Datasheet
Table Of Contents
- Intel® Desktop Boards D915GEV/D915GRF Technical Product Specification
- Revision History / Disclaimer
- Preface
- Contents
- 1 Product Description
- 1.1 PCI Bus Terminology Change
- 1.2 Overview
- 1.3 Online Support
- 1.4 Processor
- 1.5 System Memory
- 1.6 Intel® 915G Chipset
- 1.7 PCI Express Connectors
- 1.8 I/O Controller
- 1.9 Audio Subsystem
- 1.10 LAN Subsystem
- 1.11 Hardware Management Subsystem
- 1.12 Power Management
- 1.12.1 ACPI
- 1.12.2 Hardware Support
- 1.12.2.1 Power Connector
- 1.12.2.2 Fan Connectors
- 1.12.2.3 LAN Wake Capabilities
- 1.12.2.4 Instantly Available PC Technology
- 1.12.2.5 Resume on Ring
- 1.12.2.6 Wake from USB
- 1.12.2.7 Wake from PS/2 Devices
- 1.12.2.8 PME# Signal Wake-up Support
- 1.12.2.9 WAKE# Signal Wake-up Support
- 1.12.2.10 +5 V Standby Power Indicator LED
- 1.13 Trusted Platform Module
- 1.13.1 System Requirements
- 1.13.2 Warning of Potential Data Loss
- 1.13.3 Security Precautions
- 1.13.4 Trusted Platform Module Ownership
- 1.13.5 Enabling the Trusted Platform Module
- 1.13.6 Assuming Trusted Platform Module Ownership
- 1.13.7 Recovery Procedures
- 1.13.8 Clearing Trusted Platform Module Ownership
- 1.13.9 Software Support
- 2 Technical Reference
- 2.1 Introduction
- 2.2 Memory Resources
- 2.3 DMA Channels
- 2.4 Fixed I/O Map
- 2.5 PCI Configuration Space Map
- 2.6 Interrupts
- 2.7 PCI Conventional Interrupt Routing Map
- 2.8 Connectors
- 2.8.1 Back Panel Connectors
- 2.8.2 Component-side Connectors
- 2.9 Jumper Block
- 2.10 Mechanical Considerations
- 2.11 Electrical Considerations
- 2.12 Thermal Considerations
- 2.13 Reliability
- 2.14 Environmental
- 2.15 Regulatory Compliance
- 3 Overview of BIOS Features
- 4 Error Messages and Beep Codes
Product Description
29
1.9 Audio Subsystem
The boards support the Intel High Definition audio subsystem based on the Realtek ALC860
codec. The audio subsystem supports the following features:
• Advanced jack sense (front and rear panel) that enables the audio codec to recognize the
device that is connected to an audio port. All jacks are capable of retasking according to user’s
definition, or can be automatically switched depending on the recognized device type.
• Stereo input and output for all jacks.
• A signal-to-noise (S/N) ratio of 90 dB.
#
INTEGRATOR’S NOTE
For the front panel jack sensing and automatic retasking feature to function, a front panel
daughter card that is designed for Intel High Definition Audio must be used. Otherwise, an AC ’97
style audio front panel connector will be assumed and the Line Out and Mic In functions will be
permanent.
1.9.1 Audio Subsystem Software
Audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio software and drivers Section 1.3, page 17
1.9.2 Audio Connectors
The boards contain audio connector on both the back panel and the component side of the board.
The component-side audio connectors include the following:
• Front panel audio (a 2 x 5-pin connector that provides mic in and line out signals for front
panel audio connectors)
• ATAPI CD-ROM (an optional 1 x 4-pin ATAPI-style connector for connecting an internal
ATAPI CD-ROM drive to the audio mixer)
• S/PDIF (an optional 1 x 3 connector that provides S/PDIF output signals)
The functions of the back panel audio connectors are dependent on which subsystem is present.
For information about Refer to
The location of the front panel audio connector, the optional ATAPI CD-ROM
connector, and the optional S/PDIF connector.
Figure 17, page 62
The signal names of the front panel audio connector Table 20, page 64
The signal names of the optional ATAPI CD-ROM connector Table 19, page 64
The signal names of the optional S/PDIF connector Table 18, page 64