Intel® Desktop Board DH55TC Technical Product Specification January 2010 Order Number: E81940-001US The Intel® Desktop Board DH55TC may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board DH55TC Specification Update.
Revision History Revision -001 Revision History Date ® First release of the Intel Desktop Board DH55TC Technical Product Specification January 2010 This product specification applies to only the standard Intel® Desktop Board DH55TC with BIOS identifier TCIBX10H.86A. Changes to this specification will be published in the Intel Desktop Board DH55TC Specification Update before being incorporated into a revision of this document. INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS.
Preface This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for the Intel® Desktop Board DH55TC. Intended Audience The TPS is intended to provide detailed, technical information about the Intel Desktop Board DH55TC and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.
Intel Desktop Board DH55TC Technical Product Specification Other Common Notation iv # Used after a signal name to identify an active-low signal (such as USBP0#) GB Gigabyte (1,073,741,824 bytes) GB/s Gigabytes per second Gb/s Gigabits per second KB Kilobyte (1024 bytes) Kbit Kilobit (1024 bits) kbits/s 1000 bits per second MB Megabyte (1,048,576 bytes) MB/s Megabytes per second Mbit Megabit (1,048,576 bits) Mbits/s Megabits per second xxh An address or data value ending with a lowe
Contents 1 Product Description 1.1 Overview.......................................................................................... 9 1.1.1 Feature Summary .................................................................. 9 1.1.2 Board Layout ....................................................................... 11 1.1.3 Block Diagram ..................................................................... 13 1.2 Legacy Considerations......................................................................
Intel Desktop Board DH55TC Technical Product Specification 2.3 Jumper Block .................................................................................. 49 2.4 Mechanical Considerations ................................................................ 51 2.4.1 Form Factor......................................................................... 51 2.5 Electrical Considerations ................................................................... 52 2.5.1 Power Supply Considerations ......................
Contents Figures 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. Major Board Components.................................................................. 11 Block Diagram ................................................................................ 13 Memory Channel and DIMM Configuration ........................................... 17 Back Panel Audio Connector Options .................................................. 22 LAN Connector LED Locations ..........................................................
Intel Desktop Board DH55TC Technical Product Specification 26. 27. 28. 29. 30. 31. 32. 33. 34. 35. 36. 37. 38. 39. 40. 41. 42. 43. 44. 45. 46. viii BIOS Setup Configuration Jumper Settings.......................................... Minimum Recommended Power Supply Current Values.......................... Fan Header Current Capability........................................................... Thermal Considerations for Components .............................................
1 Product Description 1.1 Overview 1.1.1 Feature Summary Table 1 summarizes the major features of the board. Table 1. Feature Summary Form Factor MicroATX (9.60 inches by 9.60 inches [243.84 millimeters by 243.
Intel Desktop Board DH55TC Technical Product Specification Table 1. Feature Summary (continued) Instantly Available PC Technology • Support for PCI* Local Bus Specification Revision 2.3 • Support for PCI Express* • Suspend to RAM support • Wake on PCI, PCI Express, LAN, front panel, PS/2, serial and USB ports LAN Support Gigabit (10/100/1000 Mbits/s) LAN subsystem using the Intel® 82578DC Gigabit Ethernet Controller Expansion Capabilities • One PCI Express 2.
Product Description 1.1.2 Board Layout Figure 1 shows the location of the major components on Intel Desktop Board DH55TC. Figure 1. Major Board Components Table 2 lists the components identified in Figure 1.
Intel Desktop Board DH55TC Technical Product Specification Table 2.
Product Description 1.1.3 Block Diagram Figure 2 is a block diagram of the major functional areas of the board. Figure 2.
Intel Desktop Board DH55TC Technical Product Specification 1.2 Legacy Considerations This board differs from other Intel Desktop Board products, with specific changes including (but not limited to) the following: • • 1.3 No floppy drive connector No Parallel ATA (PATA) IDE drive connector Online Support To find information about… Visit this World Wide Web site: Intel Desktop Board DH55TC http://www.intel.com/products/motherboard/DH55TC/index.htm Desktop Board Support http://www.intel.
