Intel® NUC Board DE3815TYBE Technical Product Specification January 2015 Order Number: H26598-007 The Intel NUC Board DE3815TYBE may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel NUC Board DE3815TYBE Specification Update.
Revision History Revision Revision History Date ® 001 First release of the Intel NUC Board DE3815TYBE Technical Product Specification April 2014 002 Specification Clarification April 2014 003 Specification Clarification June 2014 004 Specification Clarification July 2014 005 Specification Clarification August 2014 006 Specification Clarification August 2014 007 Specification Clarification January 2015 Disclaimer This product specification applies to only the standard Intel® NUC Board
Board Identification Information Basic Intel® NUC Board DE3815TYBE Identification Information AA Revision BIOS Revision Notes H26998-401 TYBYT10H.86A.0019 1,2 Notes: 1. The AA number is found on a small label on the component side of the board. 2.
Intel NUC Board DE3815TYBE Technical Product Specification iv
Preface This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for Intel® NUC Board DE3815TYBE. Intended Audience The TPS is intended to provide detailed, technical information about Intel NUC Board DE3815TYBE and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.
Intel NUC Board DE3815TYBE Technical Product Specification Other Common Notation vi # Used after a signal name to identify an active-low signal (such as USBP0#) GB Gigabyte (1,073,741,824 bytes) GB/s Gigabytes per second Gb/s Gigabits per second KB Kilobyte (1024 bytes) Kb Kilobit (1024 bits) kb/s 1000 bits per second MB Megabyte (1,048,576 bytes) MB/s Megabytes per second Mb Megabit (1,048,576 bits) Mb/s Megabits per second TDP Thermal Design Power xxh An address or data value e
Contents Revision History Disclaimer.................................................................................................. ii Board Identification Information ...................................................................... iii Errata .......................................................................................................iii Preface Intended Audience ....................................................................................... v What This Document Contains........
Intel NUC Board DE3815TYBE Technical Product Specification 2 Technical Reference 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 Memory Resources .............................................................................. 37 2.1.1 Addressable Memory ................................................................ 37 Connectors and Headers ....................................................................... 38 2.2.1 Front Panel Connector .............................................................. 38 2.2.
Contents 5.2 5.1.5 e-Standby and ErP Compliance ................................................... 76 5.1.6 Regulatory Compliance Marks (Board Level) .................................... 77 Battery Disposal Information .................................................................. 78 Figures 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. Major Board Components (Top) ..................................................................................................
Intel NUC Board DE3815TYBE Technical Product Specification 15. 16. 17. 18. 19. 20. 21. 22. 23. 24. 25. 26. 27. 28. 29. 30. 31. 32. 33. 34. 35. 36. 37. 38. 39. 40. x Front Panel Dual-Port USB 2.0 Header........................................................................................... 43 Front Panel Single-Port USB 2.0 Header ....................................................................................... 43 Custom Solutions Header............................................................
1 Product Description 1.1 Overview 1.1.1 Feature Summary Table 1 summarizes the major features of the board. Table 1. Feature Summary Form Factor 4.0 inches by 4.0 inches (101.60 millimeters by 101.
Intel NUC Board DE3815TYBE Technical Product Specification Table 1.
Product Description 1.1.2 Board Layout (Top) Figure 1 shows the location of the major components on the top-side of Intel NUC Board DE3815TYBE. Figure 1.
Intel NUC Board DE3815TYBE Technical Product Specification Table 2 lists the components identified in Figure 1. Table 2. Components Shown in Figure 1 14 Item from Figure 1 Description A Front panel header (2.0 mm pitch) B Serial port header (2.0 mm pitch) C Battery D Thermal solution E Connector for optional processor fan F Power LED G Custom Solutions header (2.0 mm pitch) H VGA header (2.
Product Description 1.1.3 Board Layout (Bottom) Figure 2 shows the location of the major components on the bottom-side of Intel NUC Board DE3815TYBE. Figure 2.
Intel NUC Board DE3815TYBE Technical Product Specification Table 3. Components Shown in Figure 2 16 Item from Figure 2 Description A Back panel connectors B Internal stereo speaker header C PCI Express Half-Mini Card connector D SATA 3.0 Gb/s connector E Illuminated power button F Standby power LED G SATA power connector H Hard Disk Drive (HDD) LED I SATA Disk-on-Module (DOM) voltage selection header J Front panel USB 3.
Product Description 1.1.4 Block Diagram Figure 3 is a block diagram of the major functional areas of the board. Figure 3.
