Intel® Desktop Board DP55SB Technical Product Specification September 2009 Order Number: E70714-001US The Intel® Desktop Board DP55SB may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board DP55SB Specification Update.
Revision History Revision -001 Revision History Date ® First release of the Intel Desktop Board DP55SB Technical Product Specification September 2009 This product specification applies to only the standard Intel® Desktop Board DP55SB with BIOS identifier KGIBX10J.86A. Changes to this specification will be published in the Intel Desktop Board DP55SB Specification Update before being incorporated into a revision of this document.
Preface This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for the Intel® Desktop Board DP55SB. Intended Audience The TPS is intended to provide detailed, technical information about the Intel Desktop Board DP55SB and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.
Intel Desktop Board DP55SB Technical Product Specification Other Common Notation iv # Used after a signal name to identify an active-low signal (such as USBP0#) GB Gigabyte (1,073,741,824 bytes) GB/s Gigabytes per second Gb/s Gigabits per second KB Kilobyte (1024 bytes) Kbit Kilobit (1024 bits) kbits/s 1000 bits per second MB Megabyte (1,048,576 bytes) MB/s Megabytes per second Mbit Megabit (1,048,576 bits) Mbits/s Megabits per second xxh An address or data value ending with a lowe
Contents 1 Product Description 1.1 Overview.......................................................................................... 9 1.1.1 Feature Summary .................................................................. 9 1.1.2 Board Layout ....................................................................... 11 1.1.3 Block Diagram ..................................................................... 13 1.2 Legacy Considerations......................................................................
Intel Desktop Board DP55SB Technical Product Specification 2 Technical Reference 2.1 Memory Resources .......................................................................... 39 2.1.1 Addressable Memory............................................................. 39 2.1.2 Memory Map........................................................................ 41 2.2 Connectors and Headers................................................................... 41 2.2.1 Back Panel Connectors .........................
Contents 5 Regulatory Compliance and Battery Disposal Information 5.1 Regulatory Compliance..................................................................... 5.1.1 Safety Standards.................................................................. 5.1.2 European Union Declaration of Conformity Statement ................ 5.1.3 Product Ecology Statements................................................... 5.1.4 EMC Regulations .................................................................. 5.1.
Intel Desktop Board DP55SB Technical Product Specification 17. 18. 19. 20. 21. 22. 23. 24. 25. 26. 27. 28. 29. 30. 31. 32. 33. 34. 35. 36. 37. 38. 39. 40. viii Main Power Connector...................................................................... Front Panel Header .......................................................................... States for a One-Color Power LED ...................................................... States for a Two-Color Power LED............................................
1 Product Description 1.1 Overview 1.1.1 Feature Summary Table 1 summarizes the major features of the board. Table 1. Feature Summary Form Factor Processor Memory Chipset MicroATX (9.60 inches by 9.60 inches [243.84 millimeters by 243.84 millimeters]) • Intel® Core™ i7 and Intel® Core™ i5 processors in an LGA1156 socket: ― 1 x16 PCIe 2.0 Graphics interface (operates in x8 mode when second slot is populated) ― 1 x8 PCIe 2.
Intel Desktop Board DP55SB Technical Product Specification Table 1. Feature Summary (continued) LAN Support Gigabit (10/100/1000 Mbits/s) LAN subsystem using the Intel® 82578DC Gigabit Ethernet Controller Expansion Capabilities • One PCI Express 2.0 x16 (x8 when the PCI Express x8 connector is used) bus add-in card connector (blue) • One PCI Express 2.
Product Description 1.1.2 Board Layout Figure 1 shows the location of the major components on Intel Desktop Board DP55SB. Figure 1. Major Board Components Table 2 lists the components identified in Figure 1.
Intel Desktop Board DP55SB Technical Product Specification Table 2. Components Shown in Figure 1 Item/callout 12 from Figure 1 Description A Auxiliary PCI Express graphics power connector (SATA-style) B PCI Express 2.0 x8 connector C Front panel audio header D S/PDIF header E PCI Express 2.0 x1 connector F Rear chassis fan header G PCI Express 2.0 x1 connector H PCI Express 2.
Product Description 1.1.3 Block Diagram Figure 2 is a block diagram of the major functional areas of the board. Figure 2.