Product Description Intel® H55 Express Chipset 1.5 The Intel H55 Express Chipset consisting of the Intel H55 Platform Controller Hub (PCH) provides interfaces to the processor and the USB, SATA, LPC, audio, network, display, Conventional PCI, and PCI Express x1 interfaces. The PCH is a centralized controller for the board’s I/O paths. For information about Refer to The Intel H55 Express Chipset http://www.intel.com/products/desktop/chipsets/index.htm Resources used by the chipset Chapter 2 1.
Intel Desktop Board DH55TC Technical Product Specification For information about… Refer to: Tested Memory http://www.intel.com/support/motherboards/desktop/sb/CS025414.htm 1.6.1 Memory Configurations The Intel Core i7, Intel Core i5, Intel Core i3, and Intel Pentium processors support the following types of memory organization: • • 16 Dual channel (Interleaved) mode. This mode offers the highest throughput for real world applications.
Product Description Figure 3 illustrates the memory channel and DIMM configuration. Figure 3. Memory Channel and DIMM Configuration NOTE When using a processor without Intel Graphics Technology: there must always be memory installed into any or both of the DIMM 0 (blue) memory slots for the system to boot.
Intel Desktop Board DH55TC Technical Product Specification 1.7 Graphics Subsystem The board supports system graphics through either Intel Graphics Technology or a PCI Express 2.0 x16 add-in graphics card. 1.7.1 Integrated Graphics The board supports integrated graphics through the Intel® Flexible Display Interface (FDI) for processors with Intel Graphics Technology.
Product Description 1.7.1.3 Digital Visual Interface (DVI-D) The DVI-D port supports digital DVI displays. The maximum supported resolution is 1920 x 1200 at 60 Hz refresh (WUXGA). The DVI-D port is compliant with the DVI 1.0 specification. The DVI-D port is only enabled for POST when there are no monitors attached to the VGA or HDMI connectors. 1.7.
Intel Desktop Board DH55TC Technical Product Specification 1.9 SATA Interfaces The board provides six internal SATA connectors through the PCH, four for internal storage (black connectors) and two for internal as well as external SATA/eSATA connectivity (red connectors). The PCH provides independent SATA ports with a theoretical maximum transfer rate of 3 Gb/s per port. A point-to-point interface is used for host to device connections.
Product Description 1.10.2 Parallel Port The parallel port is implemented as a 26-pin header on the board. Use the BIOS Setup program to set the parallel port mode. For information about Refer to The location of the parallel port header Figure 10, page 39 1.11 Audio Subsystem The board supports Intel High Definition Audio via the HDMI interface as well as via the Realtek ALC888S audio codec.
Intel Desktop Board DH55TC Technical Product Specification 1.11.2.1 Analog Audio Connectivity The available configurable back panel audio connectors are shown in Figure 4. Item Description A Audio line in B Audio line out C Mic in Figure 4. Back Panel Audio Connector Options The back panel audio connectors are configurable through the audio device drivers. For information about Refer to The back panel audio connectors Section 2.2.
Product Description 1.12 LAN Subsystem The LAN subsystem consists of the following: • • Intel 82578DC Gigabit Ethernet Controller (10/100/1000 Mbits/s) RJ-45 LAN connector with integrated status LEDs For information about Refer to LAN software and drivers http://downloadcenter.intel.com 1.12.1 Intel® 82578DC Gigabit Ethernet Controller The Intel 82578DC Gigabit Ethernet Controller supports the following features: • • • • • • • • 10/100/1000 BASE-T IEEE 802.
Intel Desktop Board DH55TC Technical Product Specification 1.12.3 RJ-45 LAN Connector with Integrated LEDs Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5). Item Description A Link/Activity LED (green) B Link Speed LED (green/yellow) Figure 5. LAN Connector LED Locations Table 4 describes the LED states when the board is powered up and the LAN subsystem is operating. Table 4.
Product Description 1.13 Real-Time Clock Subsystem A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC with power applied via the power supply 5V STBY rail.
Intel Desktop Board DH55TC Technical Product Specification 1.14.3 Thermal Monitoring Figure 6 shows the locations of the thermal sensors and fan headers. Item Description A Rear chassis fan header B Thermal diode, located on processor die C Processor fan header D Front chassis fan header Figure 6.
