Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide November 2007 Reference Number: 318465 Revision: 001
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Contents 1 Introduction .............................................................................................................. 7 1.1 Design Flow........................................................................................................ 8 1.2 Definition of Terms .............................................................................................. 8 1.3 Reference Documents ..........................................................................................
5-9 5-10 5-11 5-12 5-13 5-14 5-15 5-16 5-17 5-18 5-19 5-20 5-21 5-22 5-23 5-24 6-1 6-2 6-3 6-4 6-5 B-1 B-2 B-3 B-4 B-5 B-6 B-7 B-8 B-9 B-10 B-11 B-12 B-13 Detailed Thermocouple Bead Placement ................................................................25 Tapes Installation ..............................................................................................25 Placing Thermocouple Bead into the Bottom of the Groove ......................................26 Second Tape Installation...............
Revision History Document Number Revision Number 318465 001 Description • Initial release of the document.
Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
Introduction 1 Introduction As the complexity of computer systems increases, so do the power dissipation requirements. Care must be taken to ensure that the additional power is properly dissipated. Typical methods to improve heat dissipation include selective use of ducting, and/or passive heatsinks. The goals of this document are to: • Outline the thermal and mechanical operating limits and specifications for Intel® 3210 and 3200 Chipsets.
Introduction 1.1 Design Flow Figure 1-1. Thermal Design Process S te p 1 : T h e rm a l S im u la tio n y T h e rm a l M o d e l y T h e rm a l M o d e l U s e r's G u id e S te p 2 : H e a ts in k S e le c tio n y T h e rm a l R e fe re n c e y M e c h a n ic a l R e fe re n c e S te p 3 : T h e rm a l V a lid a tio n y T h e rm a l T e s tin g S o ftw a re y S o ftw a re U s e r's G u id e 001239 1.2 8 Definition of Terms FC-BGA Flip Chip Ball Grid Array.
Introduction upstream of airflow for a passive heatsink or at the fan inlet for an active heatsink. Case-to-ambient thermal solution characterization parameter (Psi). A measure of thermal solution performance using total package power. Defined as (TC - TLA)/Total Package Power. Heat source size should always be specified for Ψ measurements. ΨCA 1.
Introduction 10 Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
Packaging Technology 2 Packaging Technology The Intel® 3210 and 3200 Chipset consists of two individual components: the Memory Controller Hub (MCH) and the Intel® I/O Controller (Intel® ICH9). The Intel® 3210 and 3200 Chipset MCH component uses a 40 mm [1.57 in] x 40 mm [1.57 in] Flip Chip Ball Grid Array (FC-BGA) package with an integrated heat spreader (IHS) and 1300 solder balls. A mechanical drawing of the package is shown in Figure 2-1.
Packaging Technology Figure 2-3. MCH Package Dimensions (Bottom View) Notes: 1. All dimensions are in millimeters. 2. All dimensions and tolerances conform to ANSI Y14.5 - 1994.
Packaging Technology 2.1 Non-Critical to Function Solder Joints Figure 2-4. Non-Critical to Function Solder Joints Intel has defined selected solder joints of the MCH as non-critical to function (NCTF) when evaluating package solder joints post environmental testing. The MCH signals at NCTF locations are typically redundant ground or no-critical reserved, so the loss of the solder joint continuity at end of life conditions will not affect the overall product functionality.
Packaging Technology 2. This is the maximum force that can be applied by a heatsink retention clip. The clip must also provide the minimum specified load of 7.6 lbf on the package to ensure TIM performance assuming even distribution of the load. 3. These specifications are based on limited testing for design characterization. Loading limits are for the package only.
Thermal Specifications 3 Thermal Specifications 3.1 Thermal Design Power (TDP) Analysis indicates that real applications are unlikely to cause the MCH component to consume maximum power dissipation for sustained time periods. Therefore, in order to arrive at a more realistic power level for thermal design purposes, Intel characterizes power consumption based on known platform benchmark applications. The resulting power consumption is referred to as the Thermal Design Power (TDP).
Thermal Specifications 16 Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
Thermal Simulation 4 Thermal Simulation Intel provides thermal simulation models of the Intel® 3210 and 3200 Chipset and associated user's guides to aid system designers in simulating, analyzing, and optimizing their thermal solutions in an integrated, system-level environment. The models are for use with the commercially available Computational Fluid Dynamics (CFD)-based thermal analysis tool FLOTHERM* (version 5.1 or higher) by Flomerics, Inc.
