Intel® Xeon® Processor E72800/4800/8800 v2 Product Family Thermal/ Mechanical Specifications and Design Guide February 2014 Reference Number: 329596-001
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Contents 1 Introduction .............................................................................................................. 9 1.1 Objective ........................................................................................................... 9 1.2 Scope ................................................................................................................ 9 1.3 References ....................................................................................................... 11 1.
E LGA2011-1 Socket Electrical ....................................................................................81 E.1 Socket Electrical Requirements ............................................................................81 E.2 S-Parameters ....................................................................................................82 E.3 Dielectric Withstand Voltage................................................................................83 E.4 Insulation Resistance ...................
D-3 F-1 F-2 F-3 F-4 G-1 G-2 G-3 G-4 G-5 G-6 G-7 G-8 G-9 G-10 G-11 G-12 G-13 G-14 G-15 G-16 G-17 G-18 G-19 G-20 G-21 Processor Package Mechanical Drawing (Sheet 3 of 3) ............................................... 80 Socket Mechanical Drawing (Sheet 1 of 4)................................................................ 86 Socket Mechanical Drawing (Sheet 2 of 4)................................................................ 87 Socket Mechanical Drawing (Sheet 3 of 4)....................................
E-1 E-2 E-3 F-1 G-1 6 LGA2011-1 Electrical Requirements .........................................................................81 Max Chain Average Resistance ................................................................................82 S-parameters Requirements ...................................................................................82 Socket Drawing List...............................................................................................85 Mechanical Drawing List .............
Revision History Document Number Revision Number 329596 001 Description • Initial release of the document Revision Date February 2014 § 7 Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family Thermal/ Mechanical Specifications and Design Guide,
Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family Thermal/ Mechanical Specifications and Design Guide
Introduction 1 Introduction This document provides specifications and guidelines for the design of an Intel® Xeon® processor E7-2800/4800/8800 v2 product family compatible thermal and mechanical solutions in 2 and 4-socket Intel® Xeon® processor E7-2800/4800/8800 v2 product family-based platform servers. 1.1 Objective It is the intent of this document to explain and demonstrate the processor thermal and mechanical solution features and requirements.
Introduction Figure 1-1.
Introduction 1.3 References Material and concepts available in the following documents may be beneficial when reading this document. Table 1-1. Reference Documents Document Notes Intel® Xeon® Processor E7-2800/4800/8800 v2 Product Family Datasheet - Volume One 1 Platform Environment Control Interface (PECI) Specification 1 Intel® Turbo Boost Technology 2.
Introduction 1.4 Terminology Table 1-2. Terms and Descriptions Term 12 Description Bypass Bypass is the area between a passive heatsink and any object that can act to form a duct. For this example, it can be expressed as a dimension away from the outside dimension of the fins to the nearest surface. DTS Digital Thermal Sensor reports a relative die temperature as an offset from TCC activation temperature.
Thermal and Mechanical Design 2 Thermal and Mechanical Design In this section, mechanical and thermal requirements of the processor as well as its enabling solution are discussed. These specifications will enable a designer to identify and establish set of design requirements for the motherboard and the system in addressing compliance with the processor and the enabled components specifications. 2.
Thermal and Mechanical Design Figure 2-2. Processor Package ISO View Socket Keying (4x) IHS Wings (2x) Integrated Heat Spreader (IHS) Pin 1 Substrate IHS Step (2x) Not to Scale Figure 2-3.
Thermal and Mechanical Design 2.1.1.2 Processor Mechanical Dimensions The package includes an integrated heat spreader (IHS). The IHS transfers the nonuniform heat from the die to the top of the IHS, out of which the heat flux is more uniform and spread over a larger surface area (not the entire IHS area). This allows more efficient heat transfer out of the package to an attached cooling device. The IHS is designed to be the interface for contacting a heatsink.
Thermal and Mechanical Design load-bearing surface in either static or dynamic compressive load conditions is not recommended. 2.1.1.4 Processor Component Keep-Out Zones The processor may contain components on the substrate that define component keep-out zone requirements. A thermal and mechanical solution design must not intrude into the required keep-out zones. Decoupling capacitors are typically mounted on either the topside or land-side of the package substrate.
Thermal and Mechanical Design 2.1.2 LGA2011-1 Socket Mechanical Specifications 2.1.2.1 Socket Overview This section describes a surface mount LGA (Land Grid Array) socket that provides I/O, power, and ground contacts. The socket has two main components, the socket body and Pick and Place (PnP) cover. They are delivered by the socket supplier as a single integral assembly.
Thermal and Mechanical Design Solder balls enable the socket to be surface mounted to the processor board. Each contact will have a corresponding solder ball. Solder ball position may be at an offset with respect to the contact tip and base. Hexagonal area array ball-out increases contact density by 12% while maintaining 40 mil minimum via pitch requirements. Figure 2-6. Hexagonal Array in LGA2011-1 l mi 40 40 m il 34.
Thermal and Mechanical Design Figure 2-7. LGA2011-1 Socket Features Package Alignment Cavity Contact Array (2x) Processor keying (4x) Seating Plane Finger Access ILM Keying Housing 2.1.2.3 Socket Mechanical 2.1.2.3.1 Socket Size The socket dimensions are shown in Appendix F; allow for full insertion of the package into the socket without interference.