Product Description 1.15 Power Management Power management is implemented at several levels, including: • • Software support through Advanced Configuration and Power Interface (ACPI) Hardware support: ⎯ Power connector ⎯ Fan headers ⎯ LAN wake capabilities ⎯ Instantly Available PC technology ⎯ Wake from USB ⎯ Power Management Event signal (PME#) wake-up support ⎯ PCI Express WAKE# signal support ⎯ Wake from PS/2 devices ⎯ Wake from serial port 1.15.
Intel Desktop Board DH55TC Technical Product Specification 1.15.1.1 System States and Power States Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off.
Product Description 1.15.1.2 Wake-up Devices and Events Table 7 lists the devices or specific events that can wake the computer from specific states. Table 7. Wake-up Devices and Events These devices/events can wake up the computer… …from this state Power switch S1, S3, S4, S5 RTC alarm S1, S3, S4, S5 LAN S1, S3, S4, S5 USB S1, S3 PME# signal S1, S3, S4, S5 WAKE# signal S1, S3, S4, S5 PS/2 S1, S3, S4, S5 Serial S1, S3 Notes: • S4 implies operating system support only.
Intel Desktop Board DH55TC Technical Product Specification 1.15.2 Hardware Support CAUTION Ensure that the power supply provides adequate +5 V standby current if LAN wake capabilities and Instantly Available PC technology features are used. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options.
Product Description 1.15.2.
Intel Desktop Board DH55TC Technical Product Specification 1.15.2.4 Instantly Available PC Technology CAUTION For Instantly Available PC technology, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing Instantly Available PC technology can damage the power supply. Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-toRAM) sleep-state.
Product Description 1.15.2.9 Wake from Serial Port Serial port activity wakes the computer from an ACPI S1 or S3 state. 1.15.2.10 +5 V Standby Power Indicator LED The +5 V standby power indicator LED shows that power is still present even when the computer appears to be off. Figure 7 shows the location of the standby power indicator LED on the board. Figure 7.
Intel Desktop Board DH55TC Technical Product Specification 1.15.3 ENERGY STAR* 5.0, e-Standby, and ErP Compliance The US Department of Energy and the US Environmental Protection Agency have continually revised the ENERGY STAR requirements. Intel has worked directly with these two governmental agencies in the definition of new requirements.
2 Technical Reference 2.1 Memory Resources 2.1.1 Addressable Memory The board utilizes 16 GB of addressable system memory. Typically the address space that is allocated for PCI Conventional bus add-in cards, PCI Express configuration space, BIOS (SPI Flash device), and chipset overhead resides above the top of DRAM (total system memory).
Intel Desktop Board DH55TC Technical Product Specification Figure 8.
Technical Reference 2.1.2 Memory Map Table 8 lists the system memory map. Table 8. System Memory Map Address Range (decimal) Address Range (hex) Size Description 1024 K - 16777216 K 100000 - 3FFFFFFFF 16382 MB Extended memory 960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS 896 K - 960 K E0000 - EFFFF 64 KB Reserved 800 K - 896 K C8000 - DFFFF 96 KB Potential available high DOS memory (open to the PCI Conventional bus). Dependent on video adapter used.
Intel Desktop Board DH55TC Technical Product Specification 2.2.1 Back Panel Connectors Figure 9 shows the location of the back panel connectors for the board. Item Description A B C D E F G H I J K PS/2 keyboard/mouse port USB ports VGA port DVI-D connector HDMI connector USB ports LAN USB ports Audio line in Audio line out Mic in Figure 9. Back Panel Connectors NOTE The back panel audio line out connector is designed to power headphones or amplified speakers only.
Technical Reference 2.2.2 Component-side Connectors and Headers Figure 10 shows the locations of the component-side connectors and headers. Figure 10. Component-side Connectors and Headers Table 9 lists the component-side connectors and headers identified in Figure 10.
Intel Desktop Board DH55TC Technical Product Specification Table 9.
Technical Reference 2.2.2.1 Signal Tables for the Connectors and Headers Table 10. Serial Port Header Pin Signal Name Pin Signal Name 1 DCD (Data Carrier Detect) 2 RXD# (Receive Data) 3 TXD# (Transmit Data) 4 DTR (Data Terminal Ready) 5 Ground 6 DSR (Data Set Ready) 7 RTS (Request To Send) 8 CTS (Clear To Send) 9 RI (Ring Indicator) 10 Key (no pin) Table 11.