Thermal Simulation 18 Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
Thermal Metrology 5 Thermal Metrology The system designer must make temperature measurements to accurately determine the thermal performance of the system. Intel has established guidelines for proper techniques to measure the MCH IHS temperatures. Section 5.1 provides guidelines on how to accurately measure the MCH case temperature. 5.1 MCH Case Measurement Intel® 3210 and 3200 Chipset cooling performance is determined by measuring the case temperature using a thermocouple.
Thermal Metrology Table 5-1. Thermocouple Attach Support Equipment (Sheet 2 of 2) Item Description Part Number Calibration and Control Ice Point Cell Omega, stable 0°C temperature source for calibration and offset TRCIII Hot Point Celll Omega, temperature source to control and understand meter slope gain CL950-A-110 Notes: 1. The Special Modified Tip Solder Block Fixture is available from Test Equipment Depot 800-517-8431. 2. The Alloy 57BI/42SN/1AG 0.
Thermal Metrology Figure 5-2. FCBGA7 Chipset Package Reference Groove Drawing The orientation of the groove relative to the package pin 1 indicator (gold triangle in one corner of the package) is shown in Figure 5-3 for the FCBGA7 chipset package IHS. Figure 5-3.
Thermal Metrology Select a machine shop that is capable of holding drawing-specified tolerances. IHS groove geometry is critical for repeatable placement of the thermocouple bead, ensuring precise thermal measurements. A fixture plate should be used to machine the IHS groove on the FCBGA7 Chipset Package on the Live Board. Refer to Figure 5-4. Figure 5-4. The Live Board on the Fixture Plate 5.1.
Thermal Metrology Figure 5-5. Inspection of Insulation on Thermocouple 3. Measure the thermocouple resistance by holding both contacts on the connector on one probe and the tip of thermocouple to the other probe of the DMM (measurement should be about ~3.0 ohms for 36-gauge type T thermocouple). 4. Straighten the wire for about 38 mm [1.5 inch] from the bead. 5. Using the microscope and tweezers, bend the tip of the thermocouple at approximately 10 degree angle by about 0.8 mm [.030 inch] from the tip.
Thermal Metrology Figure 5-7. Extending Slightly the Exposed Wire over the End of Groove 8. Bend the wire at the edge of the IHS groove and secure it in place using Kapton* tape. Refer to Figure 5-8. Figure 5-8. Securing Thermocouple Wire with Kapton* Tape Prior to Attach 9. Verify under the microscope that the Thermocouple bead is still slightly bent, if not, use a fine point tweezers to put a slight bend on the tip.
Thermal Metrology Figure 5-9. Detailed Thermocouple Bead Placement 10. Place the device under the microscope to continue with the process. 11. Using tweezers or a finger, slightly press the wire down inside the groove for about 5 mm from tip and place small piece of Kapton* tape to hold the wire inside the groove. Refer to Figure 5-10. Figure 5-10. Tapes Installation 12.
Thermal Metrology Figure 5-11. Placing Thermocouple Bead into the Bottom of the Groove 13. Place a second small piece of Kapton* tape on top of the IHS where it narrows at the tip. This tape will create a solder dam and keep solder from flowing down the IHS groove during the melting process. Refer to Figure 5-12. Figure 5-12. Second Tape Installation 14.
Thermal Metrology Figure 5-13. Measuring Resistance between Thermocouple and IHS 15. Using a fine-point device such as a toothpick, place a small amount of Indium paste flux on the Thermocouple bead. Refer to Figure 5-14. Figure 5-14. Adding a Small Amount of Past Flux to the Bead for Soldering Note: Make sure you are careful to keep solder flux from spreading on the IHS surface or down the groove. It should be contained to the bead area and only the tip (narrow section of the groove).
Thermal Metrology Figure 5-15. Cutting Solder 17. Place the two pieces of solder in parallel, directly over the thermocouple bead. Refer to Figure 5-16. Figure 5-16. Positioning Solder on IHS 18. Measure the resistance from the thermocouple end wires again using the DMM (Refer to Section 5.1.4.1 step 3) to ensure that the bead is still properly contacting the IHS. 5.1.4.3 Solder Process 19. Turn on the Solder Block station and heat it up to 170 °C±5 °C.
