Datasheet
Table Of Contents
- Intel® Desktop Boards D915GEV/D915GRF Technical Product Specification
- Revision History / Disclaimer
- Preface
- Contents
- 1 Product Description
- 1.1 PCI Bus Terminology Change
- 1.2 Overview
- 1.3 Online Support
- 1.4 Processor
- 1.5 System Memory
- 1.6 Intel® 915G Chipset
- 1.7 PCI Express Connectors
- 1.8 I/O Controller
- 1.9 Audio Subsystem
- 1.10 LAN Subsystem
- 1.11 Hardware Management Subsystem
- 1.12 Power Management
- 1.12.1 ACPI
- 1.12.2 Hardware Support
- 1.12.2.1 Power Connector
- 1.12.2.2 Fan Connectors
- 1.12.2.3 LAN Wake Capabilities
- 1.12.2.4 Instantly Available PC Technology
- 1.12.2.5 Resume on Ring
- 1.12.2.6 Wake from USB
- 1.12.2.7 Wake from PS/2 Devices
- 1.12.2.8 PME# Signal Wake-up Support
- 1.12.2.9 WAKE# Signal Wake-up Support
- 1.12.2.10 +5 V Standby Power Indicator LED
- 1.13 Trusted Platform Module
- 1.13.1 System Requirements
- 1.13.2 Warning of Potential Data Loss
- 1.13.3 Security Precautions
- 1.13.4 Trusted Platform Module Ownership
- 1.13.5 Enabling the Trusted Platform Module
- 1.13.6 Assuming Trusted Platform Module Ownership
- 1.13.7 Recovery Procedures
- 1.13.8 Clearing Trusted Platform Module Ownership
- 1.13.9 Software Support
- 2 Technical Reference
- 2.1 Introduction
- 2.2 Memory Resources
- 2.3 DMA Channels
- 2.4 Fixed I/O Map
- 2.5 PCI Configuration Space Map
- 2.6 Interrupts
- 2.7 PCI Conventional Interrupt Routing Map
- 2.8 Connectors
- 2.8.1 Back Panel Connectors
- 2.8.2 Component-side Connectors
- 2.9 Jumper Block
- 2.10 Mechanical Considerations
- 2.11 Electrical Considerations
- 2.12 Thermal Considerations
- 2.13 Reliability
- 2.14 Environmental
- 2.15 Regulatory Compliance
- 3 Overview of BIOS Features
- 4 Error Messages and Beep Codes
Intel Desktop Board D915GEV/D915GRF Technical Product Specification
76
2.12 Thermal Considerations
CAUTION
A chassis with a maximum internal ambient temperature of 38
o
C at the processor fan inlet is a
requirement. Use a processor heatsink that provides omni-directional airflow (as shown in
Figure 24) to maintain required airflow across the processor voltage regulator area.
O
M16996
Figure 24. Processor Heatsink Airflow
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the processor
and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that
have been tested with Intel desktop boards please refer to the following website:
http://developer.intel.com/design/motherbd/cooling.htm
All responsibility for determining the adequacy of any thermal or system design remains solely
with the reader. Intel makes no warranties or representations that merely following the
instructions presented in this document will result in a system with adequate thermal performance.
CAUTION
Ensure that the ambient temperature does not exceed the board’s maximum operating temperature.
Failure to do so could cause components to exceed their maximum case temperature and
malfunction. For information about the maximum operating temperature, see the environmental
specifications in Section 2.14.