Nettop Platform for 2008 System Design White Paper June 2008 Document Number: 319980
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Contents 1 Introduction .....................................................................................................7 1.1 1.2 1.3 2 Platform Vision .................................................................................................8 2.1 3 5.4 Typical Thermal Solutions ......................................................................24 Boundary Conditions for System Thermal Design ......................................25 Case Studies .........................................
Figures Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure 1 2 3 4 5 Platform Configuration .......................................................................10 Major components on board................................................................12 S-Video Connections..........................................................................17 S-Video Pin Definitions .......................................................................
Revision History Revision Number -001 Description Revision Date Initial release.
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Introduction 1 Introduction The basic computing market segment is commonly considered a simplified PC solution at a system price point of $299 USD and below. These computers are part of a new family of computers; called “nettops”, which represent a new generation of low-cost PCs running on Intel processors. These systems are targeted at users in both mature and emerging market segments whose computing needs and price points require focused and targeted system solutions.
Platform Vision 2 Platform Vision Nettops are a simplified version of your everyday desktop, designed to be affordable, energy efficient and have a small form-factor. A low cost, affordable, purpose build platform for the next billion users. The low cost platform solution built around the Intel® Desktop Board D945GCLF with the Intel® Atom™ processor 200 series is a simplified PC at sub entry system price points: 2.
Platform Vision Table 1 Platform Features Capabilities Features Basic Computing Supports fundamental computing applications – word processing, spreadsheets, presentation software. Store, manage, and view documents, pictures, and files. Expandability for common peripherals and additional computing needs. Operating system flexibility with Linux*, and Windows* XP. Connectivity Supports dial up and broadband connectivity. Scalable for wireless. Communicate via Email and IM for business and personal use.
Platform Overview 3 Platform Overview 3.1 Hardware – Intel® Desktop Board D945GCLF The key components (Processor, Chipsets, LAN) are soldered down on the motherboard assembly. The Processor and the Chipset reference thermal solutions are pre-assembled along with the motherboard. Figure 1 shows the principal functional blocks for the platform. The features summary is listed in Table 2. The components location on board are shown in Figure 2.
Platform Overview Table 2 Platform Features Summary Topic Description Form Factor • Micro ATX compatible (6.75 inches X 6.75 inches [171.45 mm X 171.
Platform Overview Topic Description Hardware Monitor Subsystem • Hardware monitoring through the SMSC I/O controller • Voltage sense to detect out of range power supply voltages • Thermal sense to detect out of range thermal values • Two fan headers • One fan sense inputs used to monitor fan activity • Fan speed control Figure 2 Major components on board Table 3 Items in Figure 2 Item A 12 Description PCI Conventional bus add-in card connector B Front panel audio header Front panel USB headers C
Platform Overview 3.2 I Main power connector J Parallel ATA IDE connector K SATA connectors [2] L Front panel I/O header M Battery N Intel 82801GB I/O Controller Hub (ICH7) O BIOS Setup configuration jumper block P Front panel USB header Firmware The Serial Peripheral Interface Flash Memory (SPI Flash) includes a 4 MB flash memory device on the motherboard holds the firmware content.
Platform Overview 3.3.2 Table 4 Drivers Drivers and Software for Devices Device Intel® 82945GC Graphics Memory Controller Hub (GMCH) Intel 945GC chipset Description Consists of: • Intel® 82945GC Graphics Memory Controller Hub (GMCH) with Direct Media Interface (DMI) interconnect Location http://www.intel.co m/products/desktop /chipsets/index.htm • Intel® 82801GB I/O Controller Hub (ICH7) with DMI interconnect USB Supports: • up to six USB 2.0 ports, http://downloadcent er.intel.
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System Configuration 4 System Configuration 4.1 System Components Basic system components are listed in Table 5. Table 5 System Components List Component Motherboard (with soldered down processor) Specification Intel® Desktop Board D945GCLF • Micro ATX compatible form factor (dimensions: 6.75” x 6.
System Configuration 4.2 Display Display options include: • CRT • LCD • TV as display CRT-based (cathode ray tube) monitors are a still commonly used with PCs. LCD displays are replacing CRT displays at a high rate. But CRT displays are still expected to be available for 3–5 more years (especially in refurbishing markets). System manufacturers/OEM/ODM need to be aware that the logistical costs for CRT displays is higher than the costs incurred by LCD displays.
