Intel® Celeron® D Processor for Embedded Applications Thermal Design Guide June 2004 Reference Number: 302647-001
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Contents Contents 1.0 Introduction....................................................................................................................................5 1.1 1.2 1.3 1.4 1.5 2.0 Design Guidelines ......................................................................................................................... 9 2.1 3.0 Mechanical Guidelines..........................................................................................................9 2.1.1 Processor Package............
Contents Figures 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 FC-mPGA4 Package Mechanical Drawing (Sheet 1 of 2) .......................................................... 10 FC-mPGA4 Package Mechanical Drawing (Sheet 2 of 2) .......................................................... 11 Motherboard Volumetric Constraint Footprint Definition and Height Restrictions— ATX Form Factor (Sheet 1 of 2) .................................................................................................
Introduction 1.0 Introduction This document describes thermal design guidelines for the Intel® Celeron ® D Processor for Embedded Applications in the Flip-Chip Pin Grid Array (FC-mPGA4) package that interfaces with the motherboard through a mPGA478B socket. Detailed mechanical and thermal specifications for these processors may be found in the processor datasheet.
Introduction 1.3 Document Scope This document discusses the thermal management techniques for the Intel Celeron D Processor, specifically in embedded computing applications. The physical dimensions and power numbers used in this document are for reference only. Refer to the processor’s datasheet for the product dimensions, thermal power dissipation, and maximum case temperature. In case of conflict, the information in the datasheet supercedes any data in this document. 1.4 Table 1.
Introduction Table 2. Definitions of Terms Term Definition T LA (T Local-Ambient) The measured ambient temperature locally surrounding the processor. The ambient temperature shall be measured just upstream of a passive heatsink, or at the fan inlet for an active heatsink. Thermal Design Power (TDP) A design point for the processor. OEMs must design thermal solutions that meet or exceed TDP and T-case specifications as specified by the processor’s datasheet.
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Design Guidelines 2.0 Design Guidelines The thermal solutions presented in this document are designed to fit within the maximum component height allowed by certain embedded form factor specifications, including ATX, 2U, and 1U server form factors. The thermal solutions may be valid for other form factors; however, individual applications must be modeled, prototyped, and verified. In some cases, prototype parts have been fabricated for verification tests.
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Design Guidelines 2.1.2 Motherboard Volumetric Constraint Requirements The volumetric constraint zone reserved for the processor package, heatsink, and heatsink attachment method for the baseboard is shown in Figure 3, Figure 4 and Figure 5. These are the typical volumetric constraint zones for the FC-mPGA4 package and mPGA478B socket in the ATX form factor. Figure 6 and Figure 7 show the primary and secondary side volumetric constraint for the 1U and 2U reference thermal solutions.
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Design Guidelines 2.1.3 Heatsink Attach There are no features on the mPGA478 socket to directly attach a heatsink; a heatsink attach mechanism must be designed to support the heatsink. The attach mechanism has two main roles: • To ensure thermal performance to the TIM applied between the IHS and heatsink. • To ensure system electrical, thermal, and structural integrity under shock and vibration events.
Design Guidelines 2.1.3.2 Heatsink Attach Clip 2.1.3.2.1 Heatsink Attach Clip Usage A heatsink attach clip holds the heatsink in place under dynamic loading and applies force to the heatsink base. It serves to: • Maintain desired pressure on the TIM for thermal performance. • Ensure that the package does not disengage from the socket during mechanical shock and vibration events (also known as package pullout).
Design Guidelines These dimensions are recommended to limit heatsink movement (rocking and sliding) during lateral shock (x and y directions). Requirement 2: Maximum mass and center of gravity (CG) • The maximum combined mass of the heatsink/fan/shroud assembly is 450 grams. • The combined center of gravity of the heatsink/fan/shroud assembly must be no greater than 0.85 inches above the motherboard. Figure 8 shows the heatsink, fan, and shroud assembly volumetric keep-in for the ATX form factor.
Design Guidelines In addition, the thermal solution must apply sufficient pressure on the IHS to: • Maintain desired pressure on the TIM for thermal performance. • Ensure that the package does not disengage from the socket during mechanical shock and vibration events (also known as package pullout). • Protect solder joints from surface mount component damage during mechanical shock events if no other motherboard stiffening device is used.
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Characterizing Cooling Performance Requirements 3.0 Characterizing Cooling Performance Requirements The idea of a “thermal characterization parameter,” Ψ (psi) is a convenient way to characterize the performance needed for the thermal solution and to compare thermal solutions in identical situations (heating source, local ambient conditions).
Characterizing Cooling Performance Requirements Figure 9 illustrates the combination of the different thermal characterization parameters. Figure 9. Processor Thermal Characterization Parameter Relationships TA Ψ SA HEATSINK TS TIM PROCESSOR TC Ψ CA Ψ CS IHS SOCKET 3.
Characterizing Cooling Performance Requirements If the local processor ambient temperature is assumed to be 40° C, the same calculation may be performed to determine the new case-to-ambient thermal resistance: ψ CA = ( TC – T A ) ⁄ TDP = ( 69 – 40 ) ⁄ 89 = 0.326° C ⁄ W It is evident from the above calculations that a reduction in the local processor ambient temperature has a significant positive effect on the case-to-ambient thermal resistance requirement. 3.