Intel Desktop Board DP55SB Technical Product Specification 1.2 Legacy Considerations This board differs from other Intel Desktop Board products, with specific changes including (but not limited to) the following: • • • • 1.3 1.4 No No No No parallel port connector floppy drive connector serial port connector or header PS/2 connectors Online Support To find information about… Visit this World Wide Web site: Intel Desktop Board DP55SB http://www.intel.com/products/motherboard/DP55SB/index.
Product Description 1.5 System Memory The board has four DIMM sockets and supports the following memory features: • • • 1.35 V DDR3 SDRAM DIMMs (New JEDEC Specification) Two independent memory channels with interleaved mode support Unbuffered, single-sided or double-sided DIMMs with the following restriction: Double-sided DIMMs with x16 organization are not supported. • 16 GB maximum total system memory (with 2 Gb memory technology). Refer to Section 2.1.
Intel Desktop Board DP55SB Technical Product Specification Table 3 lists the supported DIMM configurations. Table 3.
Product Description Figure 3 illustrates the memory channel and DIMM configuration. Figure 3. Memory Channel and DIMM Configuration NOTE For the system to boot, always install memory into the blue DIMM memory slots if only installing two DIMMs in your configuration.
Intel Desktop Board DP55SB Technical Product Specification Intel® P55 Express Chipset 1.6 The Intel P55 Express Chipset consisting of the Intel P55 Platform Controller Hub (PCH) provides interfaces to the processor and the USB, SATA, LPC, LAN, PCI, and PCIe interfaces. The PCH is a centralized controller for the board’s I/O paths. For information about Refer to The Intel P55 Express Chipset http://www.intel.com/products/desktop/chipsets/index.htm Resources used by the chipset Chapter 2 1.6.
Product Description 1.6.2 SATA Interfaces The board provides eight internal SATA connectors. Six connectors (black) are through the PCH, which support one device per connector, and two additional connectors (blue) from a discrete controller. The PCH provides independent SATA ports with a theoretical maximum transfer rate of 3 Gb/s per port. One device can be installed on each port for a maximum of eight SATA devices.
Intel Desktop Board DP55SB Technical Product Specification 1.7 Discrete SATA Controller The board includes a discrete Marvell 88E6145 SATA controller that provides two internal SATA ports (blue) and one eSATA port (red) on the back panel. 1.7.1 eSATA Support The red eSATA connector on the back panel can be used to connect an eSATA drive. It can also be used for port replication, which allows the aggregation of multiple hard drives on the eSATA port.
Product Description 1.9 Legacy I/O Controller The I/O controller provides the following features: • • • • Consumer Infrared (CIR) headers Serial IRQ interface compatible with serialized IRQ support for PCI systems Intelligent power management, including a programmable wake-up event interface PCI power management support The BIOS Setup program provides configuration options for the I/O controller. 1.9.
Intel Desktop Board DP55SB Technical Product Specification 1.10 Audio Subsystem The board supports the Intel High Definition Audio subsystem based on the Realtek ALC889 audio codec. The audio subsystem supports the following features: • • • • Advanced jack sense for the back panel audio jacks that enables the audio codec to recognize the device that is connected to an audio port.
Product Description 1.10.3 8-Channel (7.1) Audio Subsystem The 8-channel (7.1) audio subsystem includes the following: • • • Intel P55 PCH Realtek ALC889 audio codec Microphone input that supports a single dynamic, condenser, or electret microphone The back panel audio connectors are configurable through the audio device drivers. The available configurable back panel audio connectors are shown in Figure 4.
Intel Desktop Board DP55SB Technical Product Specification 1.
Product Description 1.11.2 LAN Subsystem Software LAN software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining LAN software and drivers http://downloadcenter.intel.com 1.11.3 RJ-45 LAN Connector with Integrated LEDs Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5 below). Item Description A Link LED (green) B Data Rate LED (green/yellow) Figure 5.
Intel Desktop Board DP55SB Technical Product Specification 1.12 Bluetooth* Technology Support The Bluetooth Module plus external antenna enables the user to connect with a variety of Bluetooth enabled devices. Driver support is provided by Microsoft operating systems like Microsoft Vista and Microsoft 7.
Product Description 1.13.2 Fan Monitoring Fan monitoring can be implemented using Intel® Desktop Control Center or third-party software. For information about Refer to The functions of the fan headers Section 1.14.2.2, page 33 1.13.3 Chassis Intrusion and Detection The board supports a chassis security feature that detects if the chassis cover is removed. The security feature uses a mechanical switch on the chassis that attaches to the chassis intrusion header.
