Intel® Core™2 Duo Desktop Processor, Intel® Pentium® Dual Core Processor, and Intel® Pentium® 4 Processor 6x1 Δ Sequence Thermal and Mechanical Design Guidelines – Supporting the Intel® Core™2 Duo desktop processor E6000 Δ and E4000 Δ sequences, Intel® Pentium® Dual Core Processor E2000 Δ sequence, and Intel® Pentium® 4 processor 6x1 sequence at 65 W June 2007 Document Number: 313685-004
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Contents 1 Introduction ...................................................................................................11 1.1 1.2 1.3 2 Processor Thermal/Mechanical Information .........................................................15 2.1 2.2 2.3 2.4 2.5 3 Mechanical Requirements ......................................................................15 2.1.1 Processor Package...................................................................15 2.1.2 Heatsink Attach .............................
.2.10 4.2.11 5 Intel® Enabled Balanced Technology Extended (BTX) Reference solution ................. 41 5.1 5.2 5.3 5.4 5.5 5.6 6 6.2 6.3 6.4 6.5 6.6 7.2 7.3 7.4 Intel® QST Algorithm ............................................................................65 7.1.1 Output Weighting Matrix ..........................................................66 7.1.2 Proportional-Integral-Derivative (PID) ........................................66 Board and System Implementation of Intel® QST ...............
A.2 A.3 Appendix B Heatsink Clip Load Metrology ............................................................................77 B.1 B.2 B.3 Appendix C Bond Line Management .........................................................................83 Interface Material Area..........................................................................83 Interface Material Performance...............................................................83 Case Temperature Reference Metrology...........................
Figures Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure 6 1. Package IHS Load Areas .....................................................................15 2.
Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure 52. 53. 54. 55. 56. 57. 58. 59. 60. 61. 62. 63. 64. 65. 66. 67. 68. 69. 70. Moving Solder back onto Thermocouple Bead .......................................99 Removing Excess Solder .................................................................
Tables Table 1. Heatsink Inlet Temperature of Intel® Reference Themal Solutions .............. 24 Table 2. Heatsink Inlet Temperature of Intel® Boxed Processor Themal Solutions .....24 Table 2. Balanced Technology Extended (BTX) Reference Heatsink Performance Targets for 775_VR_CONFIG_06 65 W Processors ....................................41 Table 4. Acoustic Targets .................................................................................42 Table 5. VR Airflow Requirements..........................
Revision History Revision Number Description Date -001 • Initial Release. -002 • Added specifications for Intel Pentium 4 processor 651 at 65 W July 2006 January 2007 ® • Added specifications for Intel Core™2 Duo Desktop Processor E4300 • Updated Table 5 and Table 9 -003 • Added specifications for Intel Core 2 Duo processors E6420, E6320, and E4400. April 2007 • Added specifications for Intel Pentium 4 processor 661, 641, and 631 at 65 W.
Thermal and Mechanical Design Guidelines
Introduction 1 Introduction 1.1 Document Goals and Scope 1.1.1 Importance of Thermal Management The objective of thermal management is to ensure that the temperatures of all components in a system are maintained within their functional temperature range. Within this temperature range, a component is expected to meet its specified performance. Operation outside the functional temperature range can degrade system performance, cause logic errors or cause component and/or system damage.
Introduction 1.1.3 Document Scope This design guide supports the following processors: • Intel® Core™2 Duo desktop processors E6700, E6600, E6420, E6400, E6320, and E6300.
Introduction 1.2 References Material and concepts available in the following documents may be beneficial when reading this document. Document Comment LGA775 Socket Mechanical Design Guide ® http://developer.intel.com/des ign/Pentium4/guides/302666. htm ® Intel Core™2 Extreme Processor X6800 and Intel Core™2 Duo Desktop Processor E6000 and E4000 Sequence Datasheet ® ® www.intel.com//design/proces sor/datashts/316981.htm Intel Pentium 4 Processor 6x1 Sequence Datasheet ® ® www.intel.
Introduction Term Description ΨCS Case-to-sink thermal characterization parameter. A measure of thermal interface material performance using total package power. Defined as (TC – TS) / Total Package Power. Note: Heat source must be specified for Ψ measurements. ΨSA Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal performance using total package power. Defined as (TS – TA) / Total Package Power. Note: Heat source must be specified for Ψ measurements.
Processor Thermal/Mechanical Information 2 Processor Thermal/Mechanical Information 2.1 Mechanical Requirements 2.1.1 Processor Package The processors covered in the document are packaged in a 775-Land LGA package that interfaces with the motherboard via a LGA775 socket. Refer to the datasheet for detailed mechanical specifications. The processor connects to the motherboard through a land grid array (LGA) surface mount socket.
Processor Thermal/Mechanical Information The primary function of the IHS is to transfer the non-uniform heat distribution from the die to the top of the IHS, out of which the heat flux is more uniform and spread over a larger surface area (not the entire IHS area). This allows more efficient heat transfer out of the package to an attached cooling device. The top surface of the IHS is designed to be the interface for contacting a heatsink.
Processor Thermal/Mechanical Information 2.1.2 Heatsink Attach 2.1.2.1 General Guidelines There are no features on the LGA775 socket to directly attach a heatsink: a mechanism must be designed to attach the heatsink directly to the motherboard.
Processor Thermal/Mechanical Information 2.1.2.3 Additional Guidelines In addition to the general guidelines given above, the heatsink attach mechanism for the processor should be designed to the following guidelines: • Holds the heatsink in place under mechanical shock and vibration events and applies force to the heatsink base to maintain desired pressure on the thermal interface material.
Processor Thermal/Mechanical Information Figure 2. Processor Case Temperature Measurement Location 37.5 mm Measure TC at this point (geometric center of the package) 37.5 mm 2.2.2 Thermal Profile The Thermal Profile defines the maximum case temperature as a function of processor power dissipation. The TDP and Maximum Case Temperature are defined as the maximum values of the thermal profile.
Processor Thermal/Mechanical Information Figure 3. Example Thermal Profile Case Temperature (°C) 70 60 50 Thermal Profile TDP 40 0 10 20 30 40 50 60 70 Power (W) 2.2.3 TCONTROL TCONTROL defines the maximum operating temperature for the digital thermal sensor when the thermal solution fan speed is being controlled by the digital thermal sensor. The TCONTROL parameter defines a very specific processor operating region where fan speed can be reduced.
