Intel® Core™2 Duo Processor E8000∆ and E7000∆ Series, Intel® Pentium® Dual-Core Processor E6000∆ and E5000∆ Series, and Intel® Celeron® Processor E3x00∆ Series Thermal and Mechanical Design Guidelines August 2010 Document Number: 318734-015
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Contents 1 Introduction ..................................................................................................... 11 1.1 1.2 1.3 2 Processor Thermal/Mechanical Information .......................................................... 15 2.1 2.2 2.3 2.4 2.5 3 Mechanical Requirements........................................................................ 15 2.1.1 Processor Package .................................................................... 15 2.1.2 Heatsink Attach ...................
.2.6 4.2.7 4.2.8 4.2.9 4.2.10 4.2.11 5 Balanced Technology Extended (BTX) Thermal/Mechanical Design Information ......... 41 5.1 5.2 5.3 5.4 5.5 5.6 6 6.3 6.4 6.5 6.6 6.7 ATX Reference Design Requirements ........................................................ 53 Validation Results for Reference Design .................................................... 55 6.2.1 Heatsink Performance ............................................................... 55 6.2.2 Acoustics .................................
7.3 7.4 Appendix A LGA775 Socket Heatsink Loading ........................................................................ 71 A.1 A.2 A.3 A.4 Appendix B B.3 Overview .............................................................................................. 77 Test Preparation .................................................................................... 77 B.2.1 Heatsink Preparation ................................................................. 77 B.2.2 Typical Test Equipment ..............
Figures Figure 2-1. Package IHS Load Areas ................................................................... 15 Figure 2-2. Processor Case Temperature Measurement Location ............................. 19 Figure 2-3. Example Thermal Profile.................................................................... 20 Figure 3-1. Processor Thermal Characterization Parameter Relationships ................. 28 Figure 3-2. Locations for Measuring Local Ambient Temperature, Active ATX Heatsink31 Figure 3-3.
Figure 7-27. Solder Station Setup ....................................................................... 98 Figure 7-28. View Through Lens at Solder Station ................................................. 99 Figure 7-29. Moving Solder back onto Thermocouple Bead ..................................... 99 Figure 7-30. Removing Excess Solder ................................................................ 100 Figure 7-31. Thermocouple placed into groove ...................................................
Tables Table 2–1. Heatsink Inlet Temperature of Intel Reference Thermal Solutions ........... 24 Table 2–2. Heatsink Inlet Temperature of Intel Boxed Processor Thermal Solutions .. 24 Table 5–1. Balanced Technology Extended (BTX) Type II Reference TMA Performance41 Table 5–2. Acoustic Targets ............................................................................... 42 Table 5–3. VR Airflow Requirements.................................................................... 44 Table 5–4.
Revision History Revision Number Description Revision 001 • Initial release.
Thermal and Mechanical Design Guidelines
Introduction 1 Introduction 1.1 Document Goals and Scope 1.1.1 Importance of Thermal Management The objective of thermal management is to ensure that the temperatures of all components in a system are maintained within their functional temperature range. Within this temperature range, a component is expected to meet its specified performance. Operation outside the functional temperature range can degrade system performance, cause logic errors or cause component and/or system damage.
Introduction 1.1.
Introduction 1.2 References Material and concepts available in the following documents may be beneficial when reading this document. Material and concepts available in the following documents may be beneficial when reading this document. Document 1.3 Location Intel® Core™2 Duo Processor E8000 and E7000 Series Datasheet www.intel.com/design/processor/d atashts/318732.htm Intel® Pentium® Dual-Core Processor E6000 and E5000 Series Datasheet http://download.intel.com/design/ processor/datashts/320467.
Introduction Term Description ΨCS Case-to-sink thermal characterization parameter. A measure of thermal interface material performance using total package power. This is defined as: (TC – TS) / Total Package Power. Note: Heat source must be specified for Ψ measurements. ΨSa Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal performance using total package power. This is defined as: (TS – TA) / Total Package Power. Note: Heat source must be specified for Ψ measurements.
Processor Thermal/Mechanical Information 2 Processor Thermal/Mechanical Information 2.1 Mechanical Requirements 2.1.1 Processor Package The processors covered in the document are packaged in a 775-Land LGA package that interfaces with the motherboard using a LGA775 socket. Refer to the datasheet for detailed mechanical specifications. The processor connects to the motherboard through a land grid array (LGA) surface mount socket.
Processor Thermal/Mechanical Information The primary function of the IHS is to transfer the non-uniform heat distribution from the die to the top of the IHS, out of which the heat flux is more uniform and spread over a larger surface area (not the entire IHS area). This allows more efficient heat transfer out of the package to an attached cooling device. The top surface of the IHS is designed to be the interface for contacting a heatsink.
Processor Thermal/Mechanical Information 2.1.2 Heatsink Attach 2.1.2.1 General Guidelines There are no features on the LGA775 socket to directly attach a heatsink: a mechanism must be designed to attach the heatsink directly to the motherboard.
Processor Thermal/Mechanical Information 2.1.2.3 Additional Guidelines In addition to the general guidelines given above, the heatsink attach mechanism for the processor should be designed to the following guidelines: • Holds the heatsink in place under mechanical shock and vibration events and applies force to the heatsink base to maintain desired pressure on the thermal interface material.