Thermal Metrology 20. Attach the tip of the thermocouple to the solder block (perform this before turning on the solder station switch) and connect to a Thermocouple meter to monitor the temperature of the block. Refer to Figure 5-17. 21. Connect (Thermocouple being installed) to a second thermocouple meter to monitor the IHS temperature and make sure this doesn’t exceed 155 °C at any time during the process. Refer to Figure 5-17. Figure 5-17.
Thermal Metrology Figure 5-18. Observing the Solder Melting Note: Do not touch the copper block at any time as it is hot. 23. Move a magnified lens light close to the device to get a better view when the solder starts melting. Manually assist this if necessary as the solder sometimes tends to move away from the end of the groove. Use fine tip tweezers to push solder into the end of groove until a solder ball is built up. Refer to Figure 5-19. Figure 5-19.
Thermal Metrology Note: The target IHS temperature during reflow is 150°C ±3°C. At no time should the IHS temperature exceed 155 °C during the solder process as damage to the device may occur. 24. Lift the solder block and magnified lens, quickly rotate the device 90 degrees clockwise and use the back side of the tweezers to press down on the solder. This will force out excess solder. Refer to Figure 5-20. Figure 5-20. Remove Excess Solder 25. Allow the device to cool down.
Thermal Metrology Figure 5-21. Thermocouple Placed into Groove 27. Using a blade, carefully shave the excess solder above the IHS surface. Only shave in one direction until solder is flush with the groove surface. Refer to Figure 5-22. Figure 5-22. Remove Excess Solder Notes: 1. Always insure tools are very sharp and free from any burrs that may scratch the IHS surface. It is a good practice to minimize any surface scratching or other damage during this process. 2.
Thermal Metrology Figure 5-23. Fill Groove with Adhesive 30. To speed up the curing process apply Loctite* Accelerator on top of the Adhesive and let it set for a couple of minutes. 31. Using a blade carefully shave any Loctite* left above the IHS surface; take into consideration instructions from step 27. Note: The adhesive shaving process should be performed when the glue is partially cured but still soft (about 1 hour after applying).
Thermal Metrology Figure 5-24.
Reference Thermal Solution 6 Reference Thermal Solution The design strategy of the reference thermal solution for the Intel® 3210 and 3200 Chipset uses backing plate stiffness/design to show significant improvement in MB strain and BGA forces. The thermal interface material and extrusion design requirements are being evaluated for changes necessary to meet the Intel® 3210 and 3200 Chipset thermal requirements.
Reference Thermal Solution Figure 6-1. Reference Heatsink Measured Thermal Performance vs. Approach Velocity 6.3 Mechanical Design Envelope While each design may have unique mechanical volume and height restrictions or implementation requirements, the height, width, and depth constrains typically placed on the Intel® 3210 and 3200 Chipset thermal solution are shown in Appendix B. The location of hole patens and keepout zones for the reference thermal solution are shown in Figure B-2 and Figure B-3. 6.
Reference Thermal Solution Figure 6-2. Design Concept for Reference Thermal Solution 6.4.1 Extruded Heatsink Profiles The reference thermal solution uses an extruded heatsink for cooling the chipset MCH. Figure 6-3 shows the heatsink profile. Other heatsinks with similar dimensions and increased thermal performance may be available. A full mechanical drawing of this heatsink is provided in Appendix B. Figure 6-3.
Reference Thermal Solution 6.4.2 Retention Mechanism Responding in Shock and Vibration The lead-free process, large package and Integrated Heat Spreader (IHS) application on the Intel® 3210 and 3200 Chipset changed the mechanical responses during shock and vibration comparing with the legacy generation MCH chipset. The Intel reference thermal solution uses a back plate design that adequately protects the Solder Ball Joint Reliability (SBJR) of the Intel® 3210 and 3200 Chipset.
Reference Thermal Solution 6.4.4 Reference Thermal Solution Assembly Process 1. Snap the preload clip spring onto the bracket. Assemble the bracket with heatsink, as shown in Figure 6-4. Figure 6-4. Reference Thermal Solution Assembly Process - Heatsink Sub-Assembly (Step 1) 2. Populate the backplate to the motherboard and align the nuts with the studs on the backplate, as shown in Figure 6-5.