Intel NUC Board DE3815TYBE Technical Product Specification 1.2 Online Support To find information about… Visit this World Wide Web site: Intel NUC Board DE3815TYBE http://www.intel.com/NUC NUC Board Support http://www.intel.com/NUCSupport Available configurations for Intel NUC Board DE3815TYBE http://ark.intel.com BIOS and driver updates http://downloadcenter.intel.com Tested memory http://www.intel.com/NUCSupport Integration information http://www.intel.com/NUCSupport 1.
Product Description 1.4 System Memory The board has one 204-pin SO-DIMM socket and supports the following memory features: • • • • • • • 1.35 V DDR3L 1066 MHz SDRAM SO-DIMM with gold plated contacts One memory channel Unbuffered, single-sided or double-sided SO-DIMMs 8 GB maximum total system memory (with 4 Gb memory technology). Refer to Section 2.1.1 on page 37 for information on the total amount of addressable memory.
Intel NUC Board DE3815TYBE Technical Product Specification Figure 4 illustrates the memory channel and SO-DIMM configuration. Figure 4.
Product Description 1.5 Graphics Subsystem The board supports graphics through Intel Graphics Technology. 1.5.1 Integrated Graphics The board supports integrated graphics through the Intel® Flexible Display Interface (Intel® FDI) for processors with Intel Graphics Technology. NOTE The board can simultaneously support up to two of the three integrated graphics interfaces: VGA, HDMI, and Flat Panel Display. 1.5.1.
Intel NUC Board DE3815TYBE Technical Product Specification 1.5.1.2 Video Memory Allocation Intel® Dynamic Video Memory Technology (DVMT) is a method for dynamically allocating system memory for use as graphics memory to balance 2D/3D graphics and system performance. If your computer is configured to use DVMT, graphics memory is allocated based on system requirements and application demands (up to the configured maximum amount).
Product Description 1.5.1.5 Flat Panel Display Interfaces The board supports flat panel displays via the Embedded DisplayPort interface. Figure 5 shows the flat panel connector. Item Description A Embedded DisplayPort connector B Backlight inverter voltage selection header C Flat panel voltage selection header Figure 5. Flat Panel Connectors NOTE Backlight inverter voltage option “Vin” refers to board input voltage as provided to board power input connector.
Intel NUC Board DE3815TYBE Technical Product Specification 1.5.1.5.1 Embedded DisplayPort* (eDP) Interface The Embedded DisplayPort (eDP) flat panel display interface supports the following: • • • • • • 1920 x 1080 @ 60 Hz resolution 1-lane and 2-lane bandwidth at 1.62 Gb/s or 2.7 Gb/s Multiple EDID data source capability (panel, predefined, and custom payloads) 3.
Product Description 1.6 USB The USB port arrangement is as follows: • • • • • One USB 3.0 front panel connector Two USB 2.0 back panel connectors Two front panel USB 2.0 ports are implemented through a dual-port internal header One front panel USB 2.0 port is implemented through a single-port internal header One port is reserved for the PCI Express* Half-Mini Card All the USB ports are high-speed, full-speed, and low-speed capable.
Intel NUC Board DE3815TYBE Technical Product Specification 1.7.2 AHCI Mode The board supports AHCI storage mode. NOTE In order to use AHCI mode, AHCI must be enabled in the BIOS. Microsoft* Windows 8 includes the necessary AHCI drivers without the need to install separate AHCI drivers during the operating system installation process. However, it is always good practice to update the AHCI drivers to the latest available by Intel. 1.
Product Description Pin Number Pin Name Description 1 Tip Left Audio Out 2 Ring Right Audio Out 3 Ring Common/Ground 4 Sleeve Audio In Figure 6. 4-Pin 3.5 mm (1/8 inch) Audio Jack Pin Out NOTE The analog circuit of the back panel audio connector is designed to power headphones or amplified speakers only. Poor audio quality occurs if passive (nonamplified) speakers are connected to this output. 1.9.
Intel NUC Board DE3815TYBE Technical Product Specification 1.
Product Description 1.10.3 RJ-45 LAN Connector with Integrated LEDs Two LEDs are built into the RJ-45 LAN connector (shown in Figure 7). Item Description A Link LED (Green) B Data Rate LED (Green/Yellow) Figure 7. LAN Connector LED Locations Table 6 describes the LED states when the board is powered up and the LAN subsystem is operating. Table 6. LAN Connector LED States LED LED Color Link (A) Data Rate (B) 1.11 Green Green/Yellow LED State Condition Off LAN link is not established.
