORMATION AS A CONVENIENCE AND ACCORDINGLY MAKES NO WARRANTIES WITH REGARD TO THIS DOCUMENT. IN PARTICULAR, INTEL (AND ANY CONTRIBUTOR) DOES NOT WARRANT OR REPRESENT THAT THIS DOCUMENT OR ANY PRODUCTS MADE IN CONFORMANCE WITH IT WILL OPERATE IN THE INTENDED MANNER.
Intel® Pentium® 4 Processor in the 423-pin Package Thermal-Mechanical Support Design Guide Version 1.0 Contents 1. Overview...........................................................................................................................4 1.1 Related Documents ......................................................................................................4 2. Thermal-Mechanical Support Solution.....................................................................5 2.1 2.2 2.
Intel® Pentium® 4 Processor in the 423-pin Package Thermal-Mechanical Support Design Guide Version 1.0 1. Overview This design guide outlines a successful thermal- mechanical support solution for the Intel® Pentium® 4 processor in the 423-pin package. The recommended solution is one proposed method to support large- mass heatsinks during shipping and handling of the product.
Intel® Pentium® 4 Processor in the 423-pin Package Thermal-Mechanical Support Design Guide Version 1.0 2.
Intel® Pentium® 4 Processor in the 423-pin Package Thermal-Mechanical Support Design Guide Version 1.0 Direct chassis-attach is one method that has been tested for managing large- mass heat sinks during mechanical shock and vibration conditions. There may be some chassis, motherboard, and heatsink combinations in which direct chassis-attach may not eliminate the damage induced by large motherboard deflections.
Intel® Pentium® 4 Processor in the 423-pin Package Thermal-Mechanical Support Design Guide Version 1.0 2.1 Motherboard Design The retention mechanism should be located in relation to the ATX mounting holes as shown in Figure 2 to allow for direct attachment to the chassis. The two-piece enabled retention mechanism cannot be pre-attached to the motherboard. Therefore, motherboards intended for use by system integrators should supply two (2) retention mechanisms and two (2) heatsink clips with each board.
Intel® Pentium® 4 Processor in the 423-pin Package Thermal-Mechanical Support Design Guide Version 1.0 2.2 Chassis Design The retention mechanism is attached to the chassis via four (4) standoffs, as shown in Figure 3. These standoffs are in addition to the standard ATX mounting holes defined in the ATX Specification, Version 2.03. The standoffs must be removable to maintain backward-compatibility with boards that do not support Pentium® 4 processors.
Intel® Pentium® 4 Processor in the 423-pin Package Thermal-Mechanical Support Design Guide Version 1.0 2.3 Hardware The screws should be 6-32 (x 1/2 inch-3/8 inch) pan-head or round-head screws (four each) for the direct chassis-attach solution. The screw head must be less than 0.284 inch diameter and less than 0.190 inch in height. It is the responsibility of the chassis vendor to supply the four (4) 6-32 screws with the chassis. 3.
