Datasheet

Datasheet 95
Intel
®
Celeron
®
Processor up to 1.10 GHz
NOTE: Capacitors will be placed on the pin-side of the FC-PGA2 package in the area defined by G1, G2, and
G3. This area is a keepout zone for motherboard designers.
For Table 52, the following apply:
1. It is not recommended to use any portion of the processor substrate as a mechanical reference
or load bearing surface for thermal solutions.
2. Parameters assume uniformly applied loads.
NOTES:
1. This specification applies to a uniform and a non-uniform load.
2. This is the maximum static force that can be applied by the heatsink and clip to maintain the heatsink and
processor interface.
3. See socket manufacturer’s force loading specification also to ensure compliance. Maximum static loading
listed here does not account for the maximum reaction forces on the socket tabs or pins.
Table 53. Package Dimensions (FC-PGA2 Package)
Symbol
Millimeters Inches
Minimum Maximum Notes Minimum Maximum Notes
A1 2.266 2.690 0.089 0.106
A2 0.980 1.180 0.038 0.047
B1 30.800 31.200 1.212 1.229
B2 30.800 31.200 1.212 1.229
C1 33.000 max 1.299 max
C2 33.000 max 1.299 max
D 49.428 49.632 1.946 1.954
D1 45.466 45.974 1.790 1.810
G1 0.000 17.780 0.000 0.700
G2 0.000 17.780 0.000 0.700
G3 0.000 0.889 0.000 0.035
H 2.540 Nominal 0.100 Nominal
L 3.048 3.302 0.120 0.130
ΦP 0.431 0.483 0.017 0.019
Pin TP 0.508 Diametric True Position (Pin-to-Pin) 0.020 Diametric True Position (Pin-to-Pin)
Table 54. Processor Case Loading Parameters (FC-PGA2 Package)
Parameter Dynamic (max)
1
Static (max)
2,3
Unit
IHS Surface 200 100 lbf
IHS Edge 125 N/A lbf
IHS Corner 75 N/A ibf