Intel NUC Board DE3815TYBE Technical Product Specification 1.11.1 Hardware Monitoring The hardware monitoring and fan control subsystem is based on an ITE IT8607E embedded controller, which supports the following: • • • • 1.11.2 Processor and system ambient temperature monitoring Optional processor fan speed monitoring Voltage monitoring of +5 V, +3.3 V, Memory Vcc (SDRAM) SMBus interface Fan Monitoring Fan monitoring can be implemented using third-party software. 1.11.
Product Description 1.12 Power Management Power management is implemented at several levels, including: • • 1.12.1 Software support through Advanced Configuration and Power Interface (ACPI) Hardware support: Power Input Instantly Available PC technology LAN wake capabilities Wake from USB WAKE# signal wake-up support Wake from S5 +5 V Standby Power Indicator LED ACPI ACPI gives the operating system direct control over the power management and Plug and Play functions of a computer.
Intel NUC Board DE3815TYBE Technical Product Specification 1.12.1.1 System States and Power States Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off.
Product Description 1.12.1.2 Wake-up Devices and Events Table 9 lists the devices or specific events that can wake the computer from specific states. Table 9. Wake-up Devices and Events Devices/events that wake up the system… …from this sleep state Power switch S3, S4, S5 RTC alarm S3, S4, S5 (Note 1) LAN S3, S4, S5 (Notes 1, 2) USB S3, S4, S5 (Note 3, 4) PCIe via WAKE# S3, S4, S5 (Note 1) Notes: 1. Monitor will remain in “sleep” state 2.
Intel NUC Board DE3815TYBE Technical Product Specification 1.12.2.1 Power Input When resuming from an AC power failure, the computer may return to the power state it was in before power was interrupted (on or off). The computer’s response can be set using the Last Power State feature in the BIOS Setup program’s Boot menu. 1.12.2.2 Instantly Available PC Technology Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-to-RAM) sleep-state.
Product Description 1.12.2.7 +5 V Standby Power Indicator LED The standby power indicator LED shows that power is still present even when the computer appears to be off. Figure 9 shows the location of the standby power LED. CAUTION If AC power has been switched off and the standby power indicator is still lit, disconnect the power cord before installing or removing any devices connected to the board. Failure to do so could damage the board and any attached devices. Figure 9.
Intel NUC Board DE3815TYBE Technical Product Specification Intel® Security and Manageability Technologies 1.13 Intel® Security and Manageability Technologies provides tools and resources to help small business owners and IT organizations protect and manage their assets in a business or institutional environment. NOTE Software with security and/or manageability capability is required to take advantage of Intel platform security and/or management technologies. Intel® Virtualization Technology 1.13.1.
2 Technical Reference 2.1 Memory Resources 2.1.1 Addressable Memory The board utilizes up to 8 GB of addressable system memory. Typically the address space that is allocated for PCI Conventional bus add-in cards, PCI Express configuration space, BIOS (SPI Flash device), and chipset overhead resides above the top of DRAM (total system memory).
Intel NUC Board DE3815TYBE Technical Product Specification 2.2 Connectors and Headers CAUTION Only the following connectors and headers have overcurrent protection: back panel and front panel USB. This section describes the board’s connectors and headers. The connectors and headers can be divided into these groups: • • 2.2.1 Front panel I/O connector Back panel I/O connectors Front Panel Connector Figure 10 shows the location of the front panel connector for the board. Item Description A USB 3.
Technical Reference 2.2.3 Headers (Top) Figure 12 shows the location of the headers on the top-side of the board. Figure 12. Header (Top) Table 10 lists the header identified in Figure 12. Table 10. Header Shown in Figure 12 Item from Figure 13 Description A Front panel header (2.0 mm pitch) B Serial port header (2.0 mm pitch) C Connector for optional processor fan D Custom Solutions header (2.0 mm pitch) E VGA header (2.
Intel NUC Board DE3815TYBE Technical Product Specification 2.2.4 Connectors and Headers (Bottom) Figure 13 shows the locations of the connectors and headers on the bottom-side of the board. Figure 13.
Technical Reference Table 11 lists the connectors and headers identified in Figure 13. Table 11. Connectors and Headers Shown in Figure 13 Item from Figure 13 Description A Internal stereo speaker header B PCI Express Half-Mini Card connector C SATA 3.0 Gb/s connector D SATA power connector E SATA DOM voltage selection header F Front panel single-port USB 2.0 header G Front panel dual-port USB 2.