Processor Thermal/Mechanical Information Figure 2-2. Processor Case Temperature Measurement Location 37.5 mm Measure TC at this point (geometric center of the package) 37.5 mm 2.2.2 Thermal Profile The Thermal Profile defines the maximum case temperature as a function of processor power dissipation. Refer to the datasheet for the further information. 2.2.
Processor Thermal/Mechanical Information The thermal profiles for the Intel Core™2 Duo processor E8000 series with 6 MB cache, Intel Core™2 Duo processor E7000 series with 3 MB cache, and Intel Pentium dual-core processor E6000 and E5000 series with 2 MB cache, and Intel Celeron processor E3x00 series with 1 MB cache are defined such that there is a single thermal solution for all of the 775_VR_CONFIG_06 processors.
Processor Thermal/Mechanical Information This is achieved in part by using the ΨCA versus RPM and RPM versus Acoustics (dBA) performance curves from the Intel enabled thermal solution. A thermal solution designed to meet the thermal profile would be expected to provide similar acoustic performance of different parts with potentially different TCONTROL values. The value for TCONTROL is calculated by the system BIOS based on values read from a factory configured processor register.
Processor Thermal/Mechanical Information required to meet a required performance. As the heatsink fin density (the number of fins in a given cross-section) increases, the resistance to the airflow increases: it is more likely that the air travels around the heatsink instead of through it, unless air bypass is carefully managed. Using air-ducting techniques to manage bypass area can be an effective method for controlling airflow through the heatsink. 2.3.
Processor Thermal/Mechanical Information The recommended maximum heatsink mass for the ATX thermal solution is 550g. This mass includes the fan and the heatsink only. The attach mechanism (clip, fasteners, and so forth) are not included. The mass limit for BTX heatsinks that use Intel reference design structural ingredients is 900 grams. The BTX structural reference component strategy and design is reviewed in depth in the latest version of the Balanced Technology Extended (BTX) System Design Guide.
Processor Thermal/Mechanical Information 2.4 System Thermal Solution Considerations 2.4.1 Chassis Thermal Design Capabilities The Intel reference thermal solutions and Intel Boxed Processor thermal solutions assume that the chassis delivers a maximum TA at the inlet of the processor fan heatsink. The following tables show the TA requirements for the reference solutions and Intel Boxed Processor thermal solutions. Table 2–1.
Processor Thermal/Mechanical Information In addition to passive heatsinks, fan heatsinks and system fans are other solutions that exist for cooling integrated circuit devices. For example, ducted blowers, heat pipes, and liquid cooling are all capable of dissipating additional heat. Due to their varying attributes, each of these solutions may be appropriate for a particular system implementation.
Processor Thermal/Mechanical Information 26 Thermal and Mechanical Design Guidelines
Thermal Metrology 3 Thermal Metrology This section discusses guidelines for testing thermal solutions, including measuring processor temperatures. In all cases, the thermal engineer must measure power dissipation and temperature to validate a thermal solution. To define the performance of a thermal solution the “thermal characterization parameter”, Ψ (“psi”) will be used. 3.
Thermal Metrology ΨSA is a measure of the thermal characterization parameter from the bottom of the heatsink to the local ambient air. ΨSA is dependent on the heatsink material, thermal conductivity, and geometry. It is also strongly dependent on the air velocity through the fins of the heatsink. Figure 3-1 illustrates the combination of the different thermal characterization parameters. Figure 3-1.
Thermal Metrology Assume the TDP, as listed in the datasheet, is 100 W and the maximum case temperature from the thermal profile for 100 W is 67° C. Assume as well that the system airflow has been designed such that the local ambient temperature is 38° C. Then, the following could be calculated using equation 1 from above: ΨCA = (TC, − TA) / TDP = (67 – 38) / 100 = 0.
Thermal Metrology For active heatsinks, it is important to avoid taking measurement in the dead flow zone that usually develops above the fan hub and hub spokes. Measurements should be taken at four different locations uniformly placed at the center of the annulus formed by the fan hub and the fan housing to evaluate the uniformity of the air temperature at the fan inlet. The thermocouples should be placed approximately 3 mm to 8 mm [0.1 to 0.
Thermal Metrology Figure 3-2. Locations for Measuring Local Ambient Temperature, Active ATX Heatsink Note: Drawing Not to Scale Figure 3-3.
Thermal Metrology 3.4 Processor Case Temperature Measurement Guidelines To ensure functionality and reliability, the processor is specified for proper operation when TC is maintained at or below the thermal profile as listed in the datasheet. The measurement location for TC is the geometric center of the IHS. Figure 2-2 shows the location for TC measurement. Special care is required when measuring TC to ensure an accurate temperature measurement. Thermocouples are often used to measure TC.
Thermal Management Logic and Thermal Monitor Feature 4 Thermal Management Logic and Thermal Monitor Feature 4.1 Processor Power Dissipation An increase in processor operating frequency not only increases system performance, but also increases the processor power dissipation.
Thermal Management Logic and Thermal Monitor Feature 4.2.1 PROCHOT# Signal The primary function of the PROCHOT# signal is to provide an external indication that the processor has reached the TCC activation temperature. While PROCHOT# is asserted, the TCC will be activated. Assertion of the PROCHOT# signal is independent of any register settings within the processor. It is asserted any time the processor die temperature reaches the trip point.