Intel Desktop Board DP55SB Technical Product Specification 1.13.4 Thermal Monitoring Figure 6 shows the locations of the thermal sensors and fan headers. Item Description A Rear chassis fan header B Voltage regulator thermal diode C Processor fan header D Thermal diode, located on processor die E Front chassis fan header F Thermal diode, located on the Intel P55 Express Chipset Figure 6.
Product Description 1.14 Power Management Power management is implemented at several levels, including: • • Software support through Advanced Configuration and Power Interface (ACPI) Hardware support: ⎯ Power connector ⎯ Fan headers ⎯ LAN wake capabilities ⎯ Instantly Available PC technology ⎯ Wake from USB ⎯ Power Management Event signal (PME#) wake-up support ⎯ PCI Express WAKE# signal support ⎯ Wake from Consumer IR 1.14.
Intel Desktop Board DP55SB Technical Product Specification 1.14.1.1 System States and Power States Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off.
Product Description 1.14.1.2 Wake-up Devices and Events Table 7 lists the devices or specific events that can wake the computer from specific states. Table 7. Wake-up Devices and Events These devices/events can wake up the computer… …from this state Power switch S1, S3, S4, S5 RTC alarm S1, S3, S4, S5 LAN S1, S3, S4, S5 USB S1, S3 PME# signal S1, S3, S4, S5 WAKE# S1, S3, S4, S5 Consumer IR S3, S4, S5 (Note 1) (Note 1) (Note 1) (Note 1) (Note 1) (Note 2) Notes: 1.
Intel Desktop Board DP55SB Technical Product Specification 1.14.2 Hardware Support CAUTION Ensure that the power supply provides adequate +5 V standby current if LAN wake capabilities and Instantly Available PC technology features are used. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options.
Product Description 1.14.2.
Intel Desktop Board DP55SB Technical Product Specification 1.14.2.4 Instantly Available PC Technology CAUTION For Instantly Available PC technology, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing Instantly Available PC technology can damage the power supply. Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-toRAM) sleep-state.
Product Description 1.14.2.10 +5 V Standby Power Indicator LED and Additional LEDs The +5 V standby power indicator LED shows that power is still present even when the computer appears to be off. Figure 7 shows the location of the standby power indicator LED on the board. CAUTION If AC power has been switched off and the standby power indicators are still lit, disconnect the power cord before installing or removing any devices connected to the board.
Intel Desktop Board DP55SB Technical Product Specification Figure 7 shows the location of these additional LEDs. Item Description A Processor LED (red) B Voltage regulator LED (red) C Standby power indicator LED (green) D SATA drive activity LED (blue) Figure 7.
Product Description 1.15 Onboard Power Button The board provides a power button that can be used to turn the computer on or off. This button is intended for use at integration facilities to provide the ability to power on/off the board without the need to attach a front panel switch (the onboard power button duplicates the functionality of the front panel button and functions in exactly the same manner).
Intel Desktop Board DP55SB Technical Product Specification 1.15.1 ENERGY STAR* 4.0 and 5.0, E-Standby, and ErP Compliance The US Department of Energy and the US Environmental Protection Agency have continually revised the ENERGY STAR requirements. Intel has worked directly with these two governmental agencies in the definition of new requirements. For information about Refer to ENERGY STAR requirements and recommended configurations http://www.intel.
2 Technical Reference 2.1 Memory Resources 2.1.1 Addressable Memory The board utilizes 16 GB of addressable system memory. Typically the address space that is allocated for PCI Conventional bus add-in cards, PCI Express configuration space, BIOS (SPI Flash device), and chipset overhead resides above the top of DRAM (total system memory).
Intel Desktop Board DP55SB Technical Product Specification Figure 9.
Technical Reference 2.1.2 Memory Map Table 8 lists the system memory map. Table 8. System Memory Map Address Range (decimal) Address Range (hex) Size Description 1024 K - 16777216 K 100000 - 3FFFFFFFF 16382 MB Extended memory 960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS 896 K - 960 K E0000 - EFFFF 64 KB Reserved 800 K - 896 K C8000 - DFFFF 96 KB Potential available high DOS memory (open to the PCI Conventional bus). Dependent on video adapter used.
Intel Desktop Board DP55SB Technical Product Specification 2.2.1 Back Panel Connectors Figure 10 shows the location of the back panel connectors for the board.