Intel NUC Board DE3815TYBE Technical Product Specification 2.2.4.1 Signal Tables for the Connectors and Headers Table 12. PCI Express Half-Mini Card Connector Pin Signal Name Pin Signal Name 1 WAKE# 2 3.3 V 3 Reserved 4 GND 5 Reserved 6 1.5 V 7 CLKREQ# 8 Reserved 9 GND 10 Reserved 11 REFCLK- 12 Reserved 13 REFCLK+ 14 Reserved 15 GND 16 Reserved 17 Reserved 18 GND 19 Reserved 20 Reserved 21 GND 22 PERST# 23 PERn0 24 +3.
Technical Reference Table 14. Serial Port Header Pin Signal Name Pin Signal Name 1 SIO_UART1_RXD 2 SIO_UART2_RXD 3 SIO_UART1_TXD 4 SIO_UART2_TXD 5 GND 6 Key (no pin) 7 SIO_UART1_RTS# 8 SIO_UART2_RTS# 9 SIO_UART1_CTS# 10 SIO_UART2_CTS# Table 15. Front Panel Dual-Port USB 2.0 Header Pin Signal Name Pin Signal Name 1 +5 V DC 2 +5 V DC 3 D- 4 D- 5 D+ 6 D+ 7 Ground 8 Ground 9 KEY (no pin) 10 No Connect Table 16. Front Panel Single-Port USB 2.
Intel NUC Board DE3815TYBE Technical Product Specification Table 18. VGA Header Pin Signal Name Pin Signal Name 1 CLK 2 DATA 3 VCC 4 VSYNC 5 HSYNC 6 GND 7 RED 8 GND 9 GREEN 10 GND 11 BLUE 12 KEY Table 19. SATA Connector Pin Signal Name 1 Ground 2 TXP 3 TXN 4 Ground 5 RXN 6 RXP 7 Ground Table 20. SATA Power Connector Pin Signal Name 1 5 V DC 2 5 V DC 3 3.3 V DC 4 Ground Table 21.
Technical Reference Table 22. Backlight Inverter Voltage Selection Header Pin Signal Name Description 1 5 V ±5% (2.0A) 5 V option 2 BKLT_PWR Send voltage to connector 3 (Vin) 12 V ±5% (2.0A) Board input voltage option (default) Table 23.
Intel NUC Board DE3815TYBE Technical Product Specification 2.2.4.2 Add-in Card Connector The board has one PCI Express Half-Mini Card Connector. It will not support mSATA. 2.2.4.3 Front Panel USB Connector and Headers Figure 14 and Figure 15 are connection diagrams for the front panel USB connector and headers. NOTE • • The +5 V DC power on the USB headers is fused. Use only a front panel USB connector that conforms to the USB 2.0 specification for highspeed USB devices. Figure 14.
Technical Reference 2.2.4.4 Power Supply Connectors The board has the following power supply connectors: • • External Power Supply – the board can be powered through a 12 V DC connector on the back panel. The back panel DC connector is compatible with a 5.5 mm/OD (outer diameter) and 2.5 mm/ID (inner diameter) plug, where the inner contact is +12 (±10%) V DC through +19 (±10%) V DC and the shell is GND. The maximum current rating is 3 A.
Intel NUC Board DE3815TYBE Technical Product Specification 2.2.4.5 Front Panel Header This section describes the functions of the front panel header. Table 25 lists the signal names of the front panel header. Figure 17 is a connection diagram for the front panel header. Table 25.
Technical Reference 2.2.4.6 Internal Stereo Speaker Header (2.00 mm pitch) The internal stereo speaker header allows connection to an internal, low-power speaker for basic system sound capability. The subsystem is capable of driving a speaker load of 8 Ohms at 1 W (rms) or 4 Ohms at 1.5 W (rms). The following parts are listed for reference: • • 1x4, 2.00 mm pitch internal stereo speakers header (JS*-1125-04, or equivalent) Mating plug (JWT* A2001H02-4P, or equivalent) Figure 18.
Intel NUC Board DE3815TYBE Technical Product Specification 2.2.4.7 Custom Solutions Header (2.0 mm Pitch) The Customs Solution header is designed to expose access to platform-level signals, enabling custom development of solutions based on such signals. • • • • • • • 50 1.8 Vstby, 3.3 Vstby and 5 Vstby: can be used to power custom solution (such as daughtercard, etc.) with up to 2 A of current rating capability per each of these voltages. Pins can also be used to monitor the presence of 1.8 V, 3.
Technical Reference Figure 19.