Thermal Management Logic and Thermal Monitor Feature Figure 4-1. Thermal Monitor Control PROCHOT# Normal clock Internal clock Duty cycle control Resultant internal clock 4.2.3 Thermal Monitor 2 The second method of power reduction is TM2. TM2 provides an efficient means of reducing the power consumption within the processor and limiting the processor temperature. When TM2 is enabled, and a high temperature situation is detected, the enhanced TCC will be activated.
Thermal Management Logic and Thermal Monitor Feature Once the processor has sufficiently cooled, and a minimum activation time has expired, the operating frequency and voltage transition back to the normal system operating point. Transition of the VID code will occur first, in order to insure proper operation once the processor reaches its normal operating frequency. Refer to Figure 4-2 for an illustration of this ordering. Figure 4-2.
Thermal Management Logic and Thermal Monitor Feature Regardless of the configuration selected, PROCHOT# will always indicate the thermal status of the processor. The power reduction mechanism of thermal monitor can also be activated manually using an “on-demand” mode. Refer to Section 4.2.5 for details on this feature. 4.2.5 On-Demand Mode For testing purposes, the thermal control circuit may also be activated by setting bits in the ACPI MSRs.
Thermal Management Logic and Thermal Monitor Feature A system designed to meet the thermal profile specification published in the processor datasheet greatly reduces the probability of real applications causing the thermal control circuit to activate under normal operating conditions. Systems that do not meet these specifications could be subject to more frequent activation of the thermal control circuit depending upon ambient air temperature and application power profile.
Thermal Management Logic and Thermal Monitor Feature 4.2.10 Digital Thermal Sensor Multiple digital thermal sensors can be implemented within the package without adding a pair of signal pins per sensor as required with the thermal diode. The digital thermal sensor is easier to place in thermally sensitive locations of the processor than the thermal diode. This is achieved due to a smaller foot print and decreased sensitivity to noise.
Thermal Management Logic and Thermal Monitor Feature 4.2.11 Platform Environmental Control Interface (PECI) The PECI interface is a proprietary single wire bus between the processor and the chipset or other health monitoring device. At this time the digital thermal sensor is the only data being transmitted. For an overview of the PECI interface, see PECI Feature Set Overview. For additional information on the PECI, see the datasheet. The PECI bus is available on pin G5 of the LGA 775 socket.
Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 5 Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 5.1 Overview of the BTX Reference Design The reference thermal module assembly is a Type II BTX compliant design and is compliant with the reference BTX motherboard keep-out and height recommendations defined in Section 6.6. The solution comes as an integrated assembly. An isometric view of the assembly is provided in Figure 5-4. 5.1.
Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 5.1.2 Acoustics To optimize acoustic emission by the fan heatsink assembly, the Type II reference design implements a variable speed fan. A variable speed fan allows higher thermal performance at higher fan inlet temperatures (TA) and the appropriate thermal performance with improved acoustics at lower fan inlet temperatures. Using the example in Table 5–2 for the Intel Core™2 Duo processor with 4 MB cache at TC-MAX of 60.
Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 5.1.3 Effective Fan Curve The TMA must fulfill the processor cooling requirements shown in Table 5–1 when it is installed in a functional BTX system. When installed in a system, the TMA must operate against the backpressure created by the chassis impedance (due to vents, bezel, peripherals, and so forth) and will operate at lower net airflow than if it were tested outside of the system on a bench top or open air environment.
Balanced Technology Extended (BTX) Thermal/Mechanical Design Information Figure 5-1. Effective TMA Fan Curves with Reference Extrusion 0.400 Reference TMA @ 5300 RPM 0.350 Reference TMA @ 2500 RPM dP (in. H2O) 0.300 Reference TMA @ 1200 RPM 0.250 0.200 0.150 0.100 0.050 0.000 0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 Airflow (cfm ) 5.1.4 Voltage Regulator Thermal Management The BTX TMA is integral to the cooling of the processor voltage regulator (VR).
Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 5.1.5 Altitude The reference TMA will be evaluated at sea level. However, many companies design products that must function reliably at high altitude, typically 1,500 m [5,000 ft] or more. Air-cooled temperature calculations and measurements at sea level must be adjusted to take into account altitude effects like variation in air density and overall heat capacity.
Balanced Technology Extended (BTX) Thermal/Mechanical Design Information Figure 5-2. Random Vibration PSD Vibration System Level 0.1 + 3 dB Control Limit g2/Hz 0.01 - 3 dB Control Limit 0.001 0.0001 1 10 100 1000 Hz 5.2.1.2 Shock Test Procedure Recommended performance requirement for a system: • Quantity: 2 drops for + and - directions in each of 3 perpendicular axes (that is, total 12 drops). • Profile: 25 G trapezoidal waveform 225 in/sec minimum velocity change.
Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 5.2.1.2.1 Recommended Test Sequence Each test sequence should start with components (that is, motherboard, heatsink assembly, and so forth) that have never been previously submitted to any reliability testing. The test sequence should always start with a visual inspection after assembly, and BIOS/CPU/Memory test (refer to Section 6.3.3).
Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 5.2.3 Recommended BIOS/CPU/Memory Test Procedures This test is to ensure proper operation of the product before and after environmental stresses, with the thermal mechanical enabling components assembled. The test shall be conducted on a fully operational motherboard that has not been exposed to any battery of tests prior to the test being considered.
Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 5.4 Safety Requirements Heatsink and attachment assemblies shall be consistent with the manufacture of units that meet the safety standards: 5.5 • UL Recognition-approved for flammability at the system level. All mechanical and thermal enabling components must be a minimum UL94V-2 approved. • CSA Certification. All mechanical and thermal enabling components must have CSA certification.
Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 5.6 Preload and TMA Stiffness 5.6.1 Structural Design Strategy Structural design strategy for the Intel Type II TMA is to minimize upward board deflection during shock to help protect the LGA775 socket. BTX thermal solutions use the SRM and TMA that together resists local board curvature under the socket and minimize, board deflection (Figure 5-5). In addition, a moderate preload provides initial downward deflection. Figure 5-5.
Balanced Technology Extended (BTX) Thermal/Mechanical Design Information Table 5–4. Processor Preload Limits Parameter Processor Preload Minimum Required Maximum Allowed Notes 98 N [22 lbf] 222 N [50 lbf] 1 NOTES: 1. These values represent upper and lower bounds for the processor preload. The nominal preload design point for the Thermal Module is based on a combination of requirements of the TIM, ease of assembly and the Thermal Module effective stiffness. Figure 5-6.
Balanced Technology Extended (BTX) Thermal/Mechanical Design Information mounting hole position for TMA attach, the required preload is approximately 10–15N greater than the values stipulated in Figure 5-6; however, Intel has not conducted any validation testing with this TMA mounting scheme. Figure 5-7. Thermal Module Attach Pointes and Duct-to-SRM Interface Features NOTES: 1. For clarity the motherboard is not shown in this figure.
ATX Thermal/Mechanical Design Information 6 ATX Thermal/Mechanical Design Information 6.1 ATX Reference Design Requirements This chapter will document the requirements for an active air-cooled design, with a fan installed at the top of the heatsink. The thermal technology required for the processor.
ATX Thermal/Mechanical Design Information Figure 6-1. E18764-001 Reference Design – Exploded View Figure 6-2. Bottom View of Copper Core Applied by TC-1996 Grease The ATX motherboard keep-out and the height recommendations defined Section 6.6 remain the same for a thermal solution for the processor in the 775-Land LGA package.
ATX Thermal/Mechanical Design Information 6.2 Validation Results for Reference Design 6.2.1 Heatsink Performance Table 6–1 provides the E18764-001 heatsink performance for the processors of Intel Core™2 Duo processor E8000 series with 6 MB cache, Intel Core™2 Duo processor E7000 series with 3 MB cache, Intel Pentium dual-core processor E6000, E5000 series with 2 MB cache, and Intel® Celeron® processor E3x00 series with 1 MB cache. The results are based on the test procedure described in Section 6.2.4.
ATX Thermal/Mechanical Design Information 6.2.2 Acoustics To optimize acoustic emission by the fan heatsink assembly, the reference design implements a variable speed fan. A variable speed fan allows higher thermal performance at higher fan inlet temperatures (TA) and lower thermal performance with improved acoustics at lower fan inlet temperatures.
ATX Thermal/Mechanical Design Information 6.2.4 Heatsink Thermal Validation Intel recommends evaluation of the heatsink within the specific boundary conditions based on the methodology described Section 6.3 , and using a thermal test vehicle. Testing is done on bench top test boards at ambient lab temperature. In particular, for the reference heatsink, the Plexiglas* barrier is installed 81.28 mm [3.2 in] above the motherboard (refer to Sections 3.3 and 6.6).
ATX Thermal/Mechanical Design Information Figure 6-3. Random Vibration PSD 0.1 3.13GRMS (10 minutes per axis) PSD (g^2/Hz) (20, 0.02) (500, 0.02) (5, 0.01) 0.01 5 Hz 500 Hz 0.001 1 100 10 1000 Frequency (Hz) 6.3.1.2 Shock Test Procedure Recommended performance requirement for a motherboard: • Quantity: 3 drops for + and - directions in each of 3 perpendicular axes (that is, total 18 drops). • Profile: 50 G trapezoidal waveform, 170 in/sec minimum velocity change.
ATX Thermal/Mechanical Design Information 6.3.1.2.1 Recommended Test Sequence Each test sequence should start with components (that is, motherboard, heatsink assembly, and so forth) that have never been previously submitted to any reliability testing. The test sequence should always start with a visual inspection after assembly, and BIOS/CPU/Memory test (refer to Section 6.3.3). Prior to the mechanical shock & vibration test, the units under test should be preconditioned for 72 hours at 45 ºC.
ATX Thermal/Mechanical Design Information 6.3.3 Recommended BIOS/CPU/Memory Test Procedures This test is to ensure proper operation of the product before and after environmental stresses, with the thermal mechanical enabling components assembled. The test shall be conducted on a fully operational motherboard that has not been exposed to any battery of tests prior to the test being considered.
ATX Thermal/Mechanical Design Information 6.5 Safety Requirements Heatsink and attachment assemblies shall be consistent with the manufacture of units that meet the safety standards: 6.6 • UL Recognition-approved for flammability at the system level. All mechanical and thermal enabling components must be a minimum UL94V-2 approved. • CSA Certification. All mechanical and thermal enabling components must have CSA certification.