Thermal and Mechanical Design 2.1.2.3.6 Orientation in Packaging, Shipping, and Handling Packaging media needs to support high-volume manufacturing. Media design must be such that no component of the socket (solder balls, contacts, housing, and so on) is damaged during shipping and handling. 2.1.2.3.7 Pick and Place, and Handling Cover To facilitate high-volume manufacturing, the socket shall have a detachable cover to support the vacuum type Pick and Place system.
Thermal and Mechanical Design 2.1.2.3.8 Durability The socket must withstand 30 cycles of processor insertion and removal. The maximum part average and single pin resistances from Table E-1 must be met when mated in the 1st and 30th cycles. 2.1.2.3.9 Socket Keep-in/Keep-out Zone Socket keep-in and keep-out zones are identified on the motherboard to ensure that sufficient space is available for the socket, and to prevent interference between the socket and the components on the motherboard.
Thermal and Mechanical Design 2.1.2.3.12 Socket Critical-to-Function Interfaces Critical-to-function (CTF) dimensions for motherboard layout and assembled components’ interface to the socket are identified in Table 2-6. The CTF values are detailed on the socket drawing provided in Appendix F and take precedence over all values presented in this document. All sockets manufactured must meet the specified CTF dimensions. Table 2-6.
Thermal and Mechanical Design 2.1.2.4.4 Package Alignment/Orientation A means of providing fixed alignment and proper orientation with the pin 1 corner of the package must be provided. The package substrate will have two pairs of keying notches at the two opposing slides of the package. The socket will utilize the four protrusions in the contact array area to serve as alignment features to mate with the notches on the package.
Thermal and Mechanical Design Figure 2-9. Contact Orientation • Base Material High-strength copper alloy. • Contact Area Plating For the area on socket contacts where processor lands will mate, there is a 0.381 μm [15 μinches] minimum gold plating over 1.27 μm [50 μinches] minimum nickel underplating in critical contact areas (area on socket contacts where processor lands will mate) is required. No contamination by solder in the contact area is allowed during solder reflow.
Thermal and Mechanical Design • Stroke/Load The minimum vertical height of the contact above the package seating plane is defined in Appendix F. The minimum vertical stroke of the contact must, under all tolerance and warpage conditions, generate a normal force load to ensure compliance with all electrical requirements of the socket defined in Appendix E. The cumulative normal force load of all contacts must not exceed the load limits defined in Table 2-5. 2.1.2.4.
Thermal and Mechanical Design Figure 2-11. Contact Wiping Direction 2.1.2.4.9 Contact Load-Deflection Curve The contact shall be designed with an appropriate spring rate and deflection range, as illustrated in Figure 2-12, to ensure adequate contact normal force in order to meet EOL performance at all contact locations. The load-deflection curve is not necessary to be linear between the minimum and maximum deflection points.
Thermal and Mechanical Design 2.1.2.4.10 Solder Ball Characteristics • Number of Solder Balls Total number of solder balls: 2011. • Layout The solder balls are laid out in two ‘L’ shape regions, as shown in Appendix F.
Thermal and Mechanical Design . Figure 2-13. LGA2011 Socket NCTF Solder Joints (Bottom View) 2.1.3 Mechanical Considerations An retention/loading mechanism must be designed to support the processor heatsink and to ensure processor interface with the socket contact is maintained since there are no features on the LGA2011-1 socket for direct attachment of the heatsink or retaining the processor.
Thermal and Mechanical Design baseboard and system must be considered when designing the heatsink and ILM attach mechanism. Their design should provide a means for protecting the LGA2011-1 socket solder joints as well as preventing package pullout from the socket. Note: The load applied by the attachment mechanism and the heatsink must comply with the package specifications, along with the dynamic load added by the mechanical shock and vibration requirements.
Thermal and Mechanical Design Table 2-7. ILM and Heatsink Mechanical Load Specifications (Sheet 2 of 2) Parameter Min Max Static compressive load from ILM load plate to processor IHS BOL 445 N [100 lbf] Static compressive load from ILM load plate to processor IHS EOL 311 N [70 lbf] Dynamic Load N/A TIM2 Activation Pressure 137.9 kPa Pick and Place Cover Insertion / Removal force N/A 6.2 N Load Lever actuation force N/A 12.
Thermal and Mechanical Design The ILM assembly consists of a top frame, load plate, and two load levers. These components together will provide the mechanism to apply uniform loading to the processor’s IHS. The frame provides the hinge locations for the Active lever and Hinge levers. While secured to the backer plate, the ILM design ensures that the only features touching the board are the insulator at the bottom of the ILM frame and on the top of the back plate. 2.1.5.
Thermal and Mechanical Design Figure 2-15. ILM Assembly (Open Orientation) Load Plate ILM Cover (Bottom View) Hinge Lever Active Lever ILM Frame The hinge lever and active lever are designed to place equal force on both ends of the ILM load plate.The frame provides the hinge locations for the levers. The hinge lever connects the load plate to the frame. When closed, the load plate applies load onto the IHS at four loading zones.