Intel Desktop Board DH55TC Technical Product Specification Table 12. S/PDIF Header Pin Signal Name 1 Ground 2 S/PDIF out 3 Key (no pin) 3 +5V_DC Table 13. Internal Mono Speaker Header Pin Signal Name 1 − 2 + Table 14.
Technical Reference Table 17. Front Panel USB Header (with Intel Z-U130 USB Solid-State Drive, or Compatible Device, Support) Pin Signal Name Pin Signal Name 1 +5 VDC 2 +5 VDC 3 D− 4 D− 5 D+ 6 D+ 7 Ground 8 Ground 9 KEY (no pin) 10 LED# Table 18. SATA Connectors Pin Signal Name 1 Ground 2 TXP 3 TXN 4 Ground 5 RXN 6 RXP 7 Ground Table 19. Processor (4-Pin) Fan Header Pin Signal Name 1 Ground 2 +12 V 3 FAN_TACH 4 FAN_CONTROL Table 20.
Intel Desktop Board DH55TC Technical Product Specification 2.2.2.2 Add-in Card Connectors The board has the following add-in card connectors: • • • One PCI Express 2.0 x16: this connector supports simultaneous transfer speeds of up to 8 GB/s of peak bandwidth per direction. Two PCI Express 2.0 x1: each of these connectors support simultaneous transfer speeds of up to 500 MB/s of peak bandwidth per direction. One Conventional PCI (rev 2.3 compliant) connector.
Technical Reference Table 22. Main Power Connector Pin Signal Name Pin 1 +3.3 V 13 +3.3 V 2 +3.3 V 14 −12 V 3 Ground 15 Ground 4 +5 V 16 PS-ON# (power supply remote on/off) 5 Ground 17 Ground 6 +5 V 18 Ground 7 Ground 19 Ground 8 PWRGD (Power Good) 20 −5 V (obsolete) 9 +5 V (Standby) 21 +5 V 10 +12 V 22 +5 V 11 +12 V (Note) 23 +5 V (Note) 12 +3.
Intel Desktop Board DH55TC Technical Product Specification 2.2.2.4 Front Panel Header This section describes the functions of the front panel header. Table 23 lists the signal names of the front panel header. Figure 11 is a connection diagram for the front panel header. Table 23.
Technical Reference 2.2.2.4.2 Reset Switch Header Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type switch that is normally open. When the switch is closed, the board resets and runs the POST. 2.2.2.4.3 Power LED Header Pins 2 and 4 can be connected to a one- or two-color LED. Table 24 shows the default states for this LED. More options are available through BIOS setup. Table 24.
Intel Desktop Board DH55TC Technical Product Specification 2.2.2.6 Front Panel USB Headers Figure 12 is a connection diagram for the front panel USB headers. NOTE • • The +5 V DC power on the USB headers is fused. Use only a front panel USB connector that conforms to the USB 2.0 specification for high-speed USB devices. Figure 12. Connection Diagram for Front Panel USB Headers Figure 13.
Technical Reference 2.3 Jumper Block CAUTION Do not move the jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged. Figure 14 shows the location of the jumper block. The 3-pin jumper block determines the BIOS Setup program’s mode. Table 26 describes the jumper settings for the three modes: normal, configure, and recovery. Figure 14.
Intel Desktop Board DH55TC Technical Product Specification Table 26. BIOS Setup Configuration Jumper Settings Function/Mode Jumper Setting Configuration Normal 1-2 The BIOS uses current configuration information and passwords for booting. Configure 2-3 After the POST runs, Setup runs automatically. The maintenance menu is displayed. Note that this Configure mode is the only way to clear the BIOS/CMOS settings.
Technical Reference 2.4 2.4.1 Mechanical Considerations Form Factor The board is designed to fit into a MicroATX form-factor chassis. Figure 15 illustrates the mechanical form factor for the board. Dimensions are given in inches [millimeters]. The outer dimensions are 9.60 inches by 9.60 inches [243.84 millimeters by 243.84 millimeters]. Location of the I/O connectors and mounting holes are in compliance with the ATX specification. Figure 15.
Intel Desktop Board DH55TC Technical Product Specification 2.5 Electrical Considerations 2.5.1 Power Supply Considerations CAUTION The +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. Additional power required will depend on configurations chosen by the integrator.