ATX Thermal/Mechanical Design Information 6.7 Reference Attach Mechanism 6.7.1 Structural Design Strategy Structural design strategy for the reference design is to minimize upward board deflection during shock to help protect the LGA775 socket. The reference design uses a high clip stiffness that resists local board curvature under the heatsink, and minimizes, in particular, upward board deflection (Figure 6-5). In addition, a moderate preload provides initial downward deflection. Figure 6-5.
ATX Thermal/Mechanical Design Information 6.7.2 Mechanical Interface to the Reference Attach Mechanism The attach mechanism component from the reference design can be used by other 3rd party cooling solutions. The attach mechanism consists of: • A metal attach clip that interfaces with the heatsink core, see Appendix G, Figure 7-48 and Figure 7-49 for the component drawings. • Four plastic fasteners, see Appendix G, Figure 7-50, Figure 7-51, Figure 7-52 and Figure 7-53 for the component drawings.
ATX Thermal/Mechanical Design Information Figure 6-7. Critical Parameters for Interfacing to Reference Clip Fan Fin Array Core See Detail A Clip Fin Array Clip 1.6 mm Core Detail A Figure 6-8. Critical Core Dimension Φ38.68 +/- 0.30 mm Φ36.14 +/- 0.10 mm Gap required to avoid core surface blemish during clip assembly. Recommend 0.3 mm min. 1.00 +/- 0.10 mm Core 1.00 mm min R 0.40 mm max R 0.40 mm max 2.596 +/- 0.
Intel® Quiet System Technology (Intel® QST) 7 Intel® Quiet System Technology (Intel® QST) In the Intel 965 Express Family Chipset a new control algorithm for fan speed control is being introduced. It is composed of an Intel Management Engine (ME) in the Graphics Memory Controller Hub (GMCH) which executes the Intel Quiet System Technology (Intel QST) algorithm and the ICH8 containing the sensor bus and fan control circuits.
Intel® Quiet System Technology (Intel® QST) Figure 7-1. Intel® QST Overview Intel® QST Temperature sensing and response Calculations Fan to sensor Relationship Fan Commands (PID) (Output Weighting Matrix) (PID) PECI / SST PWM Temperature Sensors Fans System Response 7.1.1 Output Weighting Matrix Intel QST provides an Output Weighting Matrix that provides a means for a single thermal sensor to affect the speed of multiple fans.
Intel® Quiet System Technology (Intel® QST) temperature to the target temperature. As a result of its operation, the PID control algorithm can enable an acoustic-friendly platform. Figure 7-2. PID Controller Fundamentals Integral (time averaged) Temperature Actual Temperature Limit Temperature + dPWM Derivative (Slope) Time RPM - dPWM Proportional Error Fan Speed For a PID algorithm to work limit temperatures are assigned for each temperature sensor.
Intel® Quiet System Technology (Intel® QST) 7.
Intel® Quiet System Technology (Intel® QST) Figure 7-4 shows the major connections for a typical implementation that can support processors with Digital thermal sensor or a thermal diode. In this configuration a SST Thermal Sensor has been added to read the on-die thermal diode that is in all of the processors in the 775-land LGA packages shipped before the Intel Core™2 Duo processor. With the proper configuration information, the ME can accommodate inputs from PECI or SST for the processor socket.
Intel® Quiet System Technology (Intel® QST) 7.3 Intel® QST Configuration and Tuning Initial configuration of the Intel QST is the responsibility of the board manufacturer. The SPI flash should be programmed with the hardware configuration of the motherboard and initial settings for fan control, fan monitoring, voltage and thermal monitoring. This initial data is generated using the Intel provided Configuration Tool.
LGA775 Socket Heatsink Loading Appendix A LGA775 Socket Heatsink Loading A.1 LGA775 Socket Heatsink Considerations Heatsink clip load is traditionally used for: • Mechanical performance in mechanical shock and vibration Refer to Section 6.7.
LGA775 Socket Heatsink Loading Simulation shows that the solder joint force (Faxial) is proportional to the board deflection measured along the socket diagonal. The matching of Faxial required to protect the LGA775 socket solder joint in temperature cycling is equivalent to matching a target MB deflection.
LGA775 Socket Heatsink Loading Figure 7-6. Board Deflection Definition d’1 d1 d2 d’2 A.3.2 Board Deflection Limits Deflection limits for the ATX/µATX form factor are: d_BOL – d_ref≥ 0.09 mm and d_EOL – d_ref ≥ 0.15 mm And d’_BOL – d’_ref≥ 0.09 mm and d_EOL’ – d_ref’ ≥ 0.15 mm NOTES: 1. The heatsink preload must remain within the static load limits defined in the processor datasheet at all times. 2. Board deflection should not exceed motherboard manufacturer specifications.
LGA775 Socket Heatsink Loading A.3.3 Board Deflection Metric Implementation Example This section is for illustration only, and relies on the following assumptions: • 72 mm x 72 mm hole pattern of the reference design • Board stiffness = 900 lb/in at BOL, with degradation that simulates board creep over time Though these values are representative, they may change with selected material and board manufacturing process. Check with your motherboard vendor. • Clip stiffness assumed constant – No creep.
LGA775 Socket Heatsink Loading Figure 7-7. Example—Defining Heatsink Preload Meeting Board Deflection Limit A.3.4 Additional Considerations Intel recommends to design to {d_BOL - d_ref = 0.15 mm} at BOL when EOL conditions are not known or difficult to assess The following information is given for illustration only. It is based on the reference keep-out, assuming there is no fixture that changes board stiffness: d_ref is expected to be 0.18 mm on average, and be as high as 0.
