D955XBK

Manufacturer: Intel Corporation Date: 27 June 2005
Equipment type: desktop motherboard (cpu board) Lead-free product: Yes, containing (2) SLI chipsets
Model designation: D955XBK Product weight: 798.2 grams
RoHS Definitions
*
*
Quantity limit of 0.01% by mass (100 PPM) for Cadmium.
RoHS Declaration
This product does not contain RoHS restricted substances per the RoHS definitions above. This product is RoHS directive compliant.
Other:
LEVEL A MATERIALS AND SUBSTANCES
Asbestos Mercury/Mercury Compounds Polychlorinated Naphthalenes
Azo colorants Ozone Depleting Substances Radioactive Substances
Cadmium /Cadmium Compounds Polybrominated Biphenyls (PBBs) Shortchain Chlorinated Paraffins
Hexavalent Chromium Polybrominated Diphenylethers (PBDEs) Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Hexavalent Chromium Compounds Polychlorinated Biphenyls (PCBs) Tributyl Tin Oxide (TBTO)
This product contains lead or lead compounds above the threshold limit of 1000ppm - No
LEVEL B MATERIALS AND SUBSTANCES
Antimony/Antimony Compounds Beryllium/Beryllium Compounds Brominated Flame Retardants
Arsenic/Arsenic Compounds Bismuth/Bismuth Compounds Nickel/Nickel Compounds
COMMENTS
1 The data reported for Level A and B materials and/or substances are determined through analytical testing of a representative sample of the product.
2
3 This material declaration datasheet is product specific. Like product variants or alternate skus are assumed to be same or similar.
4 Material mass can be estimated by multiplying concentration (in ppm) by product weight.
5 The remainder of this product consists of non-reportable metals (e.g., tin, iron), epoxy resin and other non-metal materials.
This product does contain RoHS restricted substance(s) above the threshold level. Exemption status is not applicable. This part is not RoHS
directive compliant.
INTEL ACCEPTS NO DUTY TO UPDATE THIS MDDS OR TO NOTIFY USERS OF THIS MDDS OF UPDATES OR CHANGES TO THIS MDDS.
INTEL SHALL NOT BE LIABLE FOR ANY DAMAGES, DIRECT OR INDIRECT, CONSEQUENTIAL OR OTHERWISE, SUFFERED BY USERS OR
THIRD PARTIES AS A RESULT OF THE USERS RELIANCE ON INFORMATION IN THIS MDDS THAT HAS BEEN UPDATED OR CHANGED.
Individual test results may vary due to differences in production and /or sensitivities of analytical testing methods. Data shown reflect analytical testing
intended to validate Intel's RoHS compliance systems. Additionally, RoHS compliance at the homogenous material level is based on Supplier's
Declarations of Conformance.
brominated flame retardant
(TBBPA)
flame retardant board 43,900 ppm
5,950 ppm
antimony
flame retardant
Location in Product
Description of Use Location in Product
Materials from Annex A of the EIA/EICTA/JGPSSI Material Composition Declaration Guide and listed in the table below are not contained in this
product in quantities above the threshold level for these materials as stated in the EIA/EICTA/JGPSSI Material Composition Declaration Guide, nor
intentionally added to this product.
If this product contains materials listed in Annex B of the EIA/EICTA/JGPSSI Material Composition Declaration Guide above the threshold level of 1000
ppm, those materials/substances are listed below.
--- ---
board
This product does contain RoHS restricted substance(s) per the definitions above, but has exemption status. This product is RoHS directive
compliant by the following exemption: Lead in solders to complete a viable electrical connection between semiconductor die and carrier within
integrated circuit Flip Chip packages.
Restriction on Hazardous Substances (RoHS) Compliance
Material Concentration
Intel understands RoHS requires Lead and other materials banned in RoHS Directive are either (1) below all applicable substance thresholds as
proposed by the EU, or (2) an approved/pending exemption applies. Note, RoHS implementation details are subject to change.
Where the product is declared compliant with RoHS directive requirements, the product has been verified to be in conformance with EU directive
2002/95/EC, as currently understood. To the best of our knowledge, the information contained in this declaration is true and correct.
Material Concentration
Description of Use
plating component plating 2,140 ppm
Material Declaration Datasheet
Quantity limit of 0.1% by mass (1000 PPM) for; Lead (Pb); Mercury; Hexavalent Chromium; Polybrominated Biphenyls (PBB); Polybrominated
Diphenyl Ethers (PBDE).
Material / Substance
---
---
nickel
Material / Substance