Thermal and Mechanical Design Figure 2-16.
Thermal and Mechanical Design Figure 2-17. 2.1.5.2.1 ILM Attachment Holes ILM Features • Eliminates the motherboard thickness dependency from the stack-up because the heatsink attach points are located on the top side of the board. • Nuts clamp the ILM frame to the board, providing good clamping and hence reduced board bending leading to more solder joint reliability. • Socket keying ensures ILM is used with an intended socket, in this case LGA2011-1 socket.
Thermal and Mechanical Design Figure 2-18. ILM Keying ILM-Socket Keying 2.1.5.3 ILM Back Plate Design Overview The backplate assembly consists of a supporting plate and captive standoffs. It provides rigidity to the system to ensure minimal board and socket deflection. Four externally threaded (male) inserts which are press fit into the backplate are for ILM attachment. Three cavities are located at the center of the plate to allow access to the baseboard test points and backside capacitors.
Thermal and Mechanical Design Figure 2-19. Back Plate Assembly Small Opening for PCB Components (2x) Large Opening for PCB Components Treaded Fastener Insulator Table 2-9. ILM Assembly Component Thickness and Material Component Thickness (mm) Material ILM Frame 1.5 301 Stainless Steel ILM Load plate 1.5 301 Stainless Steel ILM Back plate 2.2 S50C Low Carbon Steel or equivalent. All pieces in the ILM assembly, except the fasteners, are fabricated from stainless steel.
Thermal and Mechanical Design Figure 2-20. ILM Cover 2.1.5.5.1 Lever Actuation/Release Forces Nominal force to actuate the levers is 21 N at the point of typical finger placement. 2.1.5.5.2 Closing sequence To ensure proper operation, the ILM design provides features to ensure that the proper closing sequence is followed. The load plate is placed in the down position, then the Active lever engages the load plate tongue and is latched first. This is then followed by the latching of the Hinge lever.
Thermal and Mechanical Design Figure 2-22. ILM Lever Closing Sequence Active Lever in Closed Position 2.1.5.5.3 Opening Sequence For the opening sequence, the goal is to always open the Hinge lever first to prevent the load plate from springing open. The only option is to release the Hinge lever first. The Hinge lever in a closed position will block the Active lever from being unlatched. By opening the Hinge lever first, it creates clearance to open the Active lever.
Thermal and Mechanical Design Figure 2-23. Opening Sequence Open Hinge Lever First Open Active Lever Second 2.1.6 Heatsink Mechanical Requirements The mass of the heatsink should not exceed 600 g. The heatsink mass limit and the use of a back plate have eliminated the need for Direct Chassis Attach retention in some implementations. Direct contact between back plate and chassis pan will help minimize board deflection during shock. 2.
Thermal and Mechanical Design A complete solution includes both component and system level thermal management features. Component level thermal solutions can include active or passive heatsinks attached to the processor integrated heat spreader (IHS). Typical system level thermal solutions may consist of system fans combined with ducting and venting. This section provides data necessary for developing a complete thermal solution. 2.2.
Thermal and Mechanical Design 2.2.2 TCASE and DTS Based Thermal Specifications To simplify compliance to thermal specifications at processor run time, processor has added a Digital Thermal Sensor (DTS) based thermal specification. Digital Thermal Sensor reports a relative die temperature as an offset from TCC activation temperature. TCASE thermal based specifications are used for heatsink sizing and DTS based specs are used for acoustic and fan speed optimizations.
Thermal and Mechanical Design 9. Minimum Tcase represents the lowest processor operating temperature. 2.2.3 Thermal Metrology 2.2.3.1 Case Temperature The minimum and maximum case temperatures (TCASE) specified in Table 2-10 are measured at the geometric center of the processor substrate on top of the processor integrated heat spreader (IHS). Figure 2-24 contains dimensions for the thermocouple location on the processor package.
Thermal and Mechanical Design TDTS = TLA + Ψpa * P * F Where TLA and Ψpa are the intercept and slope terms from the TDTS equations. To implement the DTS based thermal specification, these equations must be programmed in firmware. Since the equations differ with processor SKU, SKUs can be identified by TDP and Core Count.
Thermal and Mechanical Design The recommended time interval between energy readings is 1 second. This helps ensure the power calculation is accurate by making the error between time stamps small as compared to the duration between time stamps. The PECI command for energy is RdPkgConfig(), the service is called Accumulated CPU Energy, the bit numbers 31:0. 2.2.3.2.
Thermal and Mechanical Design M > 0; margin to spec, fan speed may decrease Use of RdPkgConfig(), Index 10 with an Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family will return an illegal command. For the follow-on processor, coefficients (αf, αs) and scale factor (C) as defined in Section 2.2.3.2.3, will be programmable and available via a register. If the two time constant average specification (TDTS_ave) is not desired, set αf = 1.0 and C = 1.0 to force TDTS_ave = TDTS_max.
Thermal and Mechanical Design 2. 3. 4. 5. 6. 7. 2.2.5 Local ambient temperature of the air entering the heatsink. Defined as (TCASE_MAX - TLA) / TDP Reference system configuration. 1U = 1.75”. Dimensions of heatsink do not include socket or processor. Heatsink performance value (ΨCA_MAX) includes TIM performance. Values are preliminary and subject to change. Socket Maximum Temperature The power dissipated within the socket is a function of the current at the pin level and the effective pin resistance.
Thermal and Mechanical Design 2.2.6 Thermal Interface Material (TIM) Applying thermal interface material between the processor IHS and the Heatsink base will improve the heat transfer between the IHS and the heatsink. Honeywell* PCM45F material is selected for use with the Intel reference heatsink design. The recommended size ensures adequate coverage at the interface between the processor IHS and heatsink pedestal. Table 2-13.
Thermal and Mechanical Design 2.3.2 Fan Speed Control Fan speed control (FSC) techniques to reduce system-level acoustic noise are a common practice in server designs. The fan speed is one of the parameters that determines the amount of airflow provided to the thermal solution. Additionally, airflow is proportional to a thermal solution’s performance, which consequently determines the TCASE of the processor at a given power level.
Thermal and Mechanical Design The PECI temperature reading from the processor can be compared to this TCONTROL value. A fan speed control scheme can be implemented as described in Table 2-14 without compromising the long-term reliability of the processor. The PECI command for DTS is GetTemp(). Though use of a sign bit, the value returned from PECI is negative. The PECI command for TCONTROL is RdPkgConfig(), Temperature Target Read, 15:8.
Thermal and Mechanical Design • May increase frequency benefit from Intel Turbo Boost Technology. • Will increase acoustics • May result in lower wall power Customers must characterize a Tcontrol_offset value for their system to meet frequency, acoustics, and wall power goals. Tcontrol_offset is programmable for the follow-on processor in this platform. 2.3.
Thermal and Mechanical Design Table 2-15. Thermal Solution Performance Design Targets and Environment Parameter TLA Pressure Drop (ΔP) Maximum Unit 47 °C This is the temperature at the processor cooling devices. 57.2 (0.23) Pa (inch H2O) Total pressure drop across the processor heatsink fins with zero bypass. Altitude Sea-level Airflow 15.8 (33.5) Notes Heatsink designed at 0 meters l/s (CFM) Airflow through the heatsink fins.
Thermal and Mechanical Design 2.4 Design Considerations 2.4.1 System Design Considerations When designing a thermally capable system, all critical components must be simultaneously considered. The responsible engineer must determine how each component will affect another, while ensuring target performance for all components. The term “target performance” is used because some components (for example, LRDIMM) have better performance, depending on how well they are cooled.
Thermal and Mechanical Design • Determine whether that optimized thermal solution can meet processor specifications • Iterate through the previous steps to find a solution that will meet thermal requirements To develop a reliable and cost-effective thermal solution, thermal characterization and simulation should be carried out at the entire system level, accounting for the thermal requirements of each component.
Thermal and Mechanical Design 2.4.3 Thermal Interface Material (TIM) Considerations Thermal Interface Material between the processor IHS and the heatsink base is necessary to improve thermal conduction from the IHS to the heatsink. Many thermal interface materials can be pre-applied to the heatsink base prior to shipment from the heatsink supplier without the need for a separate TIM dispense or attachment process in the final assembly factory.
Thermal and Mechanical Design 2.4.4.3 Package/Socket Stack-up Height Table 2-17 provides the stack-up height of a processor in the 2011-1-land LGA package and LGA2011-1 socket with the ILM closed and the processor fully seated in the socket. Table 2-17.
Thermal and Mechanical Design Figure 2-28. Suggested Board Marking LGA2011-1 2.4.5.4.1 Socket-Socket Pitch 2.4.5.5 LGA2011-1 Socket Land Pattern Guidance The land pattern guidance provided in this section applies to printed circuit board design. Recommendation for Printed Circuit Board (PCB) Land Patterns is to ensure solder joint reliability during dynamic stresses, often encountered during shipping and handling and hence to increase socket reliability. 2.4.5.
Thermal and Mechanical Design 2.4.5.6.1 Socket Land Pattern The land pattern for the LGA2011-1 socket is 40 mils hexagonal array. For CTF (Critical to Function) joints, the pad size will primarily be a circular Metal Defined (MD) pad and these pads should be designated as a Critical Dimension to the PCB vendors with a 17 mil ±1 mil tolerance. Some CTF pads will have a SMD Pad (20 x 17 mil). For additional pad configurations details including the NCTF (Non-Critical to Function) joints, see Section 2.4.5.5.
Thermal and Mechanical Design Table 2-18. Recommended Land Pattern for LGA2011-1 Socket Pad Description Recommendation Details • • • NCTF Pads - 43 pads in the four corners • • Critical to Function Pads along the socket sides. • • All other Critical to function pads. 2.4.5.7 • • Oblong partially SMD Pad (20 x 17 mil) oriented at 45° to the socket edge. The pad end closest to the center of the socket should have the Solder Resist Opening (SRO) of 17 ±1 mil. This is a critical to function dimension.
Thermal and Mechanical Design Designs that do not meet the design objectives of the back plate or exceed the maximum Heatsink Static Compressive Load, should follow Board Deflection Measurement Methodology as outlined to assess risk to socket solder joint reliability. 2.
Thermal and Mechanical Design Figure 2-30. Processor Reference Heatsink Isometric View Table 2-20. Tower Heatsink Design Parameter Heatsink technology Heatpipe Quantity TIM Size Value Notes Cu/Al base / Al fins / heatpipes 4 35 x 35 mm Fin Quantity See heatsink drawing in Appendix G Fin Size Weight Fin Support Mechanism 2.5.
Thermal and Mechanical Design Figure 2-31.
Thermal and Mechanical Design 62 Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family Thermal/ Mechanical Specifications and Design Guide
Components Assembly Instructions A Components Assembly Instructions Reference Enabling components are designed for compatibility with the Intel Xeon processor E7-800/4800/8800 v2 product family and to ease board and system assembly. The processor enabling solution is illustrated in Figure A-1. Processor and its thermal/mechanical solution is installed onto a motherboard at the board or system assembly site.
Components Assembly Instructions Figure A-1. Processor and Enabling Components Mechanical Assembly Processor Heatsink Processor and ILM in CLOSED Position ILM Back Plate Note: The processor thermal mechanical solution assembly begins with surface mounting the LGA2011-1 socket onto the baseboard. The remaining steps presumed that the socket(s) have already been surface-mounted onto the board.
Components Assembly Instructions • ILM ILM is delivered with its cover in place. Verify the load plate is unlocked and the levers are in their latched position. This will prevent damage to the socket during the ILM installation. The ILM fastener pattern also acts as a keying feature. Orient the ILM with respect to the baseboard such that the pin-1 indicator on the ILM is oriented in the same direction as the pin-1 on the socket. Caution: Damage to the socket may occur if ILM is not properly oriented.
Components Assembly Instructions socket handling instructions. The socket Pick’n’Place cover can be discarded. Essentially the ILM cover will perform the same function as the socket Pick’n’Place cover in protecting the socket contacts. With the ILM cover in place, close the load plate and secure it by actuating the Active lever and Hinge lever in that sequence until ready for the processor installation. Figure A-3. Socket Pick and Place Cover Removal A.
Components Assembly Instructions socket if it is not properly aligned to the socket. The processor should be inspected to ensure that it is properly seated on the socket, such that the guiding features are visible on all four keying sites. Once the processor is properly seated on the socket, lower the ILM load plate, and completely actuate and latch the Active and Hinge lever in that order to load the entire assembly. Inspect the assembly to ensure that it is properly installed. Figure A-4.
Components Assembly Instructions Warning: Care should be taken not to touch the TIM during the assembly sequence as contamination or defect in TIM may impact its performance. Additionally, avoid exposing the socket or other components on the processor and the base board to the TIM as it may impact their performance and long term reliability. Secure the heatsink to the ILM using a #2 Phillips torque driver tighten the four captive fasteners to 1 N-m (9 ±1 in-lbf).
Quality and Reliability Requirements B Quality and Reliability Requirements B.1 Thermal/Mechanical Solution Stress Test Design, including materials, shall be consistent with the manufacture of units that meet the following environmental reference points. The reliability targets in this section are based on the expected field use environment for a server product.
Quality and Reliability Requirements Table B-1.
Quality and Reliability Requirements Any plastic component exceeding 25 grams must be recyclable per the European Blue Angel recycling standards. Particular requirements: Cadmium shall not be used in painting or plating. No Quaternary salt electrolytic capacitors shall be used. Examples of prohibited caps are: United Chemi-Con type: LXF, LXY, LXZ. No brominated plastics shall be used. Also, plastics heavier than 25 g must be labeled per ISO 10469 and may not contain halogenated flame retardant compounds.
Quality and Reliability Requirements 72 Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family Thermal/ Mechanical Specifications and Design Guide
Supplier Listing C Supplier Listing Third-part suppliers are enabled to ensure that reference thermal and mechanical components are available. C.1 Intel Enabled Supplier Information Notes: 1. Supplier listing is provided by Intel as a convenience to its customers. Intel does not make any representations or warranties whatsoever regarding the quality, reliability, functionality, or compatibility of these devices. 2.
Supplier Listing Table C-1. Supplier Listing (Sheet 1 of 2) Component LGA2011-1 Socket Intel Part Number Supplier PN Supplier PE201127-4353-01H (with 4 package keying) Foxconn (Hon Hai) G44924-001 (with 4 package keying) 2174987-1 (with 4 package keying) Tyco Electronics Supplier Contact Info Katie Wang katie.wang@foxconn.com Tel: +1-714-608-2085 Fax:+1-714-680-2099 Josh Moody jdmoody@tycoelectronics.com Tel: +1-503-327-8348; +1-503-327-8346 (Asia) Billy Hsieh billy.hsieh@te.
Supplier Listing Table C-1. Component Supplier Listing (Sheet 2 of 2) Intel Part Number Supplier PN ILM Top Assembly Back Plate Assembly PT44L13-4511 PT44P11-4501 Supplier Foxconn (Hon Hai) ACA-ZIF-150-Y01 DCA-HSK-182-Y06 G20917-003 (ILM Top Assembly) LGA2011-1 ILM Assembly Lotes Supplier Contact Info Eric Ling eric.ling@foxconn.com 503-693-3509 x225 Cathy Yang Cathy@lotes.com.cn Tel: +1-86-20-84686519 Alvin Yap alvinyap@amtek.com.
Supplier Listing 76 Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family Thermal/ Mechanical Specifications and Design Guide
Processor Package Mechanical Drawings D Processor Package Mechanical Drawings Table D-1 lists the socket drawings included in this appendix. Table D-1.
Processor Package Mechanical Drawings Figure D-1.
Processor Package Mechanical Drawings Figure D-2.
Processor Package Mechanical Drawings Figure D-3.
LGA2011-1 Socket Electrical E LGA2011-1 Socket Electrical E.1 Socket Electrical Requirements LGA2011-1 electrical requirements (see Table E-1) are measured from the socketseating plane of the processor (end of the contacts) to the socket solder ball attach at the motherboard. All specifications are maximum values (unless otherwise stated) for a single socket contact, but includes effects of adjacent contacts where indicated.
LGA2011-1 Socket Electrical Table E-1. LGA2011-1 Electrical Requirements (Sheet 2 of 2) Parameter Table E-2. Read & record Dielectric Withstand Voltage 360 Volts RMS Insulation Resistance 800 Mega-Ohms Report the dielectric constant and loss tangent over a frequency range from 3 GHz to 10 GHz. Include in reporting any differences due to material anisotropy. Measurements are at room temperature. Max Chain Average Resistance Max Chain LLCR Limit (milli-Ohms) 2 59.5 4 40.75 6 34.5 8 31.
LGA2011-1 Socket Electrical E.3 Dielectric Withstand Voltage No disruptive discharge or leakage greater than 0.5 mA is allowed when subjected to 360 V RMS. The sockets shall be tested according to EIA-364, Test Procedure 20A, Method 1. The sockets shall be tested in fully mated condition. Barometric pressure shall be equivalent to Sea Level. The sample size is 25 contact-to-contact pairs on each of four sockets. The contacts shall be randomly chosen. E.
LGA2011-1 Socket Electrical 84 Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family Thermal/ Mechanical Specifications and Design Guide
Socket Mechanical Drawings F Socket Mechanical Drawings Table F-1 lists the socket drawings included in this appendix. Table F-1.
Socket Mechanical Drawings Figure F-1.
Socket Mechanical Drawings Figure F-2.
Socket Mechanical Drawings Figure F-3.
Socket Mechanical Drawings Figure F-4.
Socket Mechanical Drawings § 90 Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family Thermal/ Mechanical Specifications and Design Guide
Mechanical Drawings G Mechanical Drawings Table G-1 lists the Mechanical drawings included in this appendix. Table G-1.
A B C D 8 7 6 8 SOCKET OUTLINE FOR REFERENCE ONLY .504 [12.8] 7 SCALE .717 [18.2] 1.811 [46] 6 3:1 .906 [23] 5 2.724 [69.2] TOP SIDE HOLE DETAIL A 4 PLACES SCALE 10:1 .150 NPTH [ 3.8 ] 5 .256 [ 6.5 ] COPPER WEAR PAD: NON-GROUNDED SOLDER MASKED 0.0" HEIGHT PACKAGE KEEPOUT .180 THROUGH ALL ROUTE KEEPOUT [ 4.56 ] .276 ROUTE KEEPOUT [ 7.01 ] SEE DETAIL A 1.362 [34.6] THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION.
Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family Thermal/ Mechanical Specifications and Design Guide A B C D 8 7 6 8 7 3.031 [77] 6 SCALE 3.819 [97] 2:1 2.815 [71.5] THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION. 5 5 4.213 [107] 4 4 REV 1 - INITIAL RELEASE SHT.
A B C D 8 7 6 8 4.146 [105.3] 2.450 [62.23] 7 7 2.019 [51.28] ILM RETENTION HOLES, SEE DOCUMENT G26770 FOR DETAILS SOCKET OUTLINE FOR REFERENCE ONLY SOCKET CAVITY COMPONENT DETAILS SEE G26770 6 THERMAL RETENTION MOUNTING HOLE LOCATIONS SHOWN FOR REFERENCE ONLY, NO THROUGH HOLES ARE REQUIRED IN PCB 1.975 [50.18] 5 5 .409 [10.4] 2.313 [58.75] THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION.
Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family Thermal/ Mechanical Specifications and Design Guide A B C D 8 7 6 8 7 6 .551 [14] .197 [4.99] THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION. 3.150 [80] 5 SCALE .880 [22.35] .921 [23.39] 5 2:1 3.622 [92] 4 SHT.
A B C D 8 7 6 8 3.622 [92] HINGE LEVER SWEEP 3.282 [83.36] 7 TONGUE LEVER SWEEP 3.150 [80] 4.232 [107.5] 50.0° 110.0° 110.0° 6 5 .099 [2.5] BACKSIDE KOV 3.270 [83.06] LOAD PLATE SWEEP 5 TOP SIDE SWEEP ZONES THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION. 3.150 [80] 2.650 [67.31] 3.407 [86.
Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family Thermal/ Mechanical Specifications and Design Guide A B C D 8 7 6 8 94 69.2 46 56 7 3 79.1±0.5 4X INSTRUCTION ICONS AND PIN1 MARK AREA. VENDOR AND DATE CODE INFORMATION ON THIS SURFACE OR SIDE OF LOAD PLATE 6. ENABLED COMPONENTS PART NUMBERS: G20917-XXX: ILM ASSEMBLY, INCLUDING ILM COVER G33452-XXX E94309-XXX: BACKPLATE ASSEMBLY 5. FOR ILM KEEP OUT VOLUME REFER TO DRAWING G52827 5.
A B C D 8 7 6 8 +0.25 0 2.63 +0.25 0 2.63 7 75.72 61 ACTIVE CLEVIS 75.82 61 HINGE CLEVIS 6 5. UNSPECIFIED SURFACES TO BE FLAT WITHIN 0.125MM PER 25.4MM. 4. SHARP CORNERS MUST BE CHAMFERED OR ROUNDED TO 0.25MM MAX. 3. BURR HEIGHTS SHALL NOT EXCEED 0.08MM. A) TYPE: 301 STAINLESS STEEL, 0.8MM+/- 0.05 THK. B) CRITICAL MECHANICAL PROPERTIES: TENSILE YIELD STRENGTH (ASTM D638) >= 758 MPa MODULUS OF ELASTICITY (ASTM D638) >= 193 GPa C) PLATING: NONE. D) HEAT TREATING: NONE 2.
Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family Thermal/ Mechanical Specifications and Design Guide 7 6 7 6 5 4 DEPARTMENT R 2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 DWG. NO 2 D SHT. 3 REV SIZE DRAWING NUMBER G56693 G56693 2 1 2 REV C D 3 PMCI SCALE: 2:1 1 DO NOT SCALE DRAWING SHEET 3 OF 4 A 56.05 3 A 51 49.75 ILM COVER 4 B 8 3. PART SHALL BE FREE OF OIL AND DEBRIS.
A B C D 8 7 6 8 7 0.178 4X 4 +0.051 INSULATOR WITH ADHESIVE 0 2.2 NOMINAL MATERIAL 6.37 STUD HEIGHT. ACCOMODATES PCB RANGE OF 0.080 TO 0.130 4 6 DETAIL A SCALE 5:1 0.25 TYPICAL INSULATOR OVERHANG. NO METAL IS TO BE EXPOSED BY INSULATOR WHERE IT COULD CONTACT THE CIRCUIT BOARD 2. FEATURES NOT SPECIFIED ON DRAWING SHALL BE CONTROLLED BY 3D CAD DATABASE. 3. MATERIAL: MAY USE ENGINEERING APPROVED EQUIVALENT. A) TYPE:SHEET STEEL, SK7, 1065, S50C, OR CHSP60PC- 2.2MM+/-0.
Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family Thermal/ Mechanical Specifications and Design Guide A B C D 8 7 6 MARK PART NUMBER AND DATE CODE ON INDICATED SURFACE. 8 0.25 35±2 TIM 2 7 35±2 5. APPLY ITEM 2 CENTERED ON THE HEATSINK INTERFACE SURFACE PER THE MATERIAL MANUFACTURERS APPLICATION PROCEDURES. 4 3. FOR HEATSINK DETAILS, REFER TO INTEL DOCUMENT G20942 2. 3D PART MODEL IS PER ENGINEERING BILL OF MATERIAL.
7 6 X MEASURED CRITICAL TO FUNCTION (CTF) DIMENSIONS: TO BOTH 2 7 5 6 6 12 5 SECTION A-A 4 [ +.250 -.000 +.009 -.000 .000 .000 92.500±1.000 [3.642±.039] .76 [.02] ] 3 10 9 8 7 6 5 4 3 2 1 4 4 4 4 1 1 57 9 1 4 A 3 THIRD ANGLE PROJECTION 7/7/11 T. BOYD - SEE NOTES 2 D SCALE: 1:1 R 2200 MISSION COLLEGE BLVD. P.O.
Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family Thermal/ Mechanical Specifications and Design Guide A B C D 8 7 6 8 MEASURED A DETAIL A SCALE 4:1 7 1 5 10 INDICATED POCKET FEATURE IS FOR WEIGHT REDUCTION. THESE FEATURES ARE A SUGGESTION ONLY. SUPPLIER MAY CHANGE POCKETS WITH INTEL PTMI APPROVAL. 9 INDICATED DIMENSION DESCRIBES MAXIMUM VOLUME. SUPPLIER MAY REMOVE MATERIAL FROM BASE TO REDUCE WEIGHT 8 HEAT PIPE AND CU CORE INTERFACE FEATURES TO BE CONTROLLED BY SUPPLIER. 7.
A B C D 8 7 6 5 1. 2. 3. 8 7 HEAT PIPE INTERFACE FEATURES TO BE CONTROLLED BY SUPPLIER. HEAT PIPE GEOMETRY TO BE CONTROLLED BY SUPPLIER TO MEET ASSEMBLY PRINT HEAT PIPE BASE MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT A) TYPE: COPPER ALLOY (REPORT ALLOY IN FAI STUDY) B) MINIMUM THERMAL CONDUCTIVITY: 390 W/mK C) WICK: SINTERED POWDER NOTES UNLESS OTHERWISE SPECIFIED: REQUIREMENTS. 6 A 5 SECTION THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION.
Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family Thermal/ Mechanical Specifications and Design Guide A B C D 8 7 6 8 X 7 10. ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL PRODUCT SPECIFICATION BS-MTN-0001. 9. BREAK ALL SHARP EDGES 8. CRITICAL TO FUNCTION DIMENSION (CTF) MEASURED 7. BEND RADII 0.125mm (.005") MINIMUM. 6. PART TO BE FLAT WITHIN 0.15mm. 5. THIS DRAWING TO BE USED IN CORRELATION WITH SUPPLIED 3D DATABASE FILE.
A B C D 8 7 6 8 MEASURED 7 6 ON THE DEFINED 7 HEAT PIPE AND ALUMINUM BASE INTERFACE FEATURES TO BE CONTROLLED BY SUPPLIER. 6 FINISH: MAY USE ENGINEERING APPROVED EQUIVALENT. A) INDICATED SURFACES PER INTEL 99-0007-001, CLASS A. B) INDICATED SURFACES PER INTEL 99-0007-001, CLASS B. C) UNSPECIFIED SURFACES PER INTEL 99-0007-001, CLASS C. D) TEXTURE INDICATED SURFACES PER MT-11020. E) FINISH INDICATED SURFACES PER SPI D-2. F) SURFACES WITH NO TEXTURE TO BE IN THE RANGE OF SPI B-2 TO SPI C-2.
Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family Thermal/ Mechanical Specifications and Design Guide A B C D 8 7 6 8 7 12 INDICATED DIMENSION DESCRIBES MAXIMUM SIZE. SUPPLIER MAY REDUCE FIN WEIGHT BY REMOVING MATERIAL FROM CORNERS OF THE FIN. 11 HEAT PIPE INTERFACE FEATURES TO BE CONTROLLED BY SUPPLIER, AND SHOULD FIT IN SPECIFIED REGION. 10. ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL PRODUCT SPECIFICATION BS-MTN-0001. 9. BREAK ALL SHARP EDGES 8.
A B C D 8 7 6 8 7 12 INDICATED DIMENSION DESCRIBES MAXIMUM SIZE. SUPPLIER MAY REDUCE FIN WEIGHT BY REMOVING MATERIAL FROM CORNERS OF THE FIN. 11 HEAT PIPE INTERFACE FEATURES TO BE CONTROLLED BY SUPPLIER, AND SHOULD FIT IN SPECIFIED REGION. 10. ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL PRODUCT SPECIFICATION BS-MTN-0001. 9. BREAK ALL SHARP EDGES 8. CRITICAL TO FUNCTION DIMENSION (CTF) MEASURED X 7. BEND RADII 0.125mm (.005") MINIMUM. 6. PART TO BE FLAT WITHIN 0.15mm.
Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family Thermal/ Mechanical Specifications and Design Guide A B C D 8 7 6 8 0.5 X 45° R0.20 [ 0.008 ] DETAIL A SCALE 40.000 DETAIL B SCALE 40.000 [ ] 7 SEE DETAIL A 5 8 0.40x45° CRITICAL INTERFACE FEATURE: 4 THIS SHOULDER MUST BE SQUARE +0.075 0 +0.002 0.128 -0.000 3.250 SEE DETAIL B 4X 0.72 MIN. [0.028 ] 6 TYPE 1, CROSS RECESSED #2 DRIVER 6 6 A A 3.50± 0.20 [ 0.138± 0.007 ] 5.100 [0.2008] 6 5 5 5 12.50 ± 0.13 [ 0.
A B C D 8 7 6 5 8 SOLID HEIGHT 7 +0.30 4 0 +0.011 -0.000 0.217 5.50 [ ] A A 6 FREE HEIGHT 5 12.70 4 [0.500] FREE HEIGHT THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION. 1.100 [0.0433] WIRE DIA.
Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family Thermal/ Mechanical Specifications and Design Guide 3 4 .70 1.10 SECTION 9.10 A-A CRITICAL TO FUNCTION DIMENSION (CTF). 5 6 PART MUST COMPLY WITH INTEL WORKMANSHIP STANDARD (99-0007-001). PART SHALL BE FREE OF OIL AND DEBRIS. FINISH: UNSPECIFIED SURFACES MUST CONFORM WITH CLASS C REQUIREMENTS. 4. 3 .50 X 45 $ MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT.
A B C D 8 7 6 5 8 7 [ 3.20 5 6 0 -0.12 +0.000 0.126 -0.004 ] 2.80 #0.30 [0.110 #0.011 ] 5 4X R0.50 MIN. [0.020 ] 5 5 5.20 #0.10 MAX. [0.205 #0.003 ] 7.00 #0.20 [0.276 #0.007 ] THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION. 4 4 0.60 #0.04 [0.0236 #0.
Mechanical Drawings § Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family Thermal/ Mechanical Specifications and Design Guide 113
Mechanical Drawings 114 Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family Thermal/ Mechanical Specifications and Design Guide
