R Intel® E7500 Chipset Design Guide E7500 Memory Controller Hub (MCH) Thermal and Mechanical Design Guidelines February 2002 Document Number: 298647-001
R ® Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document.
R Contents 1 Introduction ..........................................................................................................................7 1.1 1.2 1.3 Design Flow ............................................................................................................8 Definition of Terms..................................................................................................9 Reference Documents ......................................................................................
R Figures Figure 1. Thermal Design Process ......................................................................................8 ® Figure 2. Intel E7500 MCH Package Dimensions (Side View) ........................................11 ® Figure 3. Intel E7500 MCH Package Dimensions (Top View) .........................................12 Figure 4. 90° Angle Attach Methodology ...........................................................................18 Figure 5. 0° Angle Attach Methodology (Top View)...........
R Revision History Revision Number -001 ® Description Initial Release.
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Introduction R 1 Introduction As the complexity of computer systems increases, so do the power dissipation requirements. Care must be taken to ensure that the additional power is properly dissipated. Heat can be dissipated using improved system cooling, selective use of ducting, and/or passive heatsinks. The objective of thermal management is to ensure that the temperatures of all components in a system are maintained within functional limits.
Introduction R 1.1 Design Flow To develop a reliable, cost-effective thermal solution, several tools have been provided to the system designer. Figure 1 illustrates the design process implicit to this document and the tools appropriate for each step. Figure 1.
Introduction R 1.2 Definition of Terms Term ® Definition BGA Ball Grid Array. A package type defined by a resin-fiber substrate, onto which a die is mounted, bonded and encapsulated in molding compound. The primary electrical interface is an array of solder balls attached to the substrate opposite the die and molding compound. ICH3-S I/O Controller Hub. The chipset component that contains the primary PCI interface, LPC interface, USB, ATA-33, and other legacy functions. MBGA Mini Ball Grid Array.
Introduction R 1.3 Reference Documents Document Document Number Intel® Xeon™ Processor Thermal Design Guidelines http://www.intel.com/design/Xeon/guides/298348.
Packaging Technology R 2 Packaging Technology The E7500 chipset consists of three individual components: E7500 MCH, 82870P2 P64H2, and 82801CA ICH3-S. The E7500 MCH utilizes a 42.5 mm, 6-layer FC-BGA package shown in Figure 3 and Figure 2. For information on the P64H2 package, refer to the Intel® 82870P2 PCI/PCI-X 64-bit Hub 2 (P64H2) Thermal and Mechanical Design Guidelines and the Intel® 82870P2 PCI/PCI-X 64-bit Hub 2 (P64H2) Datasheet.
Packaging Technology R ® Figure 3. Intel E7500 MCH Package Dimensions (Top View) AN AM Detail A AL AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J 21.250 H G F E E C B 1.270 A 28 22 26 24 20 18 16 14 12 10 33 32 31 30 29 23 17 15 13 11 27 21 9 25 19 8 7 6 5 4 3 2 1 1.270 20.320 40.640 2x 42.500 ±0.100 0.200 A B Detail A Solder Resist Opening (n)x 0.650 ± 0.040 00.200 L C A S B 00.071 L C Metal Edge (n)x 0.790 ± 0.025 (n)x 0.025 Min MCH_Pkg_TopView NOTES: 1.
Thermal Simulation R 3 Thermal Simulation Intel provides thermal simulation models of the MCH and associated user’s guides to aid system designers in simulating, analyzing, and optimizing their thermal solutions in an integrated systemlevel environment. The models are for use with the commercially available Computational Fluid Dynamics (CFD)-based thermal analysis tool “FLOTHERM*” (version 3.1 or higher) by Flomerics* Inc.
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Thermal Specifications R 4 Thermal Specifications 4.1 Power See Table 1 for TDP specifications for the E7500 MCH. FC-BGA packages have poor heat transfer capability into the board and have minimal thermal capability without thermal solutions. Intel recommends that system designers plan for one or more heatsinks when using the E7500 chipset. 4.2 Die Temperature To ensure proper operation and reliability of the MCH, the die temperatures must be at or below the values specified for the MCH in Table 1.
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Thermal Metrology R 5 Thermal Metrology The system designer must make temperature measurements to accurately determine the thermal performance of the system. Intel has established guidelines for proper techniques of measuring the MCH die temperature. Section 5.1 provides guidelines on how to accurately measure the MCH die temperatures. Section 5.2 contains information on running an application program that will emulate anticipated maximum thermal design power.
Thermal Metrology R Figure 4. 90° Angle Attach Methodology Thermocouple Wire Heatsink Substrate 3.3 mm (0.13 in.) Diameter Hole Die Thermocouple Bead 90° Angle Attach NOTE: Not to scale. 5.1.2 0° Angle Attach Methodology 1. Mill a 3.3 mm (0.13 in.) diameter hole centered on bottom of the heatsink base. The milled hole should be approximately 1.5 mm (0.06 in.) deep. 2. Mill a 1.3 mm (0.05 in.) wide slot, 0.5 mm (0.02 in.) deep, from the centered hole to one edge of the heatsink.
Thermal Metrology R Figure 5. 0° Angle Attach Methodology (Top View) Die Thermocouple Wire Cement + Thermocouple Bead Substrate angle_attach_1 NOTE: Not to scale. Figure 6. 0° Angle Attach Heatsink Modifications 1.3 mm (0.05 in.) (0.5 mm (0.02 in.) Depth) 3.3 mm (0.13 in.) Diameter (1.5 mm (0.06 in.) Depth) Angle_Attach_Heatsink_Mod NOTE: Not to scale.