Intel NUC Board DE3815TYBE Technical Product Specification 2.3 BIOS Security Jumper CAUTION Do not move a jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged. Figure 20 shows the location of the BIOS security jumper. The 3-pin jumper determines the BIOS Security program’s mode. Table 26 describes the BIOS security jumper settings for the three modes: normal, lockdown, and configuration.
Technical Reference Table 26. BIOS Security Jumper Settings Function/Mode Jumper Setting Configuration Normal 1-2 The BIOS uses current configuration information and passwords for booting. Lockdown 2-3 The BIOS uses current configuration information and passwords for booting, except: • All POST Hotkeys are suppressed (prompts are not displayed and keys are not accepted. For example, F2 for Setup, F10 for the Boot Menu). • Power Button Menu is not available (see Section 3.7.4 Power Button Menu).
Intel NUC Board DE3815TYBE Technical Product Specification 2.4 Mechanical Considerations 2.4.1 Form Factor The board is designed to fit into a custom chassis. Figure 21 illustrates the mechanical form factor for the board. Dimensions are given in millimeters. The outer dimensions are 101.60 millimeters by 101.60 millimeters [4.0 inches by 4.0 inches]. Figure 21.
Technical Reference Figure 22 shows the height dimensions of the board. Figure 22. Board Height Dimensions 2.5 Electrical Considerations 2.5.1 Power Supply Considerations System power requirements will depend on actual system configurations chosen by the integrator, as well as end user expansion preferences. It is the system integrator’s responsibility to ensure an appropriate power budget for the system configuration is properly assessed based on the system-level components chosen. Table 27.
Intel NUC Board DE3815TYBE Technical Product Specification 2.5.2 Fan Header Current Capability Table 28 lists the current capability of the fan header. Table 28. Fan Header Current Capability 2.6 Fan Header Maximum Available Current Processor fan .25 A Thermal Considerations CAUTION Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board.
Technical Reference Figure 23 shows the locations of the localized high temperature zones. Item Description A B Processor voltage regulator area Thermal solution Figure 23.
Intel NUC Board DE3815TYBE Technical Product Specification Table 29 provides maximum case temperatures for the components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 29.
Technical Reference 2.7 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Telcordia SR-332-2 Issue 2, Method I, Case 3, 55 ºC ambient. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF for the board is 68,690 hours. 2.8 Environmental Table 31 lists the environmental specifications for the board. Table 31.
Intel NUC Board DE3815TYBE Technical Product Specification 60
3 Overview of BIOS Features 3.1 Introduction The board uses an Intel Visual BIOS that is stored in the Serial Peripheral Interface Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the Visual BIOS Setup program, POST, the PCI auto-configuration utility, LAN EEPROM information, and Plug and Play support. The initial production BIOSs are identified as TYBYT10H.86A.
Intel NUC Board DE3815TYBE Technical Product Specification can obtain the SMBIOS information. Additional board information can be found in the BIOS under the Additional Information header under the Main BIOS page. 3.4 Legacy USB Support Legacy USB support enables USB devices to be used even when the operating system’s USB drivers are not yet available. Legacy USB support is used to access the BIOS Setup program, and to install an operating system that supports USB.
Overview of BIOS Features • • Intel F7 switch during POST allows a user to select where the BIOS .bio file is located and perform the update from that location/device. Similar to performing a BIOS Recovery without removing the BIOS configuration jumper. Intel Visual BIOS allows the user to select the BIOS .bio file from the internet, USB device, hard disk drive, or other media. All utilities verify that the updated BIOS matches the target system to prevent accidentally installing an incompatible BIOS.
Intel NUC Board DE3815TYBE Technical Product Specification 3.6 BIOS Recovery It is unlikely that anything will interrupt a BIOS update; however, if an interruption occurs, the BIOS could be damaged. Table 32 lists the drives and media types that can and cannot be used for BIOS recovery. The BIOS recovery media does not need to be made bootable. Table 32.
Overview of BIOS Features 3.7 Boot Options In the BIOS Setup program, the user can choose to boot from a hard drive, removable drive, or the network. The default setting is for the hard drive to be the first boot device, the removable drive second, and the network third. 3.7.1 Network Boot The network can be selected as a boot device. This selection allows booting from the onboard LAN or a network add-in card with a remote boot ROM installed.
Intel NUC Board DE3815TYBE Technical Product Specification 3.7.4 Power Button Menu The Power Button Menu is accessible via the following sequence: 1. System is in S4/S5 (not G3) 2. User pushes the power button and holds it down 3. The system will emit three short beeps from the PC speaker, if equipped, then stop to signal the user to release the power button (approximately 3 seconds) 4.