Processor Thermal/Mechanical Information The value for TCONTROL is calculated by the system BIOS based on values read from a factory configured processor register. The result can be used to program a fan speed control component. See the appropriate processor datasheet for further details on reading the register and calculating TCONTROL. See Chapter 7, Intel® Quiet System Technology (Intel® QST), for details on implementing a design using TCONTROL and the Thermal Profile. 2.
Processor Thermal/Mechanical Information 2.3.1 Heatsink Size The size of the heatsink is dictated by height restrictions for installation in a system and by the real estate available on the motherboard and other considerations for component height and placement in the area potentially impacted by the processor heatsink. The height of the heatsink must comply with the requirements and recommendations published for the motherboard form factor of interest.
Processor Thermal/Mechanical Information reviewed in depth in the latest version of the Balanced Technology Extended (BTX) System Design Guide. Note: The 550g mass limit for ATX solutions is based on the capabilities of reference design components that retain the heatsink to the board and apply the necessary preload. Any reuse of the clip and fastener in derivative designs should not exceed 550g.
Processor Thermal/Mechanical Information 2.4 System Thermal Solution Considerations 2.4.1 Chassis Thermal Design Capabilities The Intel reference thermal solutions and Intel® Boxed Processor thermal solutions assume that the chassis delivers a maximum TA at the inlet of the processor fan heatsink (refer to Section 6.1.1). The tables below show the TA requirements for the reference solutions and Intel Boxed processor thermal solutions. Table 1.
Processor Thermal/Mechanical Information To develop a reliable, cost-effective thermal solution, thermal characterization and simulation should be carried out at the entire system level, accounting for the thermal requirements of each component. In addition, acoustic noise constraints may limit the size, number, placement, and types of fans that can be used in a particular design.
Processor Thermal/Mechanical Information 26 Thermal and Mechanical Design Guidelines
Thermal Metrology 3 Thermal Metrology This chapter discusses guidelines for testing thermal solutions, including measuring processor temperatures. In all cases, the thermal engineer must measure power dissipation and temperature to validate a thermal solution. To define the performance of a thermal solution the “thermal characterization parameter”, Ψ (“psi”) will be used. 3.
Thermal Metrology ΨCS is strongly dependent on the thermal conductivity and thickness of the TIM between the heatsink and IHS. ΨSA is a measure of the thermal characterization parameter from the bottom of the heatsink to the local ambient air. ΨSA is dependent on the heatsink material, thermal conductivity, and geometry. It is also strongly dependent on the air velocity through the fins of the heatsink. Figure 4 illustrates the combination of the different thermal characterization parameters. Figure 4.
Thermal Metrology Assume the TDP, as listed in the datasheet, is 100 W and the maximum case temperature from the thermal profile for 100W is 67 °C. Assume as well that the system airflow has been designed such that the local ambient temperature is 38 °C. Then the following could be calculated using equation 1 from above: ΨCA = (TC,– TA) / TDP = (67 – 38) / 100 = 0.
Thermal Metrology 3.3 Local Ambient Temperature Measurement Guidelines The local ambient temperature TA is the temperature of the ambient air surrounding the processor. For a passive heatsink, TA is defined as the heatsink approach air temperature; for an actively cooled heatsink, it is the temperature of inlet air to the active cooling fan. It is worthwhile to determine the local ambient temperature in the chassis around the processor to understand the effect it may have on the case temperature.
Thermal Metrology worst-case environment in these conditions, it is then necessary to disable the fan regulation and power the fan directly, based on guidance from the fan supplier. Figure 5.
Thermal Metrology Figure 6. Locations for Measuring Local Ambient Temperature, Passive Heatsink NOTE: 3.4 Drawing Not to Scale Processor Case Temperature Measurement Guidelines To ensure functionality and reliability, the processor is specified for proper operation when TC is maintained at or below the thermal profile as listed in the datasheet. The measurement location for TC is the geometric center of the IHS. Figure 2 shows the location for TC measurement.
Thermal Management Logic and Thermal Monitor Feature 4 Thermal Management Logic and Thermal Monitor Feature 4.1 Processor Power Dissipation An increase in processor operating frequency not only increases system performance, but also increases the processor power dissipation. The relationship between frequency and power is generalized in the following equation: P = CV2F (where P = power, C = capacitance, V = voltage, F = frequency).
Thermal Management Logic and Thermal Monitor Feature 4.2.1 Prochot# Signal The primary function of the PROCHOT# signal is to provide an external indication the processor has exceeded its maximum operating temperature. While PROCHOT# is asserted, the TCC will be active. Assertion of the PROCHOT# signal is independent of any register settings within the processor. It is asserted any time the processor die temperature reaches the trip point.
Thermal Management Logic and Thermal Monitor Feature Figure 7. Concept for Clocks under Thermal Monitor Control PROCHOT# Normal clock Internal clock Duty cycle control Resultant internal clock 4.2.3 Thermal Monitor 2 The processor supports an enhanced Thermal Control Circuit. In conjunction with the existing Thermal Monitor logic, this capability is known as Thermal Monitor 2.
Thermal Management Logic and Thermal Monitor Feature Once the processor has sufficiently cooled, and a minimum activation time has expired, the operating frequency and voltage transition back to the normal system operating point. Transition of the VID code will occur first, in order to insure proper operation once the processor reaches its normal operating frequency. Refer to Figure 8 for an illustration of this ordering. Figure 8.
Thermal Management Logic and Thermal Monitor Feature Regardless of the configuration selected, PROCHOT# will always indicate the thermal status of the processor. The power reduction mechanism of thermal monitor can also be activated manually using an “on-demand” mode. Refer to Section 4.2.5 for details on this feature. 4.2.5 On-Demand Mode For testing purposes, the thermal control circuit may also be activated by setting bits in the ACPI MSRs. The MSRs may be set based on a particular system event (e.g.
Thermal Management Logic and Thermal Monitor Feature A system designed to meet the thermal profile at TDP and TC-MAX values published in the processor datasheet greatly reduces the probability of real applications causing the thermal control circuit to activate under normal operating conditions. Systems that do not meet these specifications could be subject to more frequent activation of the thermal control circuit depending upon ambient air temperature and application power profile.