Technical Reference 2.2.2 Component-side Connectors and Headers Figure 11 shows the locations of the component-side connectors and headers. Figure 11. Component-side Connectors and Headers Table 9 lists the component-side connectors and headers identified in Figure 11.
Intel Desktop Board DP55SB Technical Product Specification Table 9. Component-side Connectors and Headers Shown in Figure 11 44 Item/callout from Figure 11 Description A PCI Express 2.0 x8 connector B Front panel audio header C S/PDIF header D PCI Express 2.0 x1 connector E Rear chassis fan header F PCI Express x1 connector G PCI Express 2.
Technical Reference 2.2.2.1 Signal Tables for the Connectors and Headers Table 10. IEEE 1394a Header Pin Signal Name Pin Signal Name 1 Data A (positive) 2 Data A (negative) 3 Ground 4 Ground 5 Data B (positive) 6 Data B (negative) 7 +12 V DC 8 +12 V DC 9 Key (no pin) 10 Ground Table 11.
Intel Desktop Board DP55SB Technical Product Specification Table 14. Chassis Intrusion Header Pin Signal Name 1 Intruder# 2 Ground Table 15. Processor, Front and Rear Chassis (4-Pin) Fan Headers Pin Signal Name 1 Ground (Note) 2 +12 V 3 FAN_TACH 4 FAN_CONTROL Note: These fan headers use Pulse Width Modulation control for fan speed. Table 20.
Technical Reference 2.2.2.2 Add-in Card Connectors The board has the following add-in card connectors: • • • PCI Express 2.0 x16: one PCI Express 2.0 x16 connector supporting simultaneous transfer speeds up to 8 GB/s of peak bandwidth per direction and up to 16 GB/s concurrent bandwidth. PCI Express 2.0 x8: one PCI Express 2.0 x 8 connector supporting simultaneous transfer speeds up to 4 GB/s of peak bandwidth per direction and up to 8 GB/s concurrent bandwidth. PCI Express 2.0 x1: two PCI Express 2.
Intel Desktop Board DP55SB Technical Product Specification Table 17. Main Power Connector Pin Signal Name Pin Signal Name 1 +3.3 V 13 +3.3 V 2 +3.
Technical Reference 2.2.2.4 Front Panel Header This section describes the functions of the front panel header. Table 18 lists the signal names of the front panel header. Figure 12 is a connection diagram for the front panel header. Table 18.
Intel Desktop Board DP55SB Technical Product Specification 2.2.2.4.2 Reset Switch Header Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type switch that is normally open. When the switch is closed, the board resets and runs the POST. 2.2.2.4.3 Power/Sleep LED Header Pins 2 and 4 can be connected to a one- or two-color LED. Table 19 shows the possible states for a one-color LED. Table 20 shows the possible states for a two-color LED. Table 19.
Technical Reference 2.2.2.5 Front Panel USB Headers Figure 13 is a connection diagram for the front panel USB headers. NOTE • • The +5 V DC power on the USB headers is fused. Use only a front panel USB connector that conforms to the USB 2.0 specification for high-speed USB devices. Figure 13. Connection Diagram for Front Panel USB Headers 2.2.2.6 Front Panel IEEE 1394a Header Figure 14 is a connection diagram for the IEEE 1394a header.
Intel Desktop Board DP55SB Technical Product Specification 2.3 Jumper Block CAUTION Do not move the jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged. Figure 15 shows the location of the jumper block. The 3-pin jumper block determines the BIOS Setup program’s mode. Table 21 describes the jumper settings for the three modes: normal, configure, and recovery.
Technical Reference Table 21. BIOS Setup Configuration Jumper Settings Function/Mode Jumper Setting Configuration Normal 1-2 The BIOS uses current configuration information and passwords for booting. Configure 2-3 After the POST runs, Setup runs automatically. The maintenance menu is displayed. Note that this Configure mode is the only way to clear the BIOS/CMOS settings. Press F9 (restore defaults) while in Configure mode to restore the BIOS/CMOS settings to their default values.
Intel Desktop Board DP55SB Technical Product Specification 2.4 2.4.1 Mechanical Considerations Form Factor The board is designed to fit into an ATX-form-factor chassis. Figure 16 illustrates the mechanical form factor for the board. Dimensions are given in inches [millimeters]. The outer dimensions are 12.00 inches by 9.60 inches [304.80 millimeters by 243.84 millimeters]. Location of the I/O connectors and mounting holes are in compliance with the ATX specification. Figure 16.
