Product Data Sheet / Brochure

Technical Reference
45
Figure 21 shows the height dimensions of the board. Dimensions are in mm.
Figure 21. Board Height Dimensions
4.3 Thermal Considerations
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the processor
and/or voltage regulator or, in some instances, damage to the board.
All responsibility for determining the adequacy of any thermal or system design remains solely
with the system integrator. Intel makes no warranties or representations that merely following the
instructions presented in this document will result in a system with adequate thermal
performance.
CAUTION
Ensure that the ambient temperature does not exceed the board’s maximum operating
temperature. Failure to do so could cause components to exceed their maximum case temperature
and malfunction. For information about the maximum operating temperature, see the
environmental specifications in Section 4.5.
CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do
so may result in shorter than expected product lifetime.