Thermal Metrology R 5.2 Power Simulation Software The power simulation software is a utility designed to dissipate the thermal design power on a MCH when used in conjunction with an Intel® Xeon™ processor with 512-KB L2 cache. The combination of the Intel® Xeon™ processor with 512-KB L2 cache and the higher bandwidth capability of the E7500 chipset enables new levels of system performance.
Reference Thermal Solutions R 6 Reference Thermal Solutions Intel has developed a reference thermal solution designed to meet the cooling needs of the MCH at worst-case conditions. This chapter describes the overall requirements for the reference thermal solution, including critical-to-function dimensions, operating environment, and validation criteria. Other chipset components may or may not need thermal solutions, depending on specific system local-ambient operating conditions.
Reference Thermal Solutions R Figure 8. Reference Heatsink Volumetric Envelope for the MCH 40 mm (1.6 (Tall Keep-out Above Motherboa 28 mm (1.1 (Short Motherboa MCH 42.5 mm (1.67 42.5 (1.67 42.5 mm (1.67 Heatsink_Volumetric_Envelope NOTE: Not to scale.
Reference Thermal Solutions R 6.3 Thermal Solution Assembly The reference thermal solution is a passive extruded heatsink with thermal and mechanical interfaces. It is attached using a clip with each end hooked through an anchor soldered to the board. Figure 9 shows the reference thermal solution assembly and associated components. Figure 9 and Figure 10 show alternate views of the reference solution.
Reference Thermal Solutions R Figure 10. Reference Thermal Solution Assembly (Side View) Figure 11.
Reference Thermal Solutions R 6.3.1 Heatsink Orientations To enhance the efficiency of the reference thermal solution, it is important for the designer to orient the fins properly with respect to the mean airflow direction. Simulation and experimental evidence have shown that the MCH heatsink thermal performance is enhanced when the fins are aligned with the mean airflow direction (Figure 12). Aligning the heatsink 45° relative to the airflow is acceptable but delivers reduced thermal performance.
Reference Thermal Solutions R 6.3.2 Extruded Heatsink Profiles The E7500 chipset reference thermal solution uses an extruded heatsink for cooling the MCH. Figure 13 shows the heatsink profile. This document does not provide tolerance information. Check with your heatsink supplier for specific tolerances. Appendix A lists suppliers for the extruded heatsink. Other heatsinks with similar dimensions and increased thermal performance may be available, including the tall heatsink shown in Figure 14.
Reference Thermal Solutions R 6.3.3 Mechanical Interface Material Intel recommends the use of a mechanical interface material to avoid cracking of the exposed die under loading. The interface material reduces mechanical loads experienced by the die. The reference thermal solution uses a picture frame gasket of 0.813 mm (0.032 in.) thick Poron* foam. The foam gasket is a two-piece design with diagonal cuts at two corners as shown in Figure 15.
Reference Thermal Solutions R 6.3.6 Clip Retention Anchors For E7500 chipset-based platforms that have very limited board space, a clip retention anchor has been developed to minimize the impact of clip retention on the board. It is based on a standard three-pin jumper and is soldered to the board like any common through-hole header. A new anchor design is available with 45° bent leads to increase the anchor attach reliability over time. See Appendix A for the part number and supplier information. 6.3.
Reference Thermal Solutions R Figure 17. Retention Mechanism Component Keep-out Zones 0.070" Component Keepout 0.896 2x 0.060 0.120 0.345 0.225 0.100" Component Keepout (0.345) 0.170 1.156 See Detail A (0.165) 0.100 Detail A 0.165 0.083 2x 0.038 Plated Through Hole 0.173 0.345 0.200 0.100 Component Keepout 2x 0.056 Trace Keepout 850_Keepout_Zone NOTES: 1. Dimensions are in inches. 2. Not to scale.
Reference Thermal Solutions R 6.4 Reliability Requirements Each motherboard, heatsink and attach combination may vary the mechanical loading of the component. The user should carefully evaluate the reliability of the completed assembly prior to use in high volume. Some general recommendations are shown in Table 2. Table 2.
Appendix A: Thermal Solution Component Suppliers R Appendix A: Thermal Solution Component Suppliers Table 3. Complete Thermal Solution Kits Part Intel Part Number Supplier CCI Pin Fin Heatsink Kit Contact Information Dr. Dah-Chyi (DC) Kuo 886-2-2995-2666, x131 kuo@ccic.com.tw A69225-001 (31gm, 42 x 42 x 23 mm) Foxconn CCI Alternate Pin Fin Heatsink Kit Bob Hall (503) 693-3509, x235 bhall@foxconn.com Dr. Dah-Chyi (DC) Kuo 886-2-2995-2666, x131 kuo@ccic.com.
Appendix A: Thermal Solution Component Suppliers R Table 5. Interface Materials Part Intel Part Number Supplier (Part Number) Contact Information Todd Sousa Thermal Interface (T-710) — Chomerics (69-12-22315-T710) (360) 891-2018 tsousa@parker.com Mechanical Interface (Poron*) Rhoda Kennedy A69141-001 Boyd (503) 972-3170 Table 6. Attach Hardware Part Intel Part Number Supplier Contact Information Dr. Dah-Chyi (DC) Kuo CCI Heatsink Attach Clip 886-2-2995-2666, x131 kuo@ccic.com.
Appendix B: Mechanical Drawings R Appendix B: Mechanical Drawings This appendix contains the following drawings: MCH Heatsink Assembly MCH Heatsink Clip ® Intel E7500 MCH Thermal and Mechanical Design Guidelines 33
Appendix B: Mechanical Drawings R Figure 18.
Appendix B: Mechanical Drawings R Figure 19.
