Datasheet
Table Of Contents
- Intel® Desktop Boards D915GEV/D915GRF Technical Product Specification
- Revision History / Disclaimer
- Preface
- Contents
- 1 Product Description
- 1.1 PCI Bus Terminology Change
- 1.2 Overview
- 1.3 Online Support
- 1.4 Processor
- 1.5 System Memory
- 1.6 Intel® 915G Chipset
- 1.7 PCI Express Connectors
- 1.8 I/O Controller
- 1.9 Audio Subsystem
- 1.10 LAN Subsystem
- 1.11 Hardware Management Subsystem
- 1.12 Power Management
- 1.12.1 ACPI
- 1.12.2 Hardware Support
- 1.12.2.1 Power Connector
- 1.12.2.2 Fan Connectors
- 1.12.2.3 LAN Wake Capabilities
- 1.12.2.4 Instantly Available PC Technology
- 1.12.2.5 Resume on Ring
- 1.12.2.6 Wake from USB
- 1.12.2.7 Wake from PS/2 Devices
- 1.12.2.8 PME# Signal Wake-up Support
- 1.12.2.9 WAKE# Signal Wake-up Support
- 1.12.2.10 +5 V Standby Power Indicator LED
- 1.13 Trusted Platform Module
- 1.13.1 System Requirements
- 1.13.2 Warning of Potential Data Loss
- 1.13.3 Security Precautions
- 1.13.4 Trusted Platform Module Ownership
- 1.13.5 Enabling the Trusted Platform Module
- 1.13.6 Assuming Trusted Platform Module Ownership
- 1.13.7 Recovery Procedures
- 1.13.8 Clearing Trusted Platform Module Ownership
- 1.13.9 Software Support
- 2 Technical Reference
- 2.1 Introduction
- 2.2 Memory Resources
- 2.3 DMA Channels
- 2.4 Fixed I/O Map
- 2.5 PCI Configuration Space Map
- 2.6 Interrupts
- 2.7 PCI Conventional Interrupt Routing Map
- 2.8 Connectors
- 2.8.1 Back Panel Connectors
- 2.8.2 Component-side Connectors
- 2.9 Jumper Block
- 2.10 Mechanical Considerations
- 2.11 Electrical Considerations
- 2.12 Thermal Considerations
- 2.13 Reliability
- 2.14 Environmental
- 2.15 Regulatory Compliance
- 3 Overview of BIOS Features
- 4 Error Messages and Beep Codes
Contents
vii
3.6 BIOS Updates ............................................................................................................88
3.6.1 Language Support........................................................................................88
3.6.2 Custom Splash Screen ................................................................................88
3.7 Boot Options ..............................................................................................................89
3.7.1 CD-ROM Boot..............................................................................................89
3.7.2 Network Boot ...............................................................................................89
3.7.3 Booting Without Attached Devices ...............................................................89
3.7.4 Changing the Default Boot Device During POST .........................................89
3.8 Fast Booting Systems with Intel
®
Rapid BIOS Boot....................................................90
3.8.1 Peripheral Selection and Configuration ........................................................90
3.8.2 Intel Rapid BIOS Boot ..................................................................................90
3.9 BIOS Security Features..............................................................................................91
4 Error Messages and Beep Codes
4.1 BIOS Error Messages ................................................................................................93
4.2 Port 80h POST Codes................................................................................................95
4.3 Bus Initialization Checkpoints .....................................................................................99
4.4 Speaker....................................................................................................................100
4.5 BIOS Beep Codes ....................................................................................................100
Figures
1 Board Components ....................................................................................................14
2 Block Diagram............................................................................................................16
3. Memory Channel and DIMM Configuration.................................................................19
4. Dual Channel (Interleaved) Mode Configuration with Two DIMMs..............................20
5. Dual Channel (Interleaved) Mode Configuration with Three DIMMs ...........................20
6. Dual Channel (Interleaved) Mode Configuration with Four DIMMs .............................21
7. Single Channel (Asymmetric) Mode Configuration with One DIMM ............................22
8. Single Channel (Asymmetric) Mode Configuration with Three DIMMs........................22
9. Front/Back Panel Audio Connector Options for High Definition Audio Subsystem......30
10. High Definition Audio Subsystem Block Diagram........................................................30
11. LAN Connector LED Locations...................................................................................31
12. LAN Connector LED Locations...................................................................................32
13. Thermal Monitoring ....................................................................................................35
14. Location of the Standby Power Indicator LED ............................................................42
15. Detailed System Memory Address Map......................................................................52
16. Back Panel Connectors ..............................................................................................60
17. Component-side Connectors......................................................................................62
18. Connection Diagram for Front Panel Connector .........................................................68
19. Connection Diagram for Front Panel USB Connectors ...............................................70
20. Connection Diagram for IEEE 1394a Connectors.......................................................70
21. Location of the Jumper Block .....................................................................................71
22. Board Dimensions ......................................................................................................72
23. I/O Shield Dimensions................................................................................................73
24. Processor Heatsink Airflow.........................................................................................76
25. Localized High Temperature Zones............................................................................77