System Configuration Table 6 Video Specifications Interface VGA Size 15” Resolution 8x6 (SVGA) or 10x7 (XGA) or 12x10 Technology CRT (OR) LCD Color space Min requirement is to boot Win XP Figure 4 S-Video Pin Definitions 18 White Paper
System Configuration 4.3 Power Supply 4.3.1 Power Supply Requirement This platform requires a typical desktop 5 rail output power supply for the whole system. The motherboard is powered from a 20 pin main connector and a 2x2 connector. The common internal power supply can provide a cost effective solution for the platform. The detailed electrical requirement can be found in the Power Supply Design guide for Desktop form factors (www.formfactors.org).
System Configuration 4.3.2 Common Internal Power Supply Common internal power supply form factors include ATX12 V, TFX12 V, SFX12 V and Flex ATX form factor. Using a common internal power supply has a comparative lower cost than other power solutions. A system designer should consider the power supply cost together with the system overall size. The mechanical dimension can be found in the Power Supply Design Guide for Desktop Platform Form Factors. 4.3.2.
System Configuration 4.3.3 External Adapter and DC-DC Board Ultra small form factor system can use a DC-DC board and external adapter for the power solution. The system size is greatly reduced by removing part of the AC-DC converter from the system and using an external adapter. Designing this solution, the following items need to be taken into consideration: • The DC-DC board should meet the minimum power distribution requirements in Table 7.
System Configuration Figure 6 Typical Input Voltage of the DC-DC Board in the Market, for example 19 V Adaptor 19V DC Regulator 19V 12V 5V 3.3V -12V 5VSB System DC-DC Board 4.3.4 Energy Star* Qualified External Power Supply (Adapter) Tier I of the ENERGY STAR* computer specification as documented in ENERGY STAR* Program Requirements for Computers: Version 4.0 requires that the external power supplies for compliant computers be at least 84% average efficiency.
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Improving System Thermal Performance 5 Improving System Thermal Performance The heat generated by components within the chassis must be removed to provide an adequate operating environment for the processor and all other components in the system. Moving airflow through the chassis brings in fresh cool air from the external ambient environment and transports the heat generated by the processor and other system components out of the system.
Improving System Thermal Performance 5.2 Boundary Conditions for System Thermal Design By analyzing airflow condition in μATX chassis, airflow data across multiples different chassis configuration indicates the actual test data and statistic of the effective airflow supplied by the system to processor heatsink. As shown in Figure 7, high airflow (>200LFM) could be achieved if power supply unit (PSU) with fan is located near processor as shown by chassis B in the Figure 7.
Improving System Thermal Performance 5.3 Case Studies Fan location sensitivity study was conducted using 13L micro-ATX chassis with 3 different configurations, by various fan locations in the chassis. Schematic in Figure 8 shows a typical internal placement of micro-ATX chassis. Fan could be located at locations A and B, which are the PSU fan and system fan (at back panel) respectively. Some chassis have system fan at location C instead.
Improving System Thermal Performance 5.3.1 Case Study #1 Case study #1 shows the impact of PSU fan (A) and system fan (B) placements at back panel on the thermal boundary conditions, as shown in Figure 9. The results of two chassis tested using a same heatsink on processor is shown in Figure 10. Y-axis is normalized specification with 1.0 is value as processor passing thermal requirement.
Improving System Thermal Performance Figure 9 Case study #1: PSU Fan (A) + System Fan (B) PSU Effective Fans A Ineffective Fans B HDD ODD Bay Note: System Fan (B): 80 mm Effective airflow at range 100~130LFM across processor heatsink with only PSU Fan.
Improving System Thermal Performance Figure 11 Case Study #2: PSU Fan (A) + System Fan (C) PSU A Effective Fans C HDD ODD Bay Ineffective Fans Note: System Fan (C): 75mm Figure 12 Results Chassis #3 Tested Using Same Heatsink on Processor PSU Fan (A): 60mm * 30mm off-center from HS. NOTE: White Paper This figure shows that adding a system fan (C) can also enhance boundary condition.