Thermal Management Logic and Thermal Monitor Feature 4.2.10 Digital Thermal Sensor The Intel® Core™2 Duo desktop processor E6000/E4000 sequence and Intel® Pentium® Dual Core processor E2000 sequence introduce the Digital Thermal Sensor (DTS) as the on-die sensor to use for fan speed control (FSC). The DTS will eventually replace the on-die thermal diode used in pervious products.
Thermal Management Logic and Thermal Monitor Feature sensitivity to noise. Since the DTS is factory set on a per-part basis there is no need for the health monitor components to be updated at each processor family. Note: Intel® Core™2 Duo processor E6000 and E4000 sequences and Intel® Pentium® Dual Core processor E2000 sequence do not have an on-die thermal diode. The TCONTROL in the MSR is relevant only to the DTS. 4.2.
Intel® Enabled Balanced Technology Extended (BTX) Reference solution 5 Intel® Enabled Balanced Technology Extended (BTX) Reference solution 5.1 Overview of the Balanced Technology Extended (BTX) Reference Design The reference thermal module assembly is a Type II BTX compliant design and is compliant with the reference BTX motherboard keep-out and height recommendations defined Section 6.5. The solution comes as an integrated assembly. An isometric view of the assembly is provided Figure 13. 5.1.
Intel® Enabled Balanced Technology Extended (BTX) Reference solution 5.1.2 Acoustics To optimize acoustic emission by the fan heatsink assembly, the reference design implements a variable speed fan. A variable speed fan allows higher thermal performance at higher fan inlet temperatures (TA) and the appropriate thermal performance with improved acoustics at lower fan inlet temperatures.
Intel® Enabled Balanced Technology Extended (BTX) Reference solution 3. 4. 5. Acoustics testing for Case 2 will be system level in the same a BTX S2 reference chassis and commercially available power supply. Acoustic data for Case 2 will be provided in the validation report but this condition is not a target for the design. The acoustic model is predicting that the power supply fan will be the acoustic limiter.
Intel® Enabled Balanced Technology Extended (BTX) Reference solution Figure 10. Effective TMA Fan Curves with Reference Extrusion 0.400 Reference TMA @ 5300 RPM 0.350 Reference TMA @ 2500 RPM dP (in. H2O) 0.300 Reference TMA @ 1200 RPM 0.250 0.200 0.150 0.100 0.050 0.000 0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 Airflow (cfm ) 5.1.4 Voltage Regulator Thermal Management The BTX TMA is integral to the cooling of the processor voltage regulator (VR).
Intel® Enabled Balanced Technology Extended (BTX) Reference solution 5.1.5 Altitude The reference TMA was evaluated at sea level. However, many companies design products that must function reliably at high altitude, typically 1,500 m [5,000 ft] or more. Air-cooled temperature calculations and measurements at sea level must be adjusted to take into account altitude effects like variation in air density and overall heat capacity.
Intel® Enabled Balanced Technology Extended (BTX) Reference solution 5.2 Environmental Reliability Testing 5.2.1 Structural Reliability Testing Structural reliability tests consist of unpackaged, system -level vibration and shock tests of a given thermal solution in the assembled state. The thermal solution should meet the specified thermal performance targets after these tests are conducted; however, the test conditions outlined here may differ from your own system requirements. 5.2.1.
Intel® Enabled Balanced Technology Extended (BTX) Reference solution Figure 12. Shock Acceleration Curve 5.2.1.2.1 Recommended Test Sequence Each test sequence should start with components (i.e. motherboard, heatsink assembly, etc.) that have never been previously submitted to any reliability testing. The test sequence should always start with a visual inspection after assembly, and BIOS/CPU/Memory test (refer to Section 6.2.3).
Intel® Enabled Balanced Technology Extended (BTX) Reference solution 5.2.2 Power Cycling Thermal performance degradation due to TIM degradation is evaluated using power cycling testing. The test is defined by 7500 cycles for the case temperature from room temperature (~23 ºC) to the maximum case temperature defined by the thermal profile at TDP. Thermal Test Vehicle is used for this test. 5.2.
Intel® Enabled Balanced Technology Extended (BTX) Reference solution 5.4 Safety Requirements Heatsink and attachment assemblies shall be consistent with the manufacture of units that meet the safety standards: • UL Recognition-approved for flammability at the system level. All mechanical and thermal enabling components must be a minimum UL94V-2 approved. • CSA Certification. All mechanical and thermal enabling components must have CSA certification.
Intel® Enabled Balanced Technology Extended (BTX) Reference solution 5.6 Preload and TMA Stiffness 5.6.1 Structural Design Strategy Structural design strategy for the Intel Type II TMA is to minimize upward board deflection during shock to help protect the LGA775 socket. BTX thermal solutions utilize the SRM and TMA that together resists local board curvature under the socket and minimize, board deflection (Figure 14). In addition, a moderate preload provides initial downward deflection. Figure 14.
Intel® Enabled Balanced Technology Extended (BTX) Reference solution Table 7. Processor Preload Limits Parameter Minimum Required Maximum Allowed Notes Processor Preload 98 N [22 lbf] 222 N [50 lbf] 1 NOTE: 1. These values represent upper and lower bounds for the processor preload. The nominal preload design point for the Thermal Module is based on a combination of requirements of the TIM, ease of assembly and the Thermal Module effective stiffness. Figure 15.
Intel® Enabled Balanced Technology Extended (BTX) Reference solution Figure 16. Thermal Module Attach Pointes and Duct-to-SRM Interface Features Rear attach point use 6x32 screw SRM Front attach point use 6x32 screw See detail A Detail A Chassis PEM nut See detail B Duct front interface feature see note 2 NOTE: 1. 2. Detail B For clarity the motherboard is not shown in this figure.
ATX Thermal/Mechanical Design Information 6 ATX Thermal/Mechanical Design Information 6.1 ATX Reference Design Requirements Intel is not developing an ATX reference thermal solution for the Intel® Core™2 Duo desktop processor E6000/E4000 sequence, Intel® Pentium® Dual Core processor E2000 sequence, and Intel® Pentium® 4 processor 6x1 sequence with a TDP of 65 W. This chapter will document the requirements for an active air-cooled design, with a fan installed at the top of the heatsink.