LGA775 Socket Heatsink Loading A.3.4.1 Motherboard Stiffening Considerations To protect LGA775 socket solder joint, designers need to drive their mechanical design to: • Allow downward board deflection to put the socket balls in a desirable force state to protect against fatigue failure of socket solder joint (refer to Sections A.3, A.3.1, and A.3.2. • Prevent board upward bending during mechanical shock event.
Heatsink Clip Load Metrology Appendix B Heatsink Clip Load Metrology B.1 Overview This appendix describes a procedure for measuring the load applied by the heatsink/clip/fastener assembly on a processor package. This procedure is recommended to verify the preload is within the design target range for a design, and in different situations. For example: • Heatsink preload for the LGA775 socket • Quantify preload degradation under bake conditions.
Heatsink Clip Load Metrology Remarks: Alternate Heatsink Sample Preparation As mentioned above, making sure that the load cells have minimum protrusion out of the heatsink base is paramount to meaningful results.
Heatsink Clip Load Metrology Figure 7-9. Load Cell Installation in Machined Heatsink Base Pocket – Side View Wax to maintain load cell in position during heatsink installation Height of pocket ~ height of selected load cell Load cell protrusion (Note: to be optimized depending on assembly stiffness) Figure 7-10.
Heatsink Clip Load Metrology B.2.2 Typical Test Equipment For the heatsink clip load measurement, use equivalent test equipment to the one listed in Table 7–2. Table 7–2. Typical Test Equipment Item Load cell Notes: 1, 5 Part Number (Model) Description Honeywell*-Sensotec* Model 13 subminiature load cells, compression only AL322BL Select a load range depending on load level being tested. www.sensotec.
Heatsink Clip Load Metrology B.3.1 Time-Zero, Room Temperature Preload Measurement 1. Pre-assemble mechanical components on the board as needed prior to mounting the motherboard on an appropriate support fixture that replicate the board attach to a target chassis • For example: standard ATX board should sit on ATX compliant stand-offs.
Heatsink Clip Load Metrology 82 Thermal and Mechanical Design Guidelines
Thermal Interface Management Appendix C Thermal Interface Management To optimize a heatsink design, it is important to understand the impact of factors related to the interface between the processor and the heatsink base. Specifically, the bond line thickness, interface material area, and interface material thermal conductivity should be managed to realize the most effective thermal solution. C.
Thermal Interface Management § 84 Thermal and Mechanical Design Guidelines
Case Temperature Reference Metrology Appendix D Case Temperature Reference Metrology D.1 Objective and Scope This appendix defines a reference procedure for attaching a thermocouple to the IHS of a 775-land LGA package for TC measurement. This procedure takes into account the specific features of the 775-land LGA package and of the LGA775 socket for which it is intended. The recommended equipment for the reference thermocouple installation, including tools and part numbers are also provided.
Case Temperature Reference Metrology Item Description Part Number Miscellaneous Hardware Solder Indium Corp. of America Alloy 57BI / 42SN / 1AG 0.010 Diameter 52124 Flux Indium Corp.
Case Temperature Reference Metrology D.3 Thermal Calibration and Controls It is recommended that full and routine calibration of temperature measurement equipment be performed before attempting to perform temperature case measurement. Intel recommends checking the meter probe set against known standards. This should be done at 0º C (using ice bath or other stable temperature source) and at an elevated temperature, around 80º C (using an appropriate temperature source).
Case Temperature Reference Metrology Figure 7-12.
Case Temperature Reference Metrology Figure 7-13.
Case Temperature Reference Metrology The orientation of the groove at 6 o’clock exit relative to the package pin 1 indicator (gold triangle in one corner of the package) is shown in Figure 7-14 for the 775-Land LGA package IHS. Figure 7-14. IHS Groove at 6 o’clock Exit on the 775-LAND LGA Package IHS Groove Pin1 indicator When the processor is installed in the LGA775 socket, the groove is parallel to the socket load lever, and is toward the IHS notch as shown Figure 7-15. Figure 7-15.
Case Temperature Reference Metrology D.5 Thermocouple Attach Procedure The procedure to attach a thermocouple with solder takes about 15 minutes to complete. Before proceeding turn on the solder block heater, as it can take up to 30 minutes to reach the target temperature of 153 – 155° C. Note: To avoid damage to the processor ensure the IHS temperature does not exceed 155° C. As a complement to the written procedure a video Thermocouple Attach Using Solder – Video CD-ROM is available. D.5.
Case Temperature Reference Metrology 5. Using the microscope and tweezers, bend the tip of the thermocouple at approximately 10 degree angle by about 0.8 mm [.030 inch] from the tip (Figure 7-17). Figure 7-17. Bending the Tip of the Thermocouple D.5.2 Thermocouple Attachment to the IHS 6. Clean groove and IHS with Isopropyl Alcohol (IPA) and a lint free cloth removing all residues prior to thermocouple attachment. 7.
Case Temperature Reference Metrology 9. Lift the wire at the middle of groove with tweezers and bend the front of wire to place the thermocouple in the groove ensuring the tip is in contact with the end and bottom of the groove in the IHS (Figure 7-19-A and B). Figure 7-19. Thermocouple Bead Placement (A) (B) 10. Place the package under the microscope to continue with process.