Overview of BIOS Features 3.8 Hard Disk Drive Password Security Feature The Hard Disk Drive Password Security feature blocks read and write accesses to the hard disk drive until the correct password is given. Hard Disk Drive Passwords are set in BIOS SETUP and are prompted for during BIOS POST. For convenient support of S3 resume, the system BIOS will automatically unlock drives on resume from S3. Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to 16 characters in length.
Intel NUC Board DE3815TYBE Technical Product Specification 3.9 BIOS Security Features The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer, with the following restrictions: • • • • • • • • The supervisor password gives unrestricted access to view and change all the Setup options in the BIOS Setup program. This is the supervisor mode.
4 Error Messages and Blink Codes 4.1 Front-panel Power LED Blink Codes Whenever a recoverable error occurs during POST, the BIOS causes the board’s front panel power LED to blink an error message describing the problem (see Table 36). Table 36. Front-panel Power LED Blink Codes Type Pattern BIOS update in progress Off when the update begins, then on for 0.5 seconds, then off for 0.5 seconds. The pattern repeats until the BIOS update is complete. Note Video error (Note) On-off (1.
Intel NUC Board DE3815TYBE Technical Product Specification 70
5 Regulatory Compliance and Battery Disposal Information 5.1 Regulatory Compliance This section contains the following regulatory compliance information for Intel NUC Board DE3815TYBE: • • • • • Safety standards European Union Declaration of Conformity statement Product Ecology statements Electromagnetic Compatibility (EMC) standards Product certification markings 5.1.
Intel NUC Board DE3815TYBE Technical Product Specification 5.1.2 European Union Declaration of Conformity Statement We, Intel Corporation, declare under our sole responsibility that the products Intel® NUC Board DE3815TYBE is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European Council Directive 2004/108/EC (EMC Directive), 2006/95/EC (Low Voltage Directive), and 2002/95/EC (ROHS Directive).
Regulatory Compliance and Battery Disposal Information Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC, 2006/95/EC & 2002/95/EC. Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív 2004/108/EC, 2006/95/EC a 2002/95/EC. Slovenščina Izdelek je skladen z določbami evropskih direktiv 2004/108/EC, 2006/95/EC in 2002/95/EC. Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC, 2006/95/EC & 2002/95/EC.
Intel NUC Board DE3815TYBE Technical Product Specification FCC Declaration of Conformity This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. For questions related to the EMC performance of this product, contact: Intel Corporation, 5200 N.E.
Regulatory Compliance and Battery Disposal Information Japan VCCI Statement Japan VCCI Statement translation: This is a Class B product based on the standard of the Voluntary Control Council for Interference from Information Technology Equipment (VCCI). If this is used near a radio or television receiver in a domestic environment, it may cause radio interference. Install and use the equipment according to the instruction manual.
Intel NUC Board DE3815TYBE Technical Product Specification 5.1.5 e-Standby and ErP Compliance Intel NUC Board DE3815TYBE meets the following program requirements in an adequate system configuration, including appropriate selection of an efficient power supply: • • • EPEAT* Korea e-Standby European Union Energy-related Products Directive 2013 (ErP) Lot 6 For information about 76 Refer to Electronic Product Environmental Assessment Tool (EPEAT) http://www.epeat.
Regulatory Compliance and Battery Disposal Information 5.1.6 Regulatory Compliance Marks (Board Level) Intel NUC Board DE3815TYBE has the regulatory compliance marks shown in Table 40. Table 40. Regulatory Compliance Marks Description Mark UL joint US/Canada Recognized Component mark. Includes adjacent UL file number for Intel NUC Boards: E210882. FCC Declaration of Conformity logo mark for Class B equipment. CE mark.
Intel NUC Board DE3815TYBE Technical Product Specification 5.2 Battery Disposal Information CAUTION Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations. PRÉCAUTION Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les piles usagées doivent être recyclées dans la mesure du possible.
Regulatory Compliance and Battery Disposal Information PRECAUCIÓN Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante. WAARSCHUWING Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type batterij. Batterijen moeten zoveel mogelijk worden gerecycled.
Intel NUC Board DE3815TYBE Technical Product Specification AWAS Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan. OSTRZEŻENIE Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi przepisami ochrony środowiska.
Regulatory Compliance and Battery Disposal Information 81
Intel NUC Board DE3815TYBE Technical Product Specification 82