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Thermal Design Guidelines 4.0 Thermal Design Guidelines This section presents thermal solution design guidelines for the Intel Celeron D Processor in the 478-pin package in three different form factors: desktop/ATX, 2U, and 1U server. The required performance of the thermal solution is dependent on many parameters, including the processor’s thermal design power (TDP), maximum case temperature (TC max), operating ambient temperature, and system airflow.
Thermal Design Guidelines 4.2 Thermal Specifications To allow for the optimal operation and long-term reliability of Intel processor-based systems, the system/processor thermal solution should be designed such that the processor remains within the minimum and maximum case temperature (TC) specifications when operating at or below the TDP value listed in the Intel Celeron D Processor Datasheet.
Thermal Design Guidelines 4.4 Thermal Solution Requirements The thermal performance required for the heatsink is determined by calculating the case-to-ambient thermal resistance, ΨCA. This is a basic thermal engineering parameter that may be used to evaluate and compare different thermal solutions. For this particular processor an example of how ΨCA is calculated for the Intel Celeron D processor 335 as shown in Equation 3. Equation 3.
Thermal Design Guidelines Figure 11. Thermal Resistance Values for Various Operating Temperatures 4.5 Recommended Thermal Solutions 4.5.1 Desktop/ATX Form Factor The Intel Embedded IA division (EID) is enabling the following active thermal solutions for the Intel Celeron D Processor in the ATX form factor: Table 4. Recommended Thermal Solutions Heatsink Manufacturer Intel Part Number Sanyo-Denki C33218 This is the standard thermal solution enabled by Intel’s Reseller’s Products Group.
Thermal Design Guidelines requires 100 percent of the airflow to be ducted through the fins in order to prevent heatsink bypass. A mechanical drawing of the enabled thermal solution can be seen in Figure 17 of the appendix. The primary and secondary side volumetric constraints for the 1U thermal solution can be seen in Section 2.1.2, “Motherboard Volumetric Constraint Requirements” on page 12.
Thermal Design Guidelines The primary and secondary side volumetric constraints for the 2U thermal solution can be seen in Section 2.1.2, “Motherboard Volumetric Constraint Requirements” on page 12. This thermal solution is attached to the processor package with the use of spring loaded fasteners attached to a backplate on the bottom side of PCB. The entire 2U assembly including backplate, PCB, Processor, heatsink and fasteners can be seen in Figure 13.
Thermal Design Guidelines Figure 14 illustrates an exploded view of the 2U reference thermal solution. Figure 14.
Thermal Design Guidelines 4.6 Interface to Package Requirements The Intel Celeron D Processor is packaged in a Flip-Chip Pin Grid Array (FC-mPGA4) package technology. Refer to the Intel Celeron D Processor Datasheet for detailed mechanical specifications of the 478-pin package. The package includes an integrated heat spreader (IHS). The IHS spreads non-uniform heat from the die to the top of the IHS, out of which the heat flux is more uniform and on a larger surface area.
Thermal Design Guidelines 4.8 Package and Socket Load Specifications Refer to the Intel Celeron D Processor Datasheet for additional information. Table 5. Package Static and Dynamic Load Specifications Parameter Minimum Maximum Notes Static 44 N [20 lbf] 445 N [100 lbf] 1, 2, 3 Dynamic 890 N [200 lbf] 1, 3, 4 Transient 667 N [150 lbf] 1, 3, 5 NOTES: 1. These specifications apply to uniform compressive loading in a direction normal to the processor IHS. 2.
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Thermal Metrology for the Intel® Celeron ® D Processor for Embedded Applications 5.0 Thermal Metrology for the Intel® Celeron ® D Processor for Embedded Applications The thermal metrology for the Intel Celeron D Processor is outlined in the Intel® Pentium® 4 Processor on 90 nm Process Thermal and Mechanical Design Guidelines. Refer to this document when performing validation on thermal solutions for the Intel Celeron D Processor.
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Thermal Test Vehicle Information 6.0 Thermal Test Vehicle Information The Intel Celeron D Processor Thermal Test Vehicle (TTV) is a FC-mPGA4 package assembled with a thermal test die. The cooling capability of a specific system thermal solution may be assessed using the thermal tool in a system environment. The TTV is designed for use in platforms targeted for the Intel Celeron D Processor.
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Thermal Monitor 7.0 Thermal Monitor An on-die thermal management feature called the Intel Thermal Monitor is available on the Intel Celeron D Processor. It provides a thermal management approach to support continued increases in processor frequency and performance. Using a highly accurate on-die temperature sensing circuit and a fast-acting Temperature Control Circuit (TCC), the processor may rapidly initiate thermal management control.
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Vendor Data 8.0 Vendor Data Table 6. Vendor Contact Information Component Supplier Contact Phone email Foxconn Julia Jiang 408-919-6178 juliaj@foxconn.com Tyco/AMP Incorporated Ralph Spayd 717-592-7653 respayd@tycoelectronics.com ATX/Desktop Heat Sinks Sanyo-Denki Haruhiko (Harry) Kawasumi 310-783-5430 haruhiko@sanyo-denki.com 1U and 2U Heatsinks, Reference No. EID-PSC-CUCU-001-1U and EID-PSC-CUAL-001-2U CoolerMaster Wendy Lin 909-673-9880 ext 102 wendy@coolermaster.
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Mechanical Drawings Appendix A Mechanical Drawings Mechanical drawings are found on the following pages.
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