Case Temperature Reference Metrology 11. While still at the microscope, press the wire down about 6mm [0.125”] from the thermocouple bead using the tweezers or your finger. Place a piece of Kapton* tape to hold the wire inside the groove (Figure 7-20). Refer to Figure 7-21 for detailed bead placement. Figure 7-20. Position Bead on the Groove Step Wire section into the groove to prepare for final bead placement Kapton* tape Figure 7-21.
Case Temperature Reference Metrology Figure 7-22. Third Tape Installation 12. Place a 3rd piece of tape at the end of the step in the groove as shown in Figure 7-22. This tape will create a solder dam to prevent solder from flowing into the larger IHS groove section during the melting process. 13. Measure resistance from thermocouple end wires (hold both wires to a DMM probe) to the IHS surface. This should be the same value as measured during the thermocouple conditioning Section D.5.1.
Case Temperature Reference Metrology 14. Using a fine point device, place a small amount of flux on the thermocouple bead. Be careful not to move the thermocouple bead during this step (Figure 7-24). Ensure the flux remains in the bead area only. Figure 7-24. Applying Flux to the Thermocouple Bead 15. Cut two small pieces of solder 1/16 inch (0.065 inch / 1.5 mm) from the roll using tweezers to hold the solder while cutting with a fine blade (Figure 7-25). Figure 7-25.
Case Temperature Reference Metrology 16. Place the two pieces of solder in parallel, directly over the thermocouple bead (Figure 7-26). Figure 7-26. Positioning Solder on IHS 17. Measure the resistance from the thermocouple end wires again using the DMM (refer to Section D.5.1.step 2) to ensure the bead is still properly contacting the IHS. D.5.3 Solder Process 18. Make sure the thermocouple that monitors the Solder Block temperature is positioned on the Heater block.
Case Temperature Reference Metrology Figure 7-27. Solder Station Setup 21. Remove the land side protective cover and place the device to be soldered in the solder station. Make sure the thermocouple wire for the device being soldered is exiting the heater toward you. Note: Do not touch the copper heater block at any time as this is very hot. 22. Move a magnified lens light close to the device in the solder status to get a better view when the solder begins to melt. 23. Lower the Heater block onto the IHS.
Case Temperature Reference Metrology 24. You may need to move the solder back toward the groove as the IHS begins to heat. Use a fine tip tweezers to push the solder into the end of the groove until a solder ball is built up (Figure 7-28 and Figure 7-29). Figure 7-28. View Through Lens at Solder Station Figure 7-29.
Case Temperature Reference Metrology 25. Lift the heater block and magnified lens, using tweezers quickly rotate the device 90 degrees clockwise. Using the back of the tweezers press down on the solder this will force out the excess solder. Figure 7-30. Removing Excess Solder 26. Allow the device to cool down. Blowing compressed air on the device can accelerate the cooling time.
Case Temperature Reference Metrology Figure 7-31. Thermocouple placed into groove 29. Using a blade carefully shave the excess solder above the IHS surface. Only shave in one direction until solder is flush with the groove surface (Figure 7-32). Figure 7-32. Removing Excess Solder Note: Take usual precautions when using open blades 30. Clean the surface of the IHS with Alcohol and use compressed air to remove any remaining contaminants.
Case Temperature Reference Metrology 31. Fill the rest of the groove with Loctite* 498 Adhesive. Verify under the microscope that the thermocouple wire is below the surface along the entire length of the IHS groove (Figure 7-33). Figure 7-33. Filling Groove with Adhesive 32. To speed up the curing process apply Loctite* Accelerator on top of the Adhesive and let it set for a couple of minutes (Figure 7-34). Figure 7-34.
Case Temperature Reference Metrology Figure 7-35. Removing Excess Adhesive from IHS 33. Using a blade, carefully shave any adhesive that is above the IHS surface (Figure 7-35). The preferred method is to shave from the edge to the center of the IHS. Note: The adhesive shaving step should be performed while the adhesive is partially cured, but still soft. This will help to keep the adhesive surface flat and smooth with no pits or voids.
Case Temperature Reference Metrology D.6 Thermocouple Wire Management When installing the processor into the socket, the thermocouple wire should route under the socket lid, as Figure 7-37. This will keep the wire from getting damaged or pinched when removing and installing the heatsink. Note: When thermocouple wires are damaged, the resulting reading maybe wrong.
Balanced Technology Extended (BTX) System Thermal Considerations Appendix E Balanced Technology Extended (BTX) System Thermal Considerations There are anticipated system operating conditions in which the processor power may be low but other system component powers may be high. If the only Fan Speed Control (FSC) circuit input for the Thermal Module Assembly (TMA) fan is from the processor sensor then the fan speed and system airflow is likely to be too low in this operating state.
Balanced Technology Extended (BTX) System Thermal Considerations The thermal sensor location and elevation are reflected in the Flotherm thermal model airflow illustration and pictures (see Figure 7-38 and Figure 7-39).The Intel Boxed Boards in the BTX form factor have implemented a System Monitor thermal sensor. The following thermal sensor or its equivalent can be used for this function: Part Number: 68801-0170 Molex Incorporated 2222 Wellington Ct.
Balanced Technology Extended (BTX) System Thermal Considerations Figure 7-39.