ATX Thermal/Mechanical Design Information Table 8. ATX Target Heatsink Performance in 775_VR_CONFIG_06 65 W Processor Processor Thermal Performance Ψca (Mean + 3σ) TA Assumption Notes ® 0.31 °C/W 40 °C 1, 2 ® 0.33 °C/W 40 °C 1, 2 Intel Core™2 Duo desktop processor E6000 sequence with 4 MB cache Intel Core™2 Duo desktop processor E6000/E4000 sequence with 2 MB cache ® ® 0.33 °C/W 40 °C 2 ® ® 0.
ATX Thermal/Mechanical Design Information While the fan hub thermistor helps optimize acoustics at high processor workloads by adapting the maximum fan speed to support the processor thermal profile, additional acoustic improvements can be achieved at lower processor workload by using the TCONTROL specifications described in Section 2.2.3. Intel recommendation is to use the Fan Specification for 4 Wire PWM Controlled Fans to implement fan speed control capability based digital thermal sensor temperature.
ATX Thermal/Mechanical Design Information In addition to comply with overall thermal requirements (Section 6.1.1), and the general environmental reliability requirements (Section 6.2) the fan should meet the following performance requirements: • Mechanical wear out represents the highest risk reliability parameter for fans. The capability of the functional mechanical elements (ball bearing, shaft, and tower assembly) must be demonstrated to a minimum useful lifetime of 50,000 hours.
ATX Thermal/Mechanical Design Information Figure 17. Random Vibration PSD 0.1 3.13GRMS (10 minutes per axis) PSD (g^2/Hz) (20, 0.02) (500, 0.02) (5, 0.01) 0.01 5 Hz 500 Hz 0.001 1 10 100 1000 Frequency (Hz) 6.2.1.2 Shock Test Procedure Recommended performance requirement for a motherboard: • Quantity: 3 drops for + and - directions in each of 3 perpendicular axes (i.e., total 18 drops). • Profile: 50 G trapezoidal waveform, 170 in/sec minimum velocity change.
ATX Thermal/Mechanical Design Information 6.2.1.2.1 Recommended Test Sequence Each test sequence should start with components (i.e., motherboard, heatsink assembly, etc.) that have never been previously submitted to any reliability testing. The test sequence should always start with a visual inspection after assembly, and BIOS/processor/Memory test (refer to Section 6.2.3). Prior to the mechanical shock & vibration test, the units under test should be preconditioned for 72 hours at 45 ºC.
ATX Thermal/Mechanical Design Information 6.2.3 Recommended BIOS/Processor/Memory Test Procedures This test is to ensure proper operation of the product before and after environmental stresses, with the thermal mechanical enabling components assembled. The test shall be conducted on a fully operational motherboard that has not been exposed to any battery of tests prior to the test being considered.
ATX Thermal/Mechanical Design Information 6.4 Safety Requirements Heatsink and attachment assemblies shall be consistent with the manufacture of units that meet the safety standards: • UL Recognition-approved for flammability at the system level. All mechanical and thermal enabling components must be a minimum UL94V-2 approved. • CSA Certification. All mechanical and thermal enabling components must have CSA certification.
ATX Thermal/Mechanical Design Information Figure 19. Intel® RCFH-4 Reference Design – Exploded View Wire Guard Fan Assy. Extrusion Fastener Clip Development vendor information for the Intel RCFH-4 Reference Solution is provided in Appendix H. 6.6 Reference Attach Mechanism 6.6.1 Structural Design Strategy Structural design strategy for the Intel RCFH-4 Reference Solution is to minimize upward board deflection during shock to help protect the LGA775 socket.
ATX Thermal/Mechanical Design Information Figure 20. Upward Board Deflection During Shock Shock Load Less curvature in region under stiff clip The target metal clip nominal stiffness is 540 N/mm [3100 lb/in]. The combined target for reference clip and fasteners nominal stiffness is 380 N/mm [2180 lb/in]. This is consistent with the results for the RCBFH-3 design. The nominal preload provided by the Intel RCFH-4 reference design is 191.3 N ± 44.5 N [43 lb ± 10 lb].
ATX Thermal/Mechanical Design Information Figure 21. Reference Clip/Heatsink Assembly Clip Core shoulder traps clip in place The mechanical interface with the reference attach mechanism is defined in Figure 22 and Figure 23. Complying with the mechanical interface parameters is critical to generating a heatsink preload compliant with the minimum preload requirement given in Section 2.1.2.2.
ATX Thermal/Mechanical Design Information Figure 22. Critical Parameters for Interfacing to Reference Clip Fan Fin Array Core See Detail A Clip Fin Array Clip 1.6 mm Core Detail A Figure 23. Critical Core Dimension Φ38.68 +/- 0.30 mm Φ36.14 +/- 0.10 mm Gap required to avoid core surface blemish during clip assembly. Recommend 0.3 mm min. 1.00 +/- 0.10 mm Core 1.00 mm min R 0.40 mm max R 0.40 mm max 2.596 +/- 0.
Intel® Quiet System Technology (Intel® QST) 7 Intel® Quiet System Technology (Intel® QST) In the Intel® 965 Express family chipset a new control algorithm for fan speed control is being introduced. It is composed of a Manageability Engine (ME) in the Graphics Memory Controller Hub (GMCH) which executes the Intel Quiet System Technology (Intel QST) algorithm and the ICH8 containing the sensor bus and fan control circuits.
Intel® Quiet System Technology (Intel® QST) Figure 24. Intel® QST Overview Intel® QST Temperature sensing and response Calculations Fan to sensor Relationship Fan Commands (PID) (Output Weighting Matrix) (PID) PECI / SST PWM Temperature Sensors Fans System Response 7.1.1 Output Weighting Matrix Intel QST provides an Output Weighting Matrix that provides a means for a single thermal sensor to affect the speed of multiple fans.
Intel® Quiet System Technology (Intel® QST) Figure 25. PID Controller Fundamentals Integral (time averaged) Temperature Actual Temperature Limit Temperature + dPWM Derivative (Slope) Time RPM - dPWM Proportional Error Fan Speed For a PID algorithm to work limit temperatures are assigned for each temperature sensor. For Intel QST, the TCONTROL for the processor and chipset are to be used as the limit temperature.