Technical Reference 2.5 Electrical Considerations 2.5.1 Power Supply Considerations CAUTION The +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. Additional power required will depend on configurations chosen by the integrator.
Intel Desktop Board DP55SB Technical Product Specification 2.5.2 Fan Header Current Capability CAUTION The processor fan must be connected to the processor fan header, not to a chassis fan header. Connecting the processor fan to a chassis fan header may result in onboard component damage that will halt fan operation. Table 23 lists the current capability of the fan headers. Table 23. Fan Header Current Capability Fan Header Maximum Available Current Processor fan 1.5 A Front chassis fan 1.
Technical Reference 2.6 Thermal Considerations CAUTION A chassis with a maximum internal ambient temperature of 38 oC at the processor fan inlet is a requirement. Use a processor heat sink that provides omni-directional airflow to maintain required airflow across the processor voltage regulator area. CAUTION Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board.
Intel Desktop Board DP55SB Technical Product Specification Item Description A B C Processor voltage regulator area Processor Intel P55 Express Chipset Figure 17. Localized High Temperature Zones Table 24 provides maximum case temperatures for the components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 24.
Technical Reference 2.7 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the board is 102,130.7539 hours. 2.
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3 Overview of BIOS Features 3.1 Introduction The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the BIOS Setup program, POST, the PCI auto-configuration utility, LAN EEPROM information, and Plug and Play support. The BIOS displays a message during POST identifying the type of BIOS and a revision code. The initial production BIOSs are identified as KGIBX10J.86A.
Intel Desktop Board DP55SB Technical Product Specification Table 26 lists the BIOS Setup program menu features. Table 26.
Overview of BIOS Features 3.4 System Management BIOS (SMBIOS) SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in a managed network. The main component of SMBIOS is the Management Information Format (MIF) database, which contains information about the computing system and its components. Using SMBIOS, a system administrator can obtain the system types, capabilities, operational status, and installation dates for system components.
Intel Desktop Board DP55SB Technical Product Specification To install an operating system that supports USB, verify that Legacy USB support in the BIOS Setup program is set to Enabled and follow the operating system’s installation instructions. 3.6 BIOS Updates The BIOS can be updated using either of the following utilities, which are available on the Intel World Wide Web site: • • • Intel® Express BIOS Update utility, which enables automated updating while in the Windows environment.
Overview of BIOS Features 3.6.2 Custom Splash Screen During POST, an Intel® splash screen is displayed by default. This splash screen can be augmented with a custom splash screen. The Intel Integrator’s Toolkit that is available from Intel can be used to create a custom splash screen. NOTE If you add a custom splash screen, it will share space with the Intel branded logo. For information about Refer to Intel® Integrator Toolkit http://developer.intel.
Intel Desktop Board DP55SB Technical Product Specification 3.8 Boot Options In the BIOS Setup program, the user can choose to boot from a diskette drive, hard drive, USB drive, USB flash drive, optical drive, or the network. The default setting is for the diskette drive to be the first boot device, the hard drive second, and the optical drive third. If enabled, the last default boot device is the network. 3.8.
Overview of BIOS Features 3.9 Adjusting Boot Speed These factors affect system boot speed: • • Selecting and configuring peripherals properly Optimized BIOS boot parameters 3.9.1 Peripheral Selection and Configuration The following techniques help improve system boot speed: • • • • Choose a hard drive with parameters such as “power-up to data ready” in less than eight seconds to minimize hard drive startup delays. Select an optical drive with a fast initialization rate.
Intel Desktop Board DP55SB Technical Product Specification 3.10 BIOS Security Features The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer, with the following restrictions: • • • • • • • The supervisor password gives unrestricted access to view and change all the Setup options in the BIOS Setup program. This is the supervisor mode.
Overview of BIOS Features 3.11 BIOS Performance Features The BIOS includes the following options to provide custom performance enhancements when using an Intel Core i7 and Intel Core i5 processors in an LGA 1156 socket.
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4 Error Messages and Beep Codes 4.1 Speaker The board-mounted speaker provides audible error code (beep code) information during POST. 4.2 For information about Refer to The location of the onboard speaker Figure 1, page 11 BIOS Beep Codes Whenever a recoverable error occurs during POST, the BIOS causes the board’s speaker to beep an error message describing the problem (see Table 31). Table 31. BIOS Beep Codes Type Pattern F2 Setup/F10 Boot Menu One 0.
Intel Desktop Board DP55SB Technical Product Specification 4.3 Front-panel Power LED Blink Codes Whenever a recoverable error occurs during POST, the BIOS causes the board’s front panel power LED to blink an error message describing the problem (see Table 32). Table 32. Front-panel Power LED Blink Codes Type Pattern Note F2 Setup/F10 Boot Menu None Prompt 4.4 BIOS update in progress Off when the update begins, then on for 0.5 seconds, then off for 0.5 seconds.
Error Messages and Beep Codes 4.5 Port 80h POST Codes During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h. This code is useful for determining the point where an error occurred. Displaying the POST codes requires a PCI bus add-in card, often called a POST card. The POST card can decode the port and display the contents on a medium such as a seven-segment display.
Intel Desktop Board DP55SB Technical Product Specification Table 35.
Error Messages and Beep Codes Table 35.
Intel Desktop Board DP55SB Technical Product Specification Table 35.
Error Messages and Beep Codes Table 36.
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5 Regulatory Compliance and Battery Disposal Information 5.1 Regulatory Compliance This section contains the following regulatory compliance information for Intel Desktop Board DP55SB: • • • • • 5.1.
Intel Desktop Board DP55SB Technical Product Specification 5.1.2 European Union Declaration of Conformity Statement We, Intel Corporation, declare under our sole responsibility that the product Intel® Desktop Board DP55SB is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European Council Directive 2004/108/EC (EMC Directive) and 2006/95/EC (Low Voltage Directive).
Regulatory Compliance and Battery Disposal Information Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC & 2006/95/EC. Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív 2004/108/EC a 2006/95/EC. Slovenščina Izdelek je skladen z določbami evropskih direktiv 2004/108/EC in 2006/95/EC. Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC & 2006/95/EC. Türkçe Bu ürün, Avrupa Birliği’nin 2004/108/EC ve 2006/95/EC yönergelerine uyar. 5.1.
Intel Desktop Board DP55SB Technical Product Specification Español Como parte de su compromiso de responsabilidad medioambiental, Intel ha implantado el programa de reciclaje de productos Intel, que permite que los consumidores al detalle de los productos Intel devuelvan los productos usados en los lugares seleccionados para su correspondiente reciclado. Consulte la http://www.intel.
Regulatory Compliance and Battery Disposal Information Russian В качестве части своих обязательств к окружающей среде, в Intel создана программа утилизации продукции Intel (Product Recycling Program) для предоставления конечным пользователям марок продукции Intel возможности возврата используемой продукции в специализированные пункты для должной утилизации. Пожалуйста, обратитесь на веб-сайт http://www.intel.
Intel Desktop Board DP55SB Technical Product Specification Table 38. Lead-Free Board Markings Description Mark nd Lead-Free 2 Level Interconnect: This symbol is used to identify electrical and electronic assemblies and components in which the lead (Pb) concentration level in the desktop board substrate and the solder connections from the board to the components (second-level interconnect) is not greater than 0.1% by weight (1000 ppm).
Regulatory Compliance and Battery Disposal Information 5.1.4 EMC Regulations Intel Desktop Board DP55SB complies with the EMC regulations stated in Table 39 when correctly installed in a compatible host system. Table 39. EMC Regulations Regulation Title FCC 47 CFR Part 15, Subpart B Title 47 of the Code of Federal Regulations, Part15, Subpart B, Radio Frequency Devices. (USA) ICES-003 Issue 4 Interference-Causing Equipment Standard, Digital Apparatus.
Intel Desktop Board DP55SB Technical Product Specification Korean Class B statement translation: this is household equipment that is certified to comply with EMC requirements. You may use this equipment in residential environments and other non-residential environments. 5.1.5 Product Certification Markings (Board Level) Intel Desktop Board DP55SB has the product certification markings shown in Table 40: Table 40.
Regulatory Compliance and Battery Disposal Information 5.2 Battery Disposal Information CAUTION Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations. PRECAUTION Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les piles usagées doivent être recyclées dans la mesure du possible.
Intel Desktop Board DP55SB Technical Product Specification PRECAUCIÓN Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante. WAARSCHUWING Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type batterij. Batterijen moeten zoveel mogelijk worden gerecycled.
Regulatory Compliance and Battery Disposal Information AWAS Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan. OSTRZEŻENIE Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi przepisami ochrony środowiska.
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