Balanced Technology Extended (BTX) System Thermal Considerations 108 Thermal and Mechanical Design Guidelines
Fan Performance for Reference Design Appendix F Fan Performance for Reference Design The fan power requirements for proper operation are listed in Table 7–3. Table 7–3. Fan Electrical Performance Requirements Requirement Value Maximum Average fan current draw 1.5 A Fan start-up current draw 2.2 A Fan start-up current draw maximum duration 1.
Fan Performance for Reference Design 110 Thermal and Mechanical Design Guidelines
Mechanical Drawings Appendix G Mechanical Drawings The following table lists the mechanical drawings included in this appendix. These drawings refer to the reference thermal mechanical enabling components for the processor. Note: Intel reserves the right to make changes and modifications to the design as necessary.
Mechanical Drawings Figure 7-40. ATX/µATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components - Sheet 1 REVISION HISTORY ZONE ( 72.00 ) 45.26 47.50 36.78 40.00 23.47 27.81 0.00 2 7.30 5.90 27.00 23.47 47.50 45.26 44.00 40.00 36.78 36.49 ( 1.93 ) SOCKET BALL 1 ( 37.50 ) DATE APPROVED ( 1.09 ) D SOCKET BALLS ( 1.17 ) ( 16.965 ) 47.50 45.26 ( 0.965 ) ( 1.17 ) 39.01 36.78 31.96 31.51 28.00 C DESCRIPTION BOARD PRIMARY SIDE ( 95.00 ) D REV 36.
Mechanical Drawings Figure 7-41. ATX/µATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components - Sheet 2 8 7 THIS DRAWING CONTAINS INTEL CORPORAT MAY NOT BE DISCLOSED, REPRODUCED, DI 6 ION CONFIDENTIAL INFORMATION. IT IS SPLAYED OR MODIFIED, WITHOUT THE PRI DISCLOSED IN CONFIDENCE AND ITS CONT OR WRITTEN CONSENT OF INTEL CORPORAT 4 5 3 DWG. NO C40819 SHT. 2 REV 1 3 ENTS ION. BOARD SECONDARY SIDE D 4X 6.00 4X D 10.
Mechanical Drawings Figure 7-42. ATX/µATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components - Sheet 3 8 7 THIS DRAWING CONTAINS INTEL CORPORAT MAY NOT BE DISCLOSED, REPRODUCED, DI 6 ION CONFIDENTIAL INFORMATION. IT IS SPLAYED OR MODIFIED, WITHOUT THE PRI 49.00 2X 45 X 3.00 24.50 3 DWG. NO ENTS ION. C40819 SHT. 3 REV 1 3 ( 37.60 ) SOCKET & PROCESSOR VOLUMETRIC KEEP-IN 14.60 6.
Mechanical Drawings Figure 7-43.
Mechanical Drawings Figure 7-44.
Mechanical Drawings Figure 7-45.
Mechanical Drawings Figure 7-46.
Mechanical Drawings Figure 7-47.
Mechanical Drawings Figure 7-48. ATX Reference Clip – Sheet 1 8 7 6 5 4 3 2 DWG. NO C85609 SHT. 1 REV H B H 94.62 [ 3.725 ] REMOVE ALL BURRS OR SHARP EDGES AROUND PERIMETER OF PART. SHARPNESS OF EDGES SUBJECT TO HANDLING ARE REQUIRED TO MEET THE UL1439 TEST. 7 G G 4X 10 0.2 [ .394 .007 ] 0.5 [.019] A B 36.44 0.2 [ 1.435 .007 ] F 7 F SEE DETAIL A A A E E NOTES: D 94.62 [ 3.725 ] 1. THIS DRAWING TO BE USED IN CONJUNTION WITH SUPPLIED 3D DATABASE FILE.
Mechanical Drawings Figure 7-49. ATX Reference Clip - Sheet 2 8 7 6 5 4 3 2 DWG. NO C85609 SHT. 2 REV H 0 H 135 7.31 [ .288 ] G G 2X R0.5 [ .020 ] 1.65 [ .065 ] F 45 X 0.45 0.05 [ .018 .001 ] 1.06 [ .042 ] 5.3 [ .209 ] R0.3 TYP [ .012 ] 0.1 [.003] 0.2 [.007] BOUNDARY 7 7.35 [ .289 ] D F SECTION D-D SCALE 8 2X R3.6 [ .142 ] E 8 A B A B E DETAIL A SCALE 10 TYPICAL 4 PLACES W 0.4 [.015] 0.5 [.019] X 4X D A B A B 45 X 0.25 0.05 [ .010 .
Mechanical Drawings Figure 7-50.
Mechanical Drawings Figure 7-51.
Mechanical Drawings Figure 7-52.
Mechanical Drawings Figure 7-53.
Mechanical Drawings Figure 7-54.
Intel® Enabled Reference Solution Information Appendix H Intel® Enabled Reference Solution Information This appendix includes supplier information for Intel enabled vendors for E18764-001 reference design and BTX reference design. The reference component designs are available for adoption by suppliers and heatsink integrators pending completion of appropriate licensing contracts. For more information on licensing, contact the Intel representative mentioned in Table 7–4. Table 7–4.
Intel® Enabled Reference Solution Information Note: These vendors and devices are listed by Intel as a convenience to Intel's general customer base, but Intel does not make any representations or warranties whatsoever regarding quality, reliability, functionality, or compatibility of these devices. This list and/or these devices may be subject to change without notice. Table 7–6.