Reference Thermal Solution Figure 6-5. Reference Thermal Solution Assembly Process - Heatsink Assembly (Step 2) 3. To assemble the heatsink with the backplate, screw in the nuts with 8 in-lb. 6.5 Reliability Guidelines The environmental reliability requirements for the reference thermal solution are shown in Table 6-2. These should be considered as general guidelines. Each motherboard, heatsink and attach combination may vary the mechanical loading of the component.
Reference Thermal Solution Table 6-2. Reference Thermal Solution Environmental Reliability Guidelines Test (1) Requirement Pass/Fail Criteria (2) Mechanical Shock 3 drops for + and – directions in each of 3 perpendicular axes Profile: 50 G, Trapezoidal waveform, 4.3 m/s [170 in/s] minimum velocity change Visual Check and Electrical Functional Test Random Vibration Duration: 10 min/axis, 3 axes Frequency Range: 5 Hz to 500 Hz Power Spectral Density (PSD) Profile: 3.
Reference Thermal Solution 42 Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
Thermal Solution Component Suppliers A Thermal Solution Component Suppliers A.1 Heatsink Thermal Solution Part Intel Part Number Quantity Contact Information Heatsink Assembly D96730-001 Heatsink D96729-001 1 Retainer D92698-001 1 Nuts-Inserts D92621-001 4 Bracket E11663-001 1 Stiffener-backplate D94244-001 1 Monika Chih monika_chih@ccic.com.
Thermal Solution Component Suppliers 44 Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
Mechanical Drawings B Mechanical Drawings The following table lists the mechanical drawings available in this document.
Mechanical Drawings Figure B-1.
Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide A B C D 8 7 8 67 [ 2.638 ] 81 [ 3.189 ] 45.79 [ 1.803 ] 6 7 6 PRIMARY SIDE KEEPOUTS MAX 1.27 [.050] COMPONENT HEIGHT (NON-MCH COMPONENTS) 26.79 [ 1.055 ] 48 [ 1.890 ] 60.6 [ 2.386 ] NORTH 135 5 5 4 [ .1575 ] DETAIL A DISCLOSED IN CONFIDENCE AND ITS CONT ENTS OR WRITTEN CONSENT OF INTEL CORPORATION. COMPONENT CENTER 4 REV 1 *** TOP ITEM NO D94910 3 THIRD ANGLE PROJECTION SHT. 1 REV 1 10.5 [ .
A B C D 8 7 8 NO COMPONENTS THIS AREA 7 6 5 6 5 SECONDARY SIDE KEEPOUTS 19.05 [ .7500 ] 60.6 [ 2.3858 ] DISCLOSED IN CONFIDENCE AND ITS CONT ENTS OR WRITTEN CONSENT OF INTEL CORPORATION. 4 4 38.05 [ 1.4980 ] 81 [ 3.1890 ] COMPONENT CENTER 3 TMD DEPARTMENT 3 2 2200 MISSION COLLEGE BLVD. CORP. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 R DWG. NO SHT.
Mechanical Drawings Figure B-4.
Mechanical Drawings Figure B-5.
7 6 5 Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide A B C D E 8 9.651 B 7 6 43.7 0.25 5 5 0.451 0.15 5 Cpk TARGET = 1.0 ACCEPTABLE 0.05 A 5 1.9 8 3.8 0.1 5 3 - ZONE DESIGNED BY UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES K.CEURTER IN ACCORDANCE WITH ASME Y14.5M-1994 DRAWN BY DIMENSIONS ARE IN MILLIMETERS ALL UNTOLERANCED LINEAR K.CEURTER DIMENSIONS ± 0.3 CHECKED BY ANGLES ±1 2 1 DATE DWG.
A B C D E F G H 8 7 6 5 8 #36 DRILL ( 6-32 2.71 ) 7 UNC- 2B TAP 5 THRU -( 1 ) HOLE 6 B 5 SECTION 7 0.01 0.13 2.71 ( 62 ) 5 A B A B A-A 0.13 6 0.25 RECESS FOR #2 PHILLIPS DRIVER A NOTES: 1. USE PEM PART NUMBER = OR INTEL APPROVED ALTERNATE 2. DIMENSIONS ARE IN MILLIMETERS 3. MATERIAL: - LOW CARBON STEEL 4. FINISH: - ZINC PLUS CLEAR CHROMATE PER ASTM B633 COLORLESS 5 . CRITICAL TO FUNCTION 6.
Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide A B C D E F G H 8 7 6 5 7.438 22.2 II III 0.12 I II 47.6 I 0.1 III IV 0.1 47 A H C 0.1 23.5 2X 3 C 1.5 4X H 33 0.15 10.2 4X 0.1 6 A H 0.12 0.15 3.7 66 A H 6 A 2X 4 TYP 2 4X 10 8 7 6 5 6 CRITICAL TO FUNCTION DIMENSION 7. ALL DIMENSIONS SHOWN SHALL BE MEASURED FOR FAI 8. DEGATE: FLUSH TO 0.35 BELOW STRUCTURAL THICKNESS (GATE WELL OR GATE RECESS ACCEPTABLE) 9. FLASH: 0.15 MAX. 10. SINK: 0.25 MAX.
7 6 5 7 SECTION III-III SCALE 10 5 TYP 2.8 7.5 8 A A A B C D E 8 SECTION I-I SCALE 10 6 REV B TYP ( 2 ) 4 4 SECTION II-II SCALE 10 3 2 1.5 2 A SECTION IV-IV SCALE 10 2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 A DRAWING NUMBER DWG. NO E11663 E11663 2 REV REV 2 OF 2 SHT. 1 H 2 PST DEPARTMENT 1 R SIZE A1 SCALE: 3 DO NOT SCALE DRAWING SHEET 1 A B C D E F 0.07 3 F 2.55 4 G 2X 4.
7 6 5 Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide A B C D 8 4 3 7 ( 2.127 ) 4 D92624-001 PRODUCTION RELEASE BONE TRAIL,INSULATOR,BACK PLATE 1 DWG. NO REVISION HISTORY DESCRIPTION A INITIAL DV RELEASE REV R SHT. REV KJC KJC APPROVED 1 2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 06/20/07 03/09/07 DATE D94244 1 H 6 5 0.13 PLATE PUNCH/BURR DIRECTION 3 2 THIRD ANGLE PROJECTION PARTS LIST DATE 03/12/07 FINISH SEE NOTES K.
A B C D E F G H 8 7 6 5 8 TYP R2 66 7 TYP R1 6 5 59 47 21 0.25 29.5 B PUNCH C 40 39.75 79.5 4X A B C A B 0.125 0.25 +0.08 0 3.48 0.25 DISCLOSED IN CONFIDENCE AND ITS CONT ENTS OR WRITTEN CONSENT OF INTEL CORPORATION. NOTES: 1. DIMENSIONS ARE IN MILLIMETERS 2. BREAK ALL SHARP EDGES AND CORNERS, GRIND PUNCH MARKS FLAT, NO BURRS FROM 3. MATERIAL: AISI 1020 COLD ROLLED STEEL OR INTEL APPROVED EQUIVALENT CRITICAL MATERIAL PROPERTIES: MIN YEILD STRENGTH = 250 MPa 4.
Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide 7 6 5 8 7 6 4 21 40 80.5 TYP R2 0.25 B 4 0.2 4 0.127 THICK A C B A 4 3 - ZONE DESIGNED BY UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES K.CEURTER IN ACCORDANCE WITH ASME Y14.5M-1994 DRAWN BY DIMENSIONS ARE IN MILLIMETERS ALL UNTOLERANCED LINEAR K.CEURTER DIMENSIONS ± 0.3 CHECKED BY ANGLES ±1 2 1 DATE DWG. NO REVISION HISTORY DESCRIPTION DEPARTMENT PRODUCTION RELEASE A INITIAL DV RELEASE REV R SHT.
A B C D E F G H 8 7 6 5 8 7 ( 2.2 ) NOMINAL BACK PLATE + INSULATOR THICKNESS ( 1.58 ) NOMINAL DT PCB THICKNESS 2.2 A 6 5 A B 0.08 0.05 3.51 B 0.25 ( 4) ( 5.8 ) 6 ( 3.78 ) REFERENCE FOR LOWEST THREADED AREA ( 4.745 ) UNC #6-32 THREADED SECTIONS (THREADS SHOWN FOR REFERENCE ONLY) 1 "DOG POINT" TO ASSIST BLING ASSEMBLY 6 . FEATURE DETAIL PER VENDOR SPECIFICATION - FLUSH MOUNT HEAD - PUSHOUT FORCE > 250LBS - TORQUE OUT FORCE > 18 IN-LBS - SHEET METAL HOLE SIZE = 4 +0.
