Dual-Core Intel® Xeon® Processor 7000 Sequence Thermal/Mechanical Design Guidelines November 2005 Document Number: 309625-001
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND/OR USE OF INTEL PRODUCTS, INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.
Contents 1 Introduction.........................................................................................................................7 1.1 Objective ............................................................................................................... 7 1.2 Scope .................................................................................................................... 7 1.3 References .............................................................................................
Figures 2-1 2-2 2-3 2-4 2-5 2-6 2-7 2-8 2-9 2-10 2-11 2-12 2-13 2-14 2-15 A-1 A-2 A-3 A-4 A-5 A-6 A-7 A-8 A-9 A-10 A-11 A-12 A-13 C-1 C-2 4 Dual-Core Intel® Xeon® Processor 7000 Sequence Mechanical Drawing, Sheet 1 ............................................................................. 12 Dual-Core Intel® Xeon® Processor 7000 Sequence Mechanical Drawing, Sheet 2 ............................................................................. 13 Dual Core vs. Dual Die....................................
Tables 1-1 1-2 2-1 2-2 2-3 2-4 2-5 A-1 D-1 References ............................................................................................................ 7 Terms and Definitions ........................................................................................... 8 Processor Mechanical Parameters ..................................................................... 11 Input and Output Conditions for Dual Core Thermal Management .....................
Revision History Reference Number Revision Number 309625 001 Description • Initial release of the document.
1 Introduction 1.1 Objective The purpose of this guide is to describe the reference thermal solution and design parameters required for the Dual-Core Intel® Xeon® processor 7000 sequence. It is also the intent of this document to comprehend and demonstrate the processor cooling solution features and requirements.
Introduction Table 1-1. References (Sheet 2 of 2) Document Comment Thin Electronics Bay Specification (A Server System Infrastructure (SSI) Specification for Thin Servers www.ssiforum.com European Blue Angel Recycling Standards http://www.blauer-engel.de NOTE: Contact your Intel field sales representative for the latest revision and order number of this document. 1.4 Definition of Terms Table 1-2.
Introduction Table 1-2. Terms and Definitions (Sheet 2 of 2) Term Description Thermal Profile Line that defines case temperature specification of a processor at a given power level. TIM Thermal Interface Material: The thermally conductive compound between the heatsink and the processor case. This material fills the air gaps and voids, and enhances the transfer of the heat from the processor case to the heatsink. TLA The measured ambient temperature locally surrounding the processor.
Introduction 10 Dual-Core Intel® Xeon® Processor 7000 Sequence Thermal /Mechanical Guidelines
2 Thermal Mechanical Design 2.1 Mechanical Requirements The mechanical performance of the processor cooling solution satisfies the requirements and volumetric keepouts as described in this section. 2.1.1 Processor Mechanical Parameters Table 2-1. Processor Mechanical Parameters Parameter Minimum Maximum Unit Volumetric Requirements and Keepouts Refer to drawings in Appendix A Heatsink Mass Static Compressive Load Dynamic Compressive Load Transient Notes 1000 g 2.
Thermal Mechanical Design 2.1.2 Mechanical Dimensions The Dual-Core Intel Xeon processor 7000 sequence is packaged using the flip-chip micro pin grid array (FC-mPGA4) package technology. Please refer to the Dual-Core Intel® Xeon® Processor 7000 Sequence Datasheet for detailed mechanical specifications. The Dual-Core Intel Xeon processor 7000 sequence mechanical drawings, Figure 2-1 and Figure 2-2, provide the mechanical information for Dual-Core Intel Xeon processor 7000 sequences.
Thermal Mechanical Design Figure 2-2. Dual-Core Intel® Xeon® Processor 7000 Sequence Mechanical Drawing, Sheet 2 The package includes an integrated heat spreader (IHS). The IHS transfers the non-uniform heat from the die to the top of the IHS, out of which the heat flux is more uniform and spread over a larger surface area (not the entire IHS area). This allows more efficient heat transfer out of the package to an attached cooling device. The IHS is designed to be the interface for contacting a heatsink.
Thermal Mechanical Design The processor connects to the baseboard through a 604-pin surface mount, zero insertion force (ZIF) socket. A description of the socket can be found in the mPGA604 Socket Design Guidlines. The processor package has mechanical load limits that are specified in the processor Datasheet and in Table 2-1. These load limits should not be exceeded during heatsink installation, removal, mechanical stress testing, or standard shipping conditions.
Thermal Mechanical Design 2.2 Processor Thermal Parameters and Features 2.2.1 Thermal Control Circuit and TDP The operating thermal limits of the processor are defined by the Thermal Profile. The intent of the Thermal Profile specification is to support acoustic noise reduction through fan speed control and ensure the long-term reliability of the processor.
Thermal Mechanical Design On-die thermal management features called THERMTRIP# and FORCEPTR# are available on the Dual-Core Intel Xeon processor 7000 sequence. They provide a thermal management approach to support the continued increases in processor frequency and performance. Note: Please see the Dual-Core Intel® Xeon® Processor 7000 Sequence Electrical, Mechanical, and Thermal Specifications for guidance on these thermal management features. 2.2.2 Dual Core Special Considerations 2.2.2.
Thermal Mechanical Design 2.2.2.2 Fan Speed Control for Dual Core The SMBus thermal sensor will move to a two-channel model for dual core processors. There will be no hardware changes to the SMBus on the platform, but the software will need to be modified to read the 2nd channel. Figure 2-5 provides an illustration of the fan speed signal for the Dual-Core Intel Xeon processor 7000 sequence. Figure 2-4. Fan Speed Control Dual Core 2.2.2.
Thermal Mechanical Design Table 2-2. Input and Output Conditions for Dual Core Thermal Management (Sheet 2 of 2) Input Output Item Core1 Core2 Core1 Core2 THERMTRIP# reached THERMTRIP# reached THERMTRIP# THERMTRIP# reached THERMTRIP# reached FORCEPR# Asserted FORCEPR# THERMTRIP# Asserted, both cores shut down TCC TCC NOTE: For more information on PROCHOT#, THERMTRIP#, and FORCEPR# see the Dual-Core Intel® Xeon® Processor 7000 Sequence Datasheet 2.2.
Thermal Mechanical Design Figure 2-5. Thermal Profile Diagram TTCASE MAX CASEMAX TCASE MAX TCASEMAX @ Pcontrol_base @Pcontrol_Base Thermal Profile TCASE Pcontrol_Base TDP Power The higher end point of the Thermal Profile represents the processor’s TDP and the associated maximum case temperature (TCASEMAX).
Thermal Mechanical Design 2.2.4 TCONTROL Definition TCONTROL is a temperature specification based on a temperature reading from the processor’s thermal diode. TCONTROL defines the lower end of the Thermal Profile line for a given processor, and it can be described as a trigger point for fan speed control implementation. The value for TCONTROL is calibrated in manufacturing and configured for each processor individually.
Thermal Mechanical Design minimum for the given processor family). Any Offset value greater than 0 moves the point where the Thermal Profile must be met upwards, as shown by location 2 on the graph. If the diode temperature is less than TCONTROL, then the case temperature is permitted to exceed the Thermal Profile, but the diode temperature must remain at or below TCONTROL. In other words, there is no TCASE specification for the processor at power levels less than PCONTROL.
Thermal Mechanical Design Table 2-3. Intel Reference Heatsink Performance Targets for the Dual-Core Intel® Xeon® Processor 7000 Sequence (Sheet 2 of 2) Parameter Maximum Unit Notes TLA 40 °C Pressure Drop 0.15 Inches of H2 O Altitude Sea-level Airflow 23 CFM Airflow through the heatsink fins TCASE_MAX 76 °C In case of conflict, Datasheet supersedes TMDG. TCASE_MAX @ Pcontrol_base 50 °C Pcontrol_base = 27 W Heatsink designed at 0 meters 2.
Thermal Mechanical Design Once the TCONTROL value is determined as explained earlier, the thermal diode temperature reading from the processor can be compared to this TCONTROL value. A fan speed control scheme can be implemented as described in Table 2-4 without compromising the long-term reliability of the processor. Table 2-4.
Thermal Mechanical Design The case-to-local ambient thermal characterization parameter of the processor, CA, is comprised of CS, the TIM thermal characterization parameter, and of SA , the sink-to-local ambient thermal characterization parameter: Equation 2-4. CA = CS + SA Where: CS SA = = Thermal characterization parameter of the TIM (°C/W). Thermal characterization parameter from heatsink-to-local ambient (°C/W).
Thermal Mechanical Design Assume the Datasheet TDP is 85 W and the case temperature specification is 68 °C. Assume as well that the system airflow has been designed such that the local processor ambient temperature is 45 °C. Then the following could be calculated using Equation 2-1from above for the given frequency: Equation 2-5. CA = (TCASE – TLA) / TDP = (68 – 45) / 85 = 0.
Thermal Mechanical Design 2.4 Thermal/Mechanical Reference Design Considerations 2.4.1 Heatsink Solutions 2.4.1.1 Heatsink Design Considerations To remove the heat from the processor, three basic parameters should be considered: • The area of the surface on which the heat transfer takes place - Without any enhancements, this is the surface of the processor package IHS. One method used to improve thermal performance is by attaching a heatsink to the IHS.
Thermal Mechanical Design All thermal interface materials should be sized and positioned on the heatsink base in a way that ensures the entire processor IHS area is covered. It is important to compensate for heatsink-toprocessor attach positional alignment when selecting the proper TIM size. When pre-applied material is used, it is recommended to have a protective application tape over it. This tape must be removed prior to heatsink installation. The TIM performance is susceptible to degradation (i.e.
Thermal Mechanical Design 2.4.4.2 Assembly Drawing Figure 2-10. Exploded View of CEK Thermal Solution Components The CEK reference thermal solution is designed to extend air-cooling capability through the use of larger heatsinks with minimal airflow blockage and bypass. CEK retention solution can allow the use of much heavier heatsink masses compared to the legacy limits by using a load path directly attached to the chassis pan.
Thermal Mechanical Design The baseboard mounting holes for the CEK solution are at the same location as the hole locations used for previous Intel® Xeon® processor thermal solution. However, CEK assembly requires 10.16 mm [0.400 in.] large diameter holes to compensate for the CEK spring embosses. The CEK solution is designed and optimized for a baseboard thickness range of 1.57 – 2.31 mm. [0.062-0.093 in].
Thermal Mechanical Design Figure 2-11. 2U+ CEK Heatsink Thermal Performance 0.45 0.80 0.40 0.70 2 P Test = 5.52e-05CFM + 5.24e-03CFM 0.35 0.60 0.30 0.50 0.25 0.40 0.20 0.30 0.15 0.20 -0.9397 Mean Test ca = 0.1435 + 1.2225*CFM = 0.0024 C/W, non-uniform heat 0.10 0.10 0.05 0 10 20 30 40 50 60 70 80 90 0.
Thermal Mechanical Design 2.4.6 Thermal Profile Adherence The 2U+ CEK Intel reference thermal solution is designed to meet the Thermal Profile for the Dual-Core Intel Xeon processor 7000 sequence. From Table 2-3, the three-sigma (mean+3sigma) performance of the thermal solution is computed to be 0.215 °C/W and the processor local ambient temperature (TLA) for this thermal solution is 40 °C. The Thermal Profile equation for this thermal solution is calculated as: Equation 2-8. y = 0.
Thermal Mechanical Design 2.4.7 Components Overview 2.4.7.1 Heatsink with Captive Screws and Standoffs The CEK reference heatsink uses snapped-fin technology for its design. It consists of a copper base and copper fins with Shin-Etsu G751 thermal grease as the TIM. The mounting screws and standoffs are also made captive to the heatsink base for ease of handling and assembly as shown in Figure 2-13. Figure 2-13.
Thermal Mechanical Design 2.4.7.2 Thermal Interface Material (TIM) A TIM must be applied between the package and the heatsink to ensure thermal conduction. The CEK reference design uses Shin-Etsu G751 thermal grease. The recommended grease dispenses weight to ensure full coverage of the processor IHS is given below. For an alternate TIM, full coverage of the entire processor IHS is recommended. Table 2-5.
Thermal Mechanical Design Figure 2-14. CEK Spring Isometric View Figure 2-15. Isometric View of CEK Spring Attachment to the Base Board Please refer to Appendix A for more detailed mechanical drawings of the CEK spring. Also, the baseboard keepout requirements shown in Appendix A must be met to use this CEK spring design.
A Mechanical Drawings The mechanical drawings included in this appendix refer to the thermal mechanical enabling components for the Irwindale Processor. Note: Intel reserves the right to make changes and modifications to the design as necessary. Table A-1.
Mechanical Drawings Figure A-1.
Mechanical Drawings Figure A-2.
Mechanical Drawings Figure A-3.
Mechanical Drawings Figure A-4.
Mechanical Drawings Figure A-5.
Mechanical Drawings Figure A-6.
Mechanical Drawings Figure A-7.
Mechanical Drawings Figure A-8.
Mechanical Drawings Figure A-9.
Mechanical Drawings Figure A-10.
Mechanical Drawings Figure A-11.
Mechanical Drawings Figure A-12.
Mechanical Drawings Figure A-13.
B Safety Requirements Heatsink and attachment assemblies shall be consistent with the manufacture of units that meet the safety standards: 1. UL Recognition-approved for flammability at the system level. All mechanical and thermal enabling components must be a minimum UL94V-2 approved. 2. CSA Certification. All mechanical and thermal enabling components must have CSA certification. 3. Heatsink fins must meet the test requirements of UL1439 for sharp edges.
Safety Requirements 50 Dual-Core Intel® Xeon® Processor 7000 Sequence Thermal /Mechanical Guidelines
C Quality and Reliability Requirements C.1 Intel Verification Criteria for the Reference Designs C.1.1 Reference Heatsink Thermal Verification The Intel reference heatsinks will be verified within specific boundary conditions based on the methodology described in Intel® Xeon™ Processor Family Thermal Test Vehicle User’s Guide.
Quality and Reliability Requirements C.1.2.3 Shock Test Procedure Recommended performance requirement for a baseboard: • Quantity: 3 drops for + and – directions in each of 3 perpendicular axes (i.e. total 18 drops). • Profile: 50 G trapezoidal waveform, 11 ms duration, 4.32 m/sec minimum velocity change. • Setup: Mount sample board on test fixture. Figure C-2. Shock Acceleration Curve 60 50 40 30 20 10 0 0 2 4 6 8 10 12 Time (Milliseconds) C.1.2.
Quality and Reliability Requirements C.1.2.6 Recommended BIOS/Processor/Memory Test Procedures This test is to ensure proper operation of the product before and after environmental stresses, with the thermal mechanical enabling components assembled. The test shall be conducted on a fully operational baseboard that has not been exposed to any battery of tests prior to the test being considered.
Quality and Reliability Requirements 54 Dual-Core Intel® Xeon® Processor 7000 Sequence Thermal /Mechanical Guidelines
D Supplier Information D.1 Intel Enabled Suppliers The Intel reference solutions have been verified to meet the criteria outlined in Table D-1. Customers can purchase the Intel reference thermal solution components from the suppliers listed in Table D.1. Table D-1.
Supplier Information 56 Dual-Core Intel® Xeon® Processor 7000 Sequence Thermal /Mechanical Guidelines