Intel® Quiet System Technology (Intel® QST) 7.2 Board and System Implementation of Intel® QST To implement the board must be configured as shown in Figure 26 and listed below: • ME system (S0-S1) with Controller Link connected and powered • DRAM with Channel A DIMM 0 installed and 2MB reserved for Intel® QST FW execution • SPI Flash with sufficient space for the Intel® QST Firmware • SST-based thermal sensors to provide board thermal data for Intel® QST algorithms • Intel® QST firmware Figure 26.
Intel® Quiet System Technology (Intel® QST) Figure 27 shows the major connections for a typical implementation that can support processors with Digital thermal sensor or a thermal diode. In this configuration a SST Thermal Sensor has been added to read the on-die thermal diode that is in all of the processors in the 775-land LGA packages shipped before the Intel® Core™2 Duo desktop processor E6000 sequence.
Intel® Quiet System Technology (Intel® QST) 7.3 Intel® QST Configuration and Tuning Initial configuration of the Intel QST is the responsibility of the board manufacturer. The SPI flash should be programmed with the hardware configuration of the motherboard and initial settings for fan control, fan monitoring, voltage and thermal monitoring. This initial data is generated using the Intel provided Configuration Tool.
LGA775 Socket Heatsink Loading Appendix A LGA775 Socket Heatsink Loading A.1 LGA775 Socket Heatsink Considerations Heatsink clip load is traditionally used for: • Mechanical performance in mechanical shock and vibration ⎯ Refer to Section 6.6.1 above for information on the structural design strategy for ATX thermal solutions.
LGA775 Socket Heatsink Loading Simulation shows that the solder joint force (Faxial) is proportional to the board deflection measured along the socket diagonal. The matching of Faxial required to protect the LGA775 socket solder joint in temperature cycling is equivalent to matching a target MB deflection.
LGA775 Socket Heatsink Loading Figure 29. Board Deflection Definition d’1 d1 d2 d’2 A.2.3 Board Deflection Limits Deflection limits for the ATX/µATX form factor are: d_BOL - d_ref≥ 0.09 mm and d_EOL - d_ref ≥ 0.15 mm And d’_BOL – d’_ref≥ 0.09 mm NOTE: 1. 2. and d_EOL’ – d_ref’ ≥ 0.15 mm The heatsink preload must remain within the static load limits defined in the processor datasheet at all times. Board deflection should not exceed motherboard manufacturer specifications.
LGA775 Socket Heatsink Loading A.2.4 Board Deflection Metric Implementation Example This section is for illustration only and relies on the following assumptions: • 72 mm x 72 mm hole pattern of the reference design • Board stiffness = 900 lb/in at BOL, with degradation that simulates board creep over time ⎯ Though these values are representative, they may change with selected material and board manufacturing process. Check with your motherboard vendor. • Clip stiffness assumed constant – No creep.
LGA775 Socket Heatsink Loading Figure 30. Example: Defining Heatsink Preload Meeting Board Deflection Limit A.2.5 Additional Considerations Intel recommends to design to {d_BOL - d_ref = 0.15mm} at BOL when EOL conditions are not known or difficult to assess The following information is given for illustration only. It is based on the reference keep-out, assuming there is no fixture that changes board stiffness: d_ref is expected to be 0.18 mm on average, and be as high as 0.
LGA775 Socket Heatsink Loading A.2.5.1 Motherboard Stiffening Considerations To protect LGA775 socket solder joint, designers need to drive their mechanical design to: • Allow downward board deflection to put the socket balls in a desirable force state to protect against fatigue failure of socket solder joint (refer to Sections A.2.1, A.2.2, and A.2.3.
Heatsink Clip Load Metrology Appendix B Heatsink Clip Load Metrology B.1 Overview This section describes a procedure for measuring the load applied by the heatsink/clip/fastener assembly on a processor package. This procedure is recommended to verify the preload is within the design target range for a design, and in different situations. For example: • Heatsink preload for the LGA775 socket • Quantify preload degradation under bake conditions.
Heatsink Clip Load Metrology Remarks: Alternate Heatsink Sample Preparation As mentioned above, making sure that the load cells have minimum protrusion out of the heatsink base is paramount to meaningful results. An alternate method to make sure that the test setup will measure loads representative of the non-modified design is: • Machine the pocket in the heat sink base to a depth such that the tips of the load cells are just flush with the heat sink base • Then machine back the heatsink base by around 0.
Heatsink Clip Load Metrology Figure 32. Load Cell Installation in Machined Heatsink Base Pocket – Side View Wax to maintain load cell in position during heatsink installation Height of pocket ~ height of selected load cell Load cell protrusion (Note: to be optimized depending on assembly stiffness) Figure 33.
Heatsink Clip Load Metrology B.2.2 Typical Test Equipment For the heatsink clip load measurement, use equivalent test equipment to the one listed Table 12. Table 12. Typical Test Equipment Item Load cell Notes: 1, 5 Description Part Number (Model) Honeywell*-Sensotec* Model 13 subminiature load cells, compression only AL322BL Select a load range depending on load level being tested. www.sensotec.
Heatsink Clip Load Metrology B.3.1 Time-Zero, Room Temperature Preload Measurement 1. Pre-assemble mechanical components on the board as needed prior to mounting the motherboard on an appropriate support fixture that replicate the board attach to a target chassis • For example: standard ATX board should sit on ATX compliant stand-offs.
Heatsink Clip Load Metrology 82 Thermal and Mechanical Design Guidelines
Thermal Interface Management Appendix C Thermal Interface Management To optimize a heatsink design, it is important to understand the impact of factors related to the interface between the processor and the heatsink base. Specifically, the bond line thickness, interface material area and interface material thermal conductivity should be managed to realize the most effective thermal solution. C.
Thermal Interface Management § 84 Thermal and Mechanical Design Guidelines
Case Temperature Reference Metrology Appendix D Case Temperature Reference Metrology D.1 Objective and Scope This appendix defines a reference procedure for attaching a thermocouple to the IHS of a 775-land LGA package for TC measurement. This procedure takes into account the specific features of the 775-land LGA package and of the LGA775 socket for which it is intended. The recommended equipment for the reference thermocouple installation, including tools and part numbers are also provided.
Case Temperature Reference Metrology D.2 Supporting Test Equipment To apply the reference thermocouple attach procedure, it is recommended to use the equipment (or equivalent) given in the following table.