Improving System Thermal Performance Figure 13 Case Study #3: System Fan (D) versus System Fan (F) Effective Fans F HDD ODD Bay Ineffective Fans Note: Natural condition (31LFM) for heatsink with default system/PSU fan configuration. Airflow improvement to 86LFM by relocating system (D) to (F).
Improving System Thermal Performance 5.4 Summary The case studies summary in Table 8 shows that in order to enable an effective passive thermal design boundary condition, the placement of power supply unit (PSU) fan and the system fan is critical. For PSU fan, it’s is obvious that placing it closer to processor heatsink is capable to provide excellent airflow. Need to take note that the processor heatsink is placed within coverage of PSU fan.
Improving System Thermal Performance Table 8 Summary of Case Studies Fans Location Sizes (mm) Rating PSU Fan A 60, 80 Excellent E 80 Poor F 80 Excellent System Fan Comment Heatsink is within PSU fan coverage Remote PSU fan: insufficient airflow to board Direct air impingement to cool heatsink Relocate system fan to existing side vent Zero cost adder! B 80 Good Performance varies with fan size & location relative to heatsink C 75 Good Performance varies with fan size & location relat
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System Testing 6 System Testing 6.1 Validation Validation of the platform includes component level validation, board level validation and system level validation (in chassis). Extensive effort has been done by Intel on the component and board level with focus on all sub systems. In chassis system validation covers functional and EMI tests of integrated board, chassis, power supply, and peripheral devices. This chapter describes what has been done at the board and system level validation. 6.1.
System Testing 6.1.1.3 Functional, Signal Integrity Validation Board level validation covers the following functional modules on board with emphasis on signal integrity: • Processor Voltage Regulator/Controller gate switching integrity, over current protection. • MCH/ICH/Memory core voltage regulators gate switching and over current protection. • Memory functional stress test and core voltage stability testing.
System Testing Test Preparation Qty Items 1 HDD PATA (IDE) 1 DVD ODD PATA (IDE) 1 Memory DDR2 533MHz (512MB) 1 Fluke NetDAQ (data logging system) - Type-T thermo couple (TC) - Loctite Epoxy (for TC attachment) - Software required: WINDOW XP, PCMark05, 3DMark, SysMark 2007, Window Media Player - Misc: Mouse / Keyboard Pass/fail criteria for all components are as follow Component Pass/Fail Criteria Processor TCASE ≤ 85.
System Testing TC # Description Location [Axis] 5 MCH Tcase (TMCH CASE) (Type-K) Center point of MCH case top surface. 6 ICH Case (TICH CASE) Centered on ICH case top surface. 8 HDD (THDD) 3mm away from component’s surface exposed to system interior. 8 ODD (TODD) 3mm away from component’s surface exposed to system interior. TCASE thermo couple 0° attachment metrology Following is the recommended guideline for proper technique of measuring component case temperature. 1. Mill a 3.3 mm [0.
System Testing Figure 16 0° Angle Attach Heatsink Modifications (generic heatsink side and bottom view, not to scale) System Thermal Test Procedures • Install required software as described in “test preparation”. • Connect all peripheral components (HDD, ODD, memory, PSU, etc…) to complete the system setup. • Attach all thermocouples as described in “thermo couple locations”. • Ensure all TCs are connected to data logging system. • Power on system and run test application “DVD playback”.
System Testing 6.1.4 Required by Regulations System level regulatory testing includes EMC and Safety testing and certification by a certified Test Laboratory. In addition to EMC and Safety Testing, systems that are being shipped into the European Union and PRC must be RoHS compliant. The motherboard meets the RoHS requirements.
System Testing System being shipped into the European Union and PRC are required to meet the RoHS (Reduction of Hazardous Substances) Requirements. 6.1.
System Testing 6.1.5.2 System Level Vibration System level vibration testing consists of attaching the fully configured system the vibration table and applying vibration for 30minutes on each of the 3 axis X, Y and Z. Pass Criteria: • No Visible Damage, No Displacement of components, cables or hardware. • No Chaffing of cables contacting metal edges. • System must operate normally after vibration testing. Table 10 contains recommended vibration parameters for system level vibration testing.
