® 423 Pin Socket (PGA423) Design Guidelines November, 2000 Order Number: 249207-001
® 423 Pin Socket Design Guidelines Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document.
® 423 Pin Socket Design Guidelines 1. INTRODUCTION ................................................................................................................................................ 6 1.1. 1.2. 1.3. OBJECTIVE:.............................................................................................................................................................. 6 PURPOSE:...................................................................................................................
23 Pin Socket Design Guidelines ® 5.1.1. Operating:..................................................................................................................................................... 29 5.1.2. Shipping and Storage: .................................................................................................................................. 30 5.1.3. Operating Humidity ....................................................................................................................
® 423 Pin Socket Design Guidelines LIST OF FIGURES FIGURE 1: OUTLINE OF THE INTEL® PENTIUM® 4 PROCESSOR PACKAGE ............................................................................ 7 FIGURE 2: INTEL® PENTIUM® 4 PROCESSOR PACKAGE PIN FIELD PIN DETAILS.................................................................. 8 FIGURE 3: TOP VIEW OF THE SOCKET ND PIN ONE INDICATOR........................................................................................ 10 FIGURE 4: 423 PIN SOCKET DIMENSIONS ..
423 Pin Socket Design Guidelines ® 423 Pin Socket Design Guidelines 1. INTRODUCTION 1.1. Objective: This document defines a ZIF (Zero Insertion Force) socket intended for desktop and workstation platforms based on the Intel® Pentium® 4 microprocessor. The socket provides I\O, power and ground contacts and must be low cost, low risk, robust, high volume manufacturable (HVM), and multi-sourceable.
® 423 Pin Socket Design Guidelines Figure 1: Outline of the Intel® Pentium® 4 Processor Package Note: Dimensions Shown in Inches 7
® 423 Pin Socket Design Guidelines Note: Dimensions Shown In Inches Figure 2: Intel® Pentium® 4 Processor Package Pin Field Pin Details Table 1: Package Critical To Function (CTF) Dimensions Dimension Shoulder Diameter keep out (Land Solder Fillet Shoulder Inclusion ) Pin Diameter Shoulder Diameter Protrusion (Land Solder Fillet Shoulder Inclusion) Pin Length* Pin TP Flatness of package across the total length of package diagonal 8 Minimum in N/A Maximum in 0.034 max 0.017 N/A 0.020 0.010 0.
® 3. 423 Pin Socket Design Guidelines MECHANICAL REQUIREMENTS 3.1. Pin-Out and Orientation Diagram: The pin-out for the 423 pin socket is shown in Figure 3. This diagram is viewed from the TOP of the SOCKET. The socket dimensions, the tab and stopper details are provided in Figure 4, Figure 5, and Figure 6. 3.2.
® 423 Pin Socket Design Guidelines Figure 3: Top View Of The Socket nd Pin One Indicator.
® 423 Pin Socket Design Guidelines Figure 4: 423 Pin Socket Dimensions Note: Dimensions shown in inches 11
® 423 Pin Socket Design Guidelines Figure 5: Socket Tab Geometry and Dimensions Note: Dimensions shown in inches 12
® 423 Pin Socket Design Guidelines Figure 6: Socket Stopper Geometry and Dimensions Note: Dimensions shown in inches 13
423 Pin Socket Design Guidelines 3.3. ® Materials: 3.3.1. Socket Housing: Liquid Crystal Polymer (LCP), UL 94V-0, or equivalent. Flame rating, temperature rating and design capable of withstanding reflow solder process per Section 5.8. 3.3.2. Color: The 423 Pin Socket will have uniform color. The color requirement does not apply to the actuation lever arm. 3.3.3. Markings: 3.3.3.1.Name: 423 Pin Socket (Font type is Helvetica - 16 point Bold).
® 423 Pin Socket Design Guidelines between the socket and the pin field. Actuation lever arm in locked position must have the same profile as the socket cam and housing, and must not interfere with the heatsink protrusion. The total thickness of the cam house must reside within 0.350in from the bottom surface of the socket. 3.3.3.4.Socket/Package pin field Movement The socket will be built so that the package pin field displacement will not exceed 0.060in during engagement and disengagement. 3.3.4.
423 Pin Socket Design Guidelines Insert processor into socket and lock it in using actuation lever. ® Assemble heat sink onto the package. 3.4.2. Socket Engagement/Disengagement Force: The force on the actuation lever arm must not exceed 10 lbf to engage or disengage the package into the 423 Pin Socket. Movement of the cover is limited to the plane parallel to the motherboard. 3.4.3. Visual Aids: The socket top will have markings identifying open and closed positions for the actuation lever arm. 3.4.4.
® 423 Pin Socket Design Guidelines Table 2: Socket Critical To Function Dimensions Dimension Socket Housing Overall Length Socket Housing Overall Width Socket Housing Height (pin field) Socket Housing Height (cam) Socket Flatness – Cover Top Socket Through Cavity Length Socket Through Cavity Width Lever Arm Height in Locked position Index A B C D E F G H Cover Lead-in Chamfer Diameter Cover Lead-in Chamfer Depth HH J Cover Pin Hole True Position Cover Pin Hole Diameter Cover Travel Tab1 Length (cam en
® 423 Pin Socket Design Guidelines TP .010” zone TP .
® 423 Pin Socket Design Guidelines Figure 8: 423 Pin Socket Critical To Function (CTF) Dimensions 19
423 Pin Socket Design Guidelines Figure 9: 423 Pin Socket Critical To Function (CTF) Dimensions Details 20 ®
® 423 Pin Socket Design Guidelines Figure 10: 423 Pin Socket Critical To Function (CTF) Dimensions Details 21
® 423 Pin Socket Design Guidelines 4. ELECTRICAL REQUIREMENTS Socket electrical requirements are measured from the socket-seating plane of the package to the component side of the socket PCB to which it is attached. All specifications are maximum values (unless otherwise stated) for a single socket pin, but includes effects of adjacent pins where indicated. Pin and socket inductance includes exposed pin from mated contact to bottom of the package pin field. 4.1.
® 423 Pin Socket Design Guidelines In Out Package Socket Motherboard Figure 12: Methodology for Measuring Total Electrical Resistance In Out Package Motherboard Figure 13: Methodology for Measuring Electrical Resistance of the Jumper Determination of Average Electrical Resistance: Figure 12 and Figure 13 show the proposed methodology for measuring the final electrical resistance.
® 423 Pin Socket Design Guidelines Every Rtotal will be applied to equations 1-3, where the Rjumper in the following equations comes from a statistical average of many measurements. The resistance requirement, Rreq, can be calculated for each chain with the measurements as shown in the following equations.
® 4.2. 423 Pin Socket Design Guidelines Inductance: The bottom fixture for the inductance is a ground plane on the secondary side of the motherboard with all pins grounded. The component side of the socket PCB does not contain a plane. The top fixture shown is for the package test fixture, which contains pins that will connect to the socket. Figure 14 presents the inductance measurement fixture cross-section. The first figure shows the entire assembly.
R1 {4 available in the center signal} 423 Pin Socket Design Guidelines R2 R4 Rs Figure 15: Inductance and Capacitance Fixture Design R1 R2 R2a R4 Rs Probe Pad signal ground no connect & no pin Figure 16: Inductance Measurement Configuration 26 ®
® 423 Pin Socket Design Guidelines 4.2.1. Procedure for Inductance Measurements: 4.2.1.1.Mounted Directly to Motherboard Fixture: Measure the inductance of the 4 different configurations of the package fixture flush-mounted to the motherboard fixture. The configurations can be seen in Figure 16. This will force spacing between the bottom of the package and top of the motherboard fixture to be 0.010in, which matches the height of the pin shoulder.
423 Pin Socket Design Guidelines R2 – R2’ = (3*Ls/2 – 2*M71) + M100/2 ® (equation 6) R4 – R4’ = 5*Ls/4 – 2* M71 + M100/2 + M142/4 (equation 7) Rs – Rs’ = 3*Ls/2 – 2* M142 + 0.5M280 (equation 8) *note: M280 is the mutual at 280mils away