Case Temperature Reference Metrology Figure 34. Omega Thermocouple D.3 Thermal calibration and controls It is recommended that full and routine calibration of temperature measurement equipment be performed before attempting to perform temperature case measurement. Intel recommends checking the meter probe set against known standards. This should be done at 0ºC (using ice bath or other stable temperature source) and at an elevated temperature, around 80 ºC (using an appropriate temperature source).
Figure 35.
Thermal and Mechanical Design Guidelines Figure 36.
Case Temperature Reference Metrology The orientation of the groove relative to the package pin 1 indicator (gold triangle in one corner of the package) is shown in Figure 37 for the 775-Land LGA package IHS. Figure 37. IHS Groove per Figure 35 on the 775-LAND LGA Package IHS Groove Pin1 indicator When the processor is installed in the LGA775 socket, the groove is perpendicular to the socket load lever, and on the opposite side of the lever, as shown Figure 38. Figure 38.
Case Temperature Reference Metrology D.5 Thermocouple Attach Procedure The procedure to attach a thermocouple with solder takes about 15 minutes to complete. Before proceeding, turn on the solder block heater, as it can take up to 30 minutes to reach the target temperature of 153 – 155 °C. Note: To avoid damage to the processor ensure the IHS temperature does not exceed 155 °C. As a complement to the written procedure a video Thermocouple Attach Using Solder – Video CD-ROM is available. D.5.
Case Temperature Reference Metrology 5. Using the microscope and tweezers, bend the tip of the thermocouple at approximately 10 degree angle by about 0.8 mm [.030 inch] from the tip (Figure 40). Figure 40. Bending the Tip of the Thermocouple D.5.2 Thermocouple Attachment to the IHS 6. Clean groove and IHS with Isopropyl Alcohol (IPA) and a lint free cloth removing all residues prior to thermocouple attachment. 7.
Case Temperature Reference Metrology 9. Lift the wire at the middle of groove with tweezers and bend the front of wire to place the thermocouple in the groove ensuring the tip is in contact with the end and bottom of the groove in the IHS (Figure 42-A and B). Figure 42. Thermocouple Bead Placement (A) (B) 10. Place the package under the microscope to continue with process.
Case Temperature Reference Metrology 11. While still at the microscope, press the wire down about 6 mm [0.125”] from the thermocouple bead using the tweezers or your finger. Place a piece of Kapton* tape to hold the wire inside the groove (Figure 43). Refer to Figure 44 for detailed bead placement. Figure 43. Position Bead on the Groove Step Wire section into the groove to prepare for final bead placement Kapton* tape Figure 44.
Case Temperature Reference Metrology Figure 45. Third Tape Installation 12. Place a 3rd piece of tape at the end of the step in the groove as shown in Figure 45. This tape will create a solder dam to prevent solder from flowing into the larger IHS groove section during the melting process. 13. Measure resistance from thermocouple end wires (hold both wires to a DMM probe) to the IHS surface. This should be the same value as measured during the thermocouple conditioning in Section D.5.1.
Case Temperature Reference Metrology 14. Using a fine point device, place a small amount of flux on the thermocouple bead. Be careful not to move the thermocouple bead during this step (Figure 47). Ensure the flux remains in the bead area only. Figure 47. Applying Flux to the Thermocouple Bead 15. Cut two small pieces of solder 1/16 inch (0.065 inch / 1.5 mm) from the roll using tweezers to hold the solder while cutting with a fine blade(Figure 48) Figure 48.
Case Temperature Reference Metrology 16. Place the two pieces of solder in parallel, directly over the thermocouple bead (Figure 49) Figure 49. Positioning Solder on IHS 17. Measure the resistance from the thermocouple end wires again using the DMM (refer to Section D.5.1.step 2) to ensure the bead is still properly contacting the IHS. D.5.3 Solder Process 18. Make sure the thermocouple that monitors the Solder Block temperature is positioned on the Heater block.
Case Temperature Reference Metrology Figure 50. Solder Station Setup 21. Remove the land side protective cover and place the device to be soldered in the solder station. Make sure the thermocouple wire for the device being soldered is exiting the heater toward you. Note: Don’t touch the copper heater block at any time as this is very hot. 22. Move a magnified lens light close to the device in the solder status to get a better view when the solder begins to melt. 23. Lower the Heater block onto the IHS.
Case Temperature Reference Metrology 24. You may need to move the solder back toward the groove as the IHS begins to heat. Use a fine tip tweezers to push the solder into the end of the groove until a solder ball is built up (Figure 51 and Figure 52) Figure 51. View Through Lens at Solder Station Figure 52.
Case Temperature Reference Metrology 25. Lift the heater block and magnified lens, using tweezers quickly rotate the device 90 degrees clockwise. Using the back of the tweezers press down on the solder; this will force out the excess solder Figure 53. Removing Excess Solder 26. Allow the device to cool down. Blowing compressed air on the device can accelerate the cooling time.
Case Temperature Reference Metrology D.5.4 Cleaning & Completion of Thermocouple Installation 27. Remove the device from the solder station and continue to monitor IHS Temperature with a handheld meter. Place the device under the microscope and remove the three pieces of Kapton* tape with Tweezers, keeping the longest for re-use. 28. Straighten the wire and work the wire in to the groove. Bend the thermocouple over the IHS. Replace the long piece of Kapton* tape at the edge of the IHS.
Case Temperature Reference Metrology 29. Using a blade carefully shave the excess solder above the IHS surface. Only shave in one direction until solder is flush with the groove surface (Figure 55). Figure 55. Removing Excess Solder Note: Take usual precautions when using open blades 30. Clean the surface of the IHS with alcohol and use compressed air to remove any remaining contaminants. 31. Fill the rest of the groove with Loctite* 498 Adhesive.
Case Temperature Reference Metrology 32. To speed up the curing process apply Loctite* Accelerator on top of the Adhesive and let it set for a couple of minutes(Figure 57) Figure 57. Application of Accelerant Figure 58. Removing Excess Adhesive from IHS 33. Using a blade, carefully shave any adhesive that is above the IHS surface (Figure 58). The preferred method is to shave from the edge to the center of the IHS.
Case Temperature Reference Metrology 34. Clean IHS surface with IPA and a wipe. 35. Clean the LGA pads with IPA and a wipe. 36. Replace the land side cover on the device. 37. Perform a final continuity test. 38. Wind the thermocouple wire into loops and secure or if provided by the vendor back onto the plastic roll. (Figure 59) Figure 59. Finished Thermocouple Installation 39. Place the device in a tray or bag until it’s ready to be used for thermal testing use. D.
Case Temperature Reference Metrology Figure 60.
Case Temperature Reference Metrology 106 Thermal and Mechanical Design Guidelines
Legacy Fan Speed Control Appendix E Legacy Fan Speed Control A motherboard design may opt to use a SIO or ASIC based fan speed control device that uses the existing look up or state based fan speed control.
Legacy Fan Speed Control for TDP power at a given ambient temperature. The resulting variable speed fan (VSF) curve is the upper limit on fan speed. The benefit of this upper limit will become more apparent when the fan speed controller is responding to the on-die thermal sensor. Figure 61. Thermistor Set Points Variable Speed Fan (VSF) Curve Fan Speed (RPM) Full Speed Min. Operating 38 30 Fan Inlet Temperature (°C) E.1.
Legacy Fan Speed Control E.2 Board and System Implementation Once the thermal solution is defined, the system designer and board designer can define the fan speed control implementation. The first step is to select the appropriate fan speed controller (FSC). Figure 62 shows the major connections for a typical implementation. Figure 62.
Legacy Fan Speed Control These are the minimum parameters required to implement acoustic fan speed control. See Figure 63 for an example. There may be vendor specific options that offer enhanced functionality. See the appropriate vendor datasheet on how to implement those features. Figure 63. Fan Speed Control Fan Speed Min Speed (% PWM Duty Cycle) 100 % Fan Speed (RPM) Full Speed X% TLOW TCONTROL Diode Temperature (°C) E.2.1.
Legacy Fan Speed Control Figure 64. Temperature Range = 5 °C Tdiode Tlow 3500 80 3000 75 70 2500 RPM Tcontrol 65 2000 60 1500 55 1000 Tdiode (C) Fan RPM 50 500 45 0 40 Time (s) An alternate would be to consider a slightly larger value such as TRANGE = 10 °C. In this case the design is trading off the acoustic margin for thermal margin. • There is increased granularity in the fan speeds.
Legacy Fan Speed Control Figure 65. Temperature Range = 10 °C Tdiode Tlow 3500 80 3000 75 70 2500 RPM Tcontrol 65 2000 60 1500 55 1000 Tdiode (C) Fan RPM 50 500 45 0 40 Time (s) It should be noted that having TSENSOR above TCONTROL is expected for workloads near TDP power levels and high system ambient. See Section E.4 for additional discussion on TCONTROL versus Thermal Profile For use with the ATX Boxed Processor enabled reference solution a TRANGE value of 10 °C is recommended.
Legacy Fan Speed Control E.3 Combining Thermistor and Digital Thermal Sensor Control There is no closed loop control between the FSC and the thermistor, but they work in tandem to provide the maximum fan speed reduction. As discussed in Section E.1.1, the thermistor establishes the VSF curve. This curve determines the maximum fan speed as a function of the ambient temperature and by design provides a ΨCA sufficient to meet the thermal profile.
Legacy Fan Speed Control To use all of the features in the Intel reference heatsink design or the Boxed processor, system integrators should verify the following functionality is present in the board design. Refer to the Fan Specification for 4 wire PWM Controlled Fans and Chapter 6 for complete details on the Intel enabled thermal solution. The basics of Fan Speed Control were discussed in Chapter 7, as a review the FSC definitions are listed in Table 13. Table 13.
Legacy Fan Speed Control Figure 67. FSC Definition Example Requirements Classification • Required – an essential part of the design necessary to meet specifications. Should be considered a pass or fail in selection of a board. • Suggested – highly desired for consistency among designs. May be specified or expanded by the system integrator. The motherboard needs to have a fan speed control component that has the following characteristics: • PWM output programmable to 21-28 kHz (required).
Legacy Fan Speed Control The BIOS, at a minimum, must program the settings in Table 14 or Table 15, as appropriate, into the fan speed controller. The values are the minimum required to establish a fan speed control algorithm consistent with this document, the reference thermal solution, and Boxed processor thermal solution. Table 14.
Legacy Fan Speed Control Table 15. Balanced Technology Extended (BTX) Fan Speed Control Settings Parameter Classification Processor Thermal Sensor System Ambient Sensor PWM Output Notes THIGH Required TCONTROL 54 °C 3,5 TLOW Required TCONTROL – 7 °C 47 °C 3,5 Minimum PWM Duty Cycle Required PWM 1 (TMA) –20% PWM Frequency Required 21–28 kHz Spin Up Time Suggested 250 - ~ 500 ms TAVERAGING Suggested 4.0 sec 4.
Legacy Fan Speed Control 118 Thermal and Mechanical Design Guidelines
Balanced Technology Extended (BTX) System Thermal Considerations Appendix F Balanced Technology Extended (BTX) System Thermal Considerations There are anticipated system operating conditions in which the processor power may be low but other system component powers may be high. If the only Fan Speed Control (FSC) circuit input for the Thermal Module Assembly (TMA) fan is from the processor sensor then the fan speed and system airflow is likely to be too low in this operating state.
Balanced Technology Extended (BTX) System Thermal Considerations The thermal sensor location and elevation are reflected in the Flotherm thermal model airflow illustration and pictures (see Figure 68 and Figure 69).The Intel® Boxed Boards in BTX form factor have implemented a System Monitor thermal sensor. The following thermal sensor or its equivalent can be used for this function: Part Number: C83274-002 BizLink USA Technology, Inc.
Balanced Technology Extended (BTX) System Thermal Considerations Figure 69.
Balanced Technology Extended (BTX) System Thermal Considerations 122 Thermal and Mechanical Design Guidelines
Mechanical Drawings Appendix G Mechanical Drawings The following table lists the mechanical drawings included in this appendix. These drawings refer to the reference thermal mechanical enabling components for the processor. Note: Intel reserves the right to make changes and modifications to the design as necessary.
45.26 47.50 41.00 36.78 36.00 A 27.00 23.47 47.50 45.26 44.00 40.00 36.78 36.49 39.01 36.00 33.00 32.51 27.51 ( 19.13 ) 0.00 2 PACKAGE BOUNDARY SOCKET BALL 1 5.90 ( 37.50 ) 7.30 8 7 6 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2 GEOMETRIC CENTER OF CPU PACKAGE / SOCKET HOUSING CAVITY. 3. BOARD COMPONENET KEEP-INS AND MECHANICAL COMPONENET KEEP-OUTS TO BE UTILIZED WITH SUFFICIENT ALLOWANCES FOR PLACEMENT AND SIZE TOLERANCES, ASSEMBLY PROCESS ACCESS, AND DYNAMIC EXCURSIONS. 4.
4X 8 6.00 7 10.00 LEGEND 7 ROUTING KEEP-OUT COMPONENT KEEP-OUT 4X 6 DISCLOSED IN CONFIDENCE AND ITS CONT OR WRITTEN CONSENT OF INTEL CORPORAT 6 BOARD SECONDARY SIDE ION CONFIDENTIAL INFORMATION. IT IS SPLAYED OR MODIFIED, WITHOUT THE PRI Thermal and Mechanical Design Guidelines A B C D THIS DRAWING CONTAINS INTEL CORPORAT MAY NOT BE DISCLOSED, REPRODUCED, DI 8 5 ENTS ION.
A B C D 2.50 2.75 5.80 45 X 3.50 3.00 37.00 7 27.25 SECTION 49.00 6 A-A 8 7 6 5.80 3.80 3.00 A 32.85 29.00 2X 45 X 3.00 5 ENTS ION. 4 R49.44 5 ( 46.11 ) 1.00 120.0 R33.29 4 TOP SIDE VIEW 8.15 3.80 30.00 2 14.10 ( 37.60 ) 6.60 SOCKET & PROCESSOR VOLUMETRIC KEEP-IN DISCLOSED IN CONFIDENCE AND ITS CONT OR WRITTEN CONSENT OF INTEL CORPORAT LEVER MOTION SPACE REQUIRED TO RELEASE SOCKET LOAD PLATE 3.00 24.50 ION CONFIDENTIAL INFORMATION.
Thermal and Mechanical Design Guidelines Figure 73.
Thermal and Mechanical Design Guidelines Figure 74.
Thermal and Mechanical Design Guidelines Figure 75.
Thermal and Mechanical Design Guidelines Figure 76.
Thermal and Mechanical Design Guidelines Figure 77.
A B C D E F G H 94.62 [ 3.725 ] A 7 SEE DETAIL C 8 PERMANENTLY MARK PART NUMBER AND REVISION LEVEL APPROXIMATELY WHERE SHOWN XXXXXX-XXX REV XX 7 39.6 [ 1.559 ] 7 7 SEE DETAIL B 94.62 [ 3.725 ] 8 B 6 SECTION 6 Figure 78. ATX Reference Clip – Sheet 1 A-A 5 5 D 5 0.2 .007 ] 36.44 [ 1.435 7 0.5 [.019] SQ 53.5 0.2 [ 2.106 .007 ] D A B 0.5 [.019] 4X 10 0.2 [ .394 .007 ] A B 3 2 0.2 [ .079 7 A 3.52 0.2 [ .139 .007 ] .007 ] A SEE DETAIL 2 DWG.
5.3 [ .209 ] 135 7.31 [ .288 ] 6 8 0.1 [.003] 0.2 [.007] BOUNDARY 7 2X R3.6 [ .142 ] R0.3 TYP [ .012 ] 7 6 W 1.06 [ .042 ] 1.65 [ .065 ] 5 5 R3.1 [ .122 ] THIS POINT CORRESPONDS TO THE 39.6 DIMENSION ON SHEET 1 ZONE A7 DETAIL A SCALE 10 TYPICAL 4 PLACES 7.35 [ .289 ] 2X R0.5 [ .020 ] 7 Thermal and Mechanical Design Guidelines A B C D E F G H 8 Figure 79. ATX Reference Clip – Sheet 2 Mechanical Drawings A B A B W 133.59 2.97 [ .117 ] R1.4 [ .055 ] X X 4X 0.4 [.015] 0.
Figure 80.
Thermal and Mechanical Design Guidelines Figure 81.
Figure 82.
Thermal and Mechanical Design Guidelines Figure 83.
NOTES: 1. FOR DETAILED SPECIFICATIONS SEE COMPONENT DRAWINGS. 2. THERMAL INTERFACE MATERIAL: 0.2CC (0.4 GRAMS) SHIN-ETSU-MICRO-S1 G751 THERMAL GREASE. 3. SEE SHEET 2 FOR ASSEMBLY RECOMMENDATIONS. 4. US PATENTS PENDING. ( 120 ) [ 4.7 ] 90 ) [ 3.543 ] ( 62.9 ) [ 2.476 ] ( 65.42 ) [ 2.576 ] ( ( 95 ) [ 3.740 ] Figure 84.
1 4 DETAIL SCALE ( 5.88 ) [ .232 ] 9.53 0.12 [ .375 .004 ] SECTION ( 9.53 ) [ .375 ] 6 B A-A Thermal and Mechanical Design Guidelines A SEE DETAIL A B 3 § 1 FAN ATTACH INSTALLATION: INSERT FAN ATTACH (1) INTO HEAT SINK (4) TO THE SPECIFIED DEPTH AND ORIENTATION. INSERT TOOL TO KEY TO TOP OF HEAT SINK FOR DEPTH ACCURACY. ARBOR PRESS OR SIMILAR TOOL IS REQUIRED. 2 FAN AND FAN WIRE INSTALLATION: A.
Intel® Currently Enabled Reference Solution Information Appendix H Intel® Currently Enabled Reference Solution Information This appendix includes supplier information for Intel enabled vendors. The reference component designs are available for adoption by suppliers and heatsink integrators pending completion of appropriate licensing contracts. For more information on licensing, contact the Intel representative mentioned in Table 16. Table 16.
Intel® Currently Enabled Reference Solution Information regarding quality, reliability, functionality, or compatibility of these devices. This list and/or these devices may be subject to change without notice. Table 18. Intel® Reference Component for Balanced Technology Extended (BTX) Thermal Solution Providers Supplier Part Description Part Number Contact Phone Email Mitac International Corp Support and Retention Module _ Michael Tsai 886-3-3289000 Ext.