Technical Reference 2.5.2 Fan Header Current Capability CAUTION The processor fan must be connected to the processor fan header, not to a chassis fan header. Connecting the processor fan to a chassis fan header may result in onboard component damage that will halt fan operation. Table 28 lists the current capability of the fan headers. Table 28. Fan Header Current Capability Fan Header Maximum Available Current Processor fan 2.0 A Front chassis fan 1.5 A Rear chassis fan 1.5 A 2.5.
Intel Desktop Board DH55TC Technical Product Specification 2.6 Thermal Considerations CAUTION Use of a processor heat sink that provides omni-directional airflow to maintain required airflow across the processor voltage regulator area is highly recommended. CAUTION Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board.
Technical Reference Figure 16 shows the locations of the localized high temperature zones. Item Description A B C Processor voltage regulator area Processor Intel H55 Express Chipset Figure 16. Localized High Temperature Zones Table 29 provides maximum case temperatures for the components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures.
Intel Desktop Board DH55TC Technical Product Specification To ensure functionality and reliability, the component is specified for proper operation when Case Temperature is maintained at or below the maximum temperature listed in Table 29. This is a requirement for sustained power dissipation equal to Thermal Design Power (TDP is specified as the maximum sustainable power to be dissipated by the components).
Technical Reference 2.7 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 50 ºC. The MTBF for the board is 146,986 hours. 2.
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3 Overview of BIOS Features 3.1 Introduction The board uses an Intel BIOS that is stored in a 64 Mbit (8,192 KB) Serial Peripheral Interface Flash Memory (SPI Flash) device which can be updated using a set of utilities. The SPI Flash contains the BIOS Setup program, POST, LAN EEPROM information, Plug and Play support, and other firmware. The BIOS displays a message during POST identifying the type of BIOS and a revision code. The initial production BIOSs are identified as TCIBX10H.86A.
Intel Desktop Board DH55TC Technical Product Specification Table 32 lists the BIOS Setup program menu features. Table 32.
Overview of BIOS Features 3.2 System Management BIOS (SMBIOS) SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in a managed network. The main component of SMBIOS is the Management Information Format (MIF) database, which contains information about the computing system and its components. Using SMBIOS, a system administrator can obtain the system types, capabilities, operational status, and installation dates for system components.
Intel Desktop Board DH55TC Technical Product Specification 3.4 BIOS Updates The BIOS can be updated using either of the following utilities, which are available on the Intel World Wide Web site: • • • Intel® Express BIOS Update utility, which enables automated updating while in the Windows environment. Using this utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash drive or a USB drive), or an optical drive.
Overview of BIOS Features 3.4.2 Custom Splash Screen During POST, an Intel® splash screen is displayed by default. This splash screen can be augmented with a custom splash screen. The Intel Integrator’s Toolkit that is available from Intel can be used to create a custom splash screen. For information about ® Intel Integrator Toolkit ® Additional Intel software tools Refer to http://developer.intel.com/design/motherbd/software/itk/ http://developer.intel.com/products/motherboard/DH55TC/ tools.
Intel Desktop Board DH55TC Technical Product Specification 3.6 Boot Options In the BIOS Setup program, the user can choose to boot from a hard drive, optical drive, removable drive, or the network. The default setting is for the optical drive to be the first boot device, the hard drive second, removable drive third, and the network fourth. 3.6.1 Optical Drive Boot Booting from the optical drive is supported in compliance to the El Torito bootable CD-ROM format specification.
Overview of BIOS Features 3.7 BIOS Security Features The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer, with the following restrictions: • • • • • • • The supervisor password gives unrestricted access to view and change all the Setup options in the BIOS Setup program. This is the supervisor mode.
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4 Error Messages and Beep Codes 4.1 Speaker The board-mounted piezoelectric speaker provides audible error code (beep code) information during POST. For information about Refer to The location of the onboard speaker Figure 1, page 11 4.2 BIOS Beep Codes Whenever a recoverable error occurs during POST, the BIOS causes the board’s piezoelectric speaker to beep an error message describing the problem (see Table 37). Table 37. BIOS Beep Codes Type Pattern F2 Setup/F10 Boot Menu One 0.
Intel Desktop Board DH55TC Technical Product Specification 4.3 Front-panel Power LED Blink Codes Whenever a recoverable error occurs during POST, the BIOS causes the board’s front panel power LED to blink an error message describing the problem (see Table 38). Table 38. Front-panel Power LED Blink Codes Type Pattern Note F2 Setup/F10 Boot Menu None Prompt BIOS update in progress Off when the update begins, then on for 0.5 seconds, then off for 0.5 seconds.
Error Messages and Beep Codes 4.5 Port 80h POST Codes During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h. This code is useful for determining the point where an error occurred. Displaying the POST codes requires a PCI bus add-in card, often called a POST card. The POST card can decode the port and display the contents on a medium such as a seven-segment display.
Intel Desktop Board DH55TC Technical Product Specification Table 41.
Error Messages and Beep Codes Table 41.
Intel Desktop Board DH55TC Technical Product Specification Table 41.
Error Messages and Beep Codes Table 42.
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5 Regulatory Compliance and Battery Disposal Information 5.1 Regulatory Compliance This section contains the following regulatory compliance information for Intel Desktop Board DH55TC: • • • • • 5.1.
Intel Desktop Board DH55TC Technical Product Specification 5.1.2 European Union Declaration of Conformity Statement We, Intel Corporation, declare under our sole responsibility that the product Intel® Desktop Board DH55TC is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European Council Directive 2004/108/EC (EMC Directive) and 2006/95/EC (Low Voltage Directive).
Regulatory Compliance and Battery Disposal Information Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC & 2006/95/EC. Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív 2004/108/EC a 2006/95/EC. Slovenščina Izdelek je skladen z določbami evropskih direktiv 2004/108/EC in 2006/95/EC. Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC & 2006/95/EC. Türkçe Bu ürün, Avrupa Birliği’nin 2004/108/EC ve 2006/95/EC yönergelerine uyar. 5.1.
Intel Desktop Board DH55TC Technical Product Specification Español Como parte de su compromiso de responsabilidad medioambiental, Intel ha implantado el programa de reciclaje de productos Intel, que permite que los consumidores al detalle de los productos Intel devuelvan los productos usados en los lugares seleccionados para su correspondiente reciclado. Consulte la http://www.intel.
Regulatory Compliance and Battery Disposal Information Russian В качестве части своих обязательств к окружающей среде, в Intel создана программа утилизации продукции Intel (Product Recycling Program) для предоставления конечным пользователям марок продукции Intel возможности возврата используемой продукции в специализированные пункты для должной утилизации. Пожалуйста, обратитесь на веб-сайт http://www.intel.
Intel Desktop Board DH55TC Technical Product Specification Table 44. Lead-Free Board Markings Description Mark nd Lead-Free 2 Level Interconnect: This symbol is used to identify electrical and electronic assemblies and components in which the lead (Pb) concentration level in the desktop board substrate and the solder connections from the board to the components (second-level interconnect) is not greater than 0.1% by weight (1000 ppm).
Regulatory Compliance and Battery Disposal Information 5.1.4 EMC Regulations Intel Desktop Board DH55TC complies with the EMC regulations stated in Table 45 when correctly installed in a compatible host system. Table 45. EMC Regulations Regulation Title FCC 47 CFR Part 15, Subpart B Title 47 of the Code of Federal Regulations, Part15, Subpart B, Radio Frequency Devices. (USA) ICES-003 Issue 4 Interference-Causing Equipment Standard, Digital Apparatus.
Intel Desktop Board DH55TC Technical Product Specification Korean Class B statement translation: this is household equipment that is certified to comply with EMC requirements. You may use this equipment in residential environments and other non-residential environments. 5.1.5 Product Certification Markings (Board Level) Intel Desktop Board DH55TC has the product certification markings shown in Table 46: Table 46.
Regulatory Compliance and Battery Disposal Information 5.2 Battery Disposal Information CAUTION Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations. PRECAUTION Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les piles usagées doivent être recyclées dans la mesure du possible.
Intel Desktop Board DH55TC Technical Product Specification PRECAUCIÓN Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante. WAARSCHUWING Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type batterij. Batterijen moeten zoveel mogelijk worden gerecycled.
Regulatory Compliance and Battery Disposal Information AWAS Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan. OSTRZEŻENIE Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi przepisami ochrony środowiska.
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