Datasheet

12 Datasheet
Intel
®
Celeron
®
Processor up to 1.10 GHz
1.1.1 Package Terminology
The following terms are used often in this document and are explained here for clarification:
• Processor substrate—The structure on which passive components (resistors and capacitors)
are mounted.
• Processor core—The processor’s execution engine.
• S.E.P. Package—Single-Edge Processor Package, which consists of a processor substrate,
processor core, and passive components. This package differs from the S.E.C. Cartridge as this
processor has no external plastic cover, thermal plate, or latch arms.
• PPGA package—Plastic Pin Grid Array package. The package is a pinned laminated printed
circuit board structure.
• FC-PGA — Flip-Chip Pin Grid Array. The FC-PGA uses the same 370-pin zero insertion
force socket (PGA370) as the PPGA. Thermal solutions are attached directly to the back of the
processor core package without the use of a thermal plate or heat spreader.
• FC-PGA2 — Flip Chip Pin Grid Array 2. The FC-PG2A uses the same 370-pin zero insertion
force socket (PGA370) as the PPGA. The FC-PGA2 package contains an Integrated Heat
Spreader that covers the processor die.
• Keepout zone - The area on or near a FC-PGA/FC-PGA2 packaged processor that system
designs can not utilize.
• Keep-in zone - The area of a FC-PGA packaged processor that thermal solutions may utilize.
Additional terms referred to in this and other related documentation:
• SC242—242-contact slot connector. A processor in the S.E.P. Package uses this connector to
interface with a system board.
• 370-pin socket (PGA370)—The zero insertion force (ZIF) socket in which a processor in the
PPGA package will use to interface with a system board.
• Retention mechanism—A mechanical assembly which holds the package in the SC242
connector.