R Intel® E7500/E7501/E7505 Chipset Thermal Design Guide For the Intel® E7500/E7501/E7505 Chipset Memory Controller Hub (MCH) December 2002 Document Number: 298647-003
R ® INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT.
R Contents 1 Introduction.......................................................................................................................... 7 1.1 1.2 1.3 Design Flow ............................................................................................................ 8 Definition of Terms ................................................................................................. 9 Reference Documents.....................................................................................
R Figures Figure 1. Thermal Design Process...................................................................................... 8 Figure 2. MCH Package Dimensions (Side View)............................................................. 11 Figure 3. MCH Package Dimensions (Top View).............................................................. 12 Figure 4. 0° Angle Attach Methodology (Top View) .......................................................... 18 Figure 5. 0° Angle Attach Heatsink Modifications ..
R Revision History Revision Number Description Date -001 Initial Release as an Intel® E7500 chipset specific document February 2002 -002 • Added Intel E7505 chipset specific information and re-titled document November 2002 ® • Removed 90°C Angle Attach Die Temperature Measurement Methodology • Updated Supplier Contact Information • All reference to Tdie-hs changed to Tcase -003 • Added Intel® E7501 chipset specific information and re-titled document December 2002 • Updated E7500/E7505 chipset
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Introduction R 1 Introduction As the complexity of computer systems increase, so do the power dissipation requirements. Care must be taken to ensure that the additional power is properly dissipated. Typical methods to improve heat dissipation include selective use of ducting, and/or passive heatsinks. The goals of this document are: • To specify the operating limits of the Intel® E7500/E7501/E7505 chipset MCH components.
Introduction R 1.1 Design Flow To develop a reliable, cost-effective thermal solution, several tools have been provided to the system designer. Figure 1 illustrates the design process implicit to this document and the tools appropriate for each step. Figure 1.
Introduction R 1.2 Definition of Terms Term ® Definition BGA Ball Grid Array. A package type defined by a resin-fiber substrate, onto which a die is mounted, bonded and encapsulated in molding compound. The primary electrical interface is an array of solder balls attached to the substrate opposite the die and molding compound. Intel® ICH3-S / Intel® ICH4 I/O Controller Hub. The chipset component that contains the primary PCI interface, LPC interface, USB, ATA-100, and other legacy functions.
Introduction R 1.3 Reference Documents Document Document Number/Location Intel® Xeon™ Processor Thermal Design Guidelines http://www.intel.com/design/Xeon/gu ides/298348.htm Intel® 82870P2 PCI/PCI-X 64-bit Hub 2 (P64H2) Thermal Design Guide http://developer.intel.com/design/chi psets/e7500/guides/252175.htm Intel® Xeon™ Processor with 512-KB L2 Cache and Intel® E7500 Chipset Platform Design Guide http://developer.intel.com/design/chi psets/e7500/guides/298649.
Packaging Technology R 2 Packaging Technology The E7500 and E7501chipsets consist of three individual components: the chipset memory controller hub (MCH), 82870P2 P64H2, and 82801CA ICH3-S. The E7505 chipset includes the chipset memory controller hub (MCH), 82870P2 P64H2, and the 82801DB ICH4. The E7500/E7501/E7505 chipset MCH components use a 42.5 mm, 6-layer FC-BGA package (see Figure 2 and Figure 3).
Packaging Technology R Figure 3. MCH Package Dimensions (Top View) AN AM Detail A AL AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K 21.250 J H G F E E C B 1.270 A 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 10 11 9 8 7 6 5 4 3 2 1 1.270 20.320 40.640 2x 42.500 ±0.100 0.200 A B Detail A Solder Resist Opening (n)x 0.650 ± 0.040 ∅ 00.200 L C A S B ∅ 00.071 L C Metal Edge (n)x ∅ 0.790 ± 0.025 (n)x 0.025 Min MCH_Pkg_TopView NOTES: 1.
Thermal Simulation R 3 Thermal Simulation Intel provides thermal simulation models of the MCH and associated user’s guides to aid system designers in simulating, analyzing, and optimizing their thermal solutions in an integrated systemlevel environment. The models are for use with the commercially available Computational Fluid Dynamics (CFD)-based thermal analysis tool “FLOTHERM*” (version 3.1 or higher) by Flomerics, Inc.
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Thermal Specifications R 4 Thermal Specifications 4.1 Case Temperature and Thermal Design Power For TDP specifications, see Table 1 for the E7500 chipset MCH, Table 2 for the E7501 chipset MCH, and Table 3 for the E7505 chipset MCH. FC-BGA packages have poor heat transfer capability into the board and have minimal thermal capability without thermal solutions. Intel recommends that system designers plan for one or more heatsinks when using the E7500/E7501/E7505 chipset. 4.
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Thermal Metrology R 5 Thermal Metrology The system designer must make temperature measurements to accurately determine the thermal performance of the system. Intel has established guidelines for proper techniques to measure the MCH package die temperature. Section 5.1 provides guidelines on how to accurately measure the MCH die temperatures. Section 5.2 contains information on running an application program that will emulate anticipated maximum thermal design power.
Thermal Metrology R Figure 4. 0° Angle Attach Methodology (Top View) Die Thermocouple Wire Cement + Thermocouple Bead Substrate angle_attach_1 NOTE: Not to scale. Figure 5. 0° Angle Attach Heatsink Modifications 1.3 mm (0.05 in.) (0.5 mm (0.02 in.) Depth) 3.3 mm (0.13 in.) Diameter (1.5 mm (0.06 in.) Depth) Angle_Attach_Heatsink_Mod NOTE: Not to scale.
Thermal Metrology R 5.2 Power Simulation Software The power simulation software is a utility designed to dissipate the thermal design power on an E7500/E7501/E7505 chipset MCH when used in conjunction with Intel® Xeon™ processor with 512-KB L2 cache or Intel® Xeon™ processor with 533 MHz system bus. The combination of the Xeon processor(s) and the higher bandwidth capability of the E7500/E7501/E7505 chipsets enable new levels of system performance.
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Reference Thermal Solutions R 6 Reference Thermal Solutions Intel has developed a reference thermal solution designed to meet the cooling needs of the E7500/E7501/E7505 chipset MCH at worst-case conditions. This chapter describes the overall requirements for the reference thermal solution, including critical-to-function dimensions, operating environment, and validation criteria. Other chipset components may or may not need thermal solutions, depending on specific system local-ambient operating conditions.
Reference Thermal Solutions R Figure 7. Reference Heatsink Volumetric Envelope for the MCH 40 mm (1.6 in.) (Tall Heatsink) Keep-out Zone Above the Motherboard 28 mm (1.1 in.) (Short Heatsink) Motherboard 42.5 mm (1.67 in.) MCH 42.5 mm (1.67 in.) 42.5 mm (1.67 in.) Heatsink_Volumetric_Envelope NOTE: Not to scale.
Reference Thermal Solutions R 6.3 Thermal Solution Assembly The reference thermal solution for the E7500/E7501/E7505 MCH is a passive extruded heatsink with thermal and mechanical interfaces. It is attached using a clip with each end hooked through an anchor soldered to the board. Figure 8 shows the reference thermal solution assembly and associated components. Figure 9 and Figure 10 show alternate views of the reference solution.
Reference Thermal Solutions R Figure 9. Reference Thermal Solution Assembly (Side View) Figure 10.
Reference Thermal Solutions R 6.3.1 Heatsink Orientations To enhance the efficiency of the reference thermal solution, it is important for the designer to orient the fins properly with respect to the mean airflow direction. Simulation and experimental evidence have shown that the MCH heatsink thermal performance is enhanced when the fins are aligned with the mean airflow direction (Figure 11). Aligning the heatsink 45 degrees relative to the airflow is acceptable but delivers reduced thermal performance.
Reference Thermal Solutions R 6.3.2 Extruded Heatsink Profiles The reference thermal solution uses an extruded heatsink for cooling the E7500/E7501/E7505 chipset MCH components. Figure 12 shows the heatsink profile. This document does not provide tolerance information. Check with your heatsink supplier for specific tolerances. Appendix A lists suppliers for the extruded heatsink.
Reference Thermal Solutions R 6.3.3 Mechanical Interface Material Intel recommends the use of a mechanical interface material to avoid cracking of the exposed die under loading. The interface material reduces mechanical loads experienced by the die. The reference thermal solution uses a picture frame gasket of 0.813 mm (0.032 in.) thick Poron* foam. The foam gasket is a two-piece design with diagonal cuts at two corners as shown in Figure 14.
Reference Thermal Solutions R 6.3.6 Clip Retention Anchors For E7500/E7501/E7505 chipset-based platforms that have very limited board space, a clip retention anchor has been developed to minimize the impact of clip retention on the board. It is based on a standard three-pin jumper and is soldered to the board like any common through-hole header. A new anchor design is available with 45-degree bent leads to increase the anchor attach reliability over time.
Reference Thermal Solutions R Figure 16. Retention Mechanism Component Keep-Out Zones 0.070" Component Keepout 0.896 2x 0.060 0.120 0.345 0.225 0.100" Component Keepout (0.345) 0.170 1.156 See Detail A (0.165) 0.100 Detail A 0.165 0.083 2x 0.038 Plated Through Hole 0.173 0.345 0.200 0.100 2x 0.056 Component Keepout Trace Keepout 850_Keepout_Zone NOTES: 1. Dimensions are in inches. 2. Not to scale.
Reference Thermal Solutions R 6.4 Reliability Guidelines Each motherboard, heatsink and attach combination may vary the mechanical loading of the component. Based on the end user environment, the user should define the appropriate reliability test criteria and carefully evaluate the completed assembly prior to use in high volume. Some general recommendations are shown in Table 4. Table 4.
Appendix A: Thermal Solution Component Suppliers R Appendix A: Thermal Solution Component Suppliers Note: These vendors/devices are listed by Intel as a convenience to Intel's general customer base, but Intel does not make any representations or warranties whatsoever regarding quality, reliability, functionality, or compatibility of these devices. This list and/or these devices may be subject to change without notice. Table 5.
Appendix A: Thermal Solution Component Suppliers R Harry Lin 714-739-5797 hlinack@aol.com CCI/ACK Alternate Pin Fin Heatsink Kit Monica Chih 866-2-29952666x131 monica_chih@ccic.com.tw A13506-001 (43gm, 42 x 42 x 35 mm) Foxconn Bob Hall 503-693-3509x235 bhall@foxconn.com Table 7.
Appendix B: Mechanical Drawings R Appendix B: Mechanical Drawings This appendix contains the following drawings: • MCH Heatsink Assembly (See Figure 17) • MCH Heatsink Clip (See Figure 18) ® Intel E7500/E7501/E7505 Chipset MCH Thermal Design Guide 33
Appendix B: Mechanical Drawings R Figure 17.
Appendix B: Mechanical Drawings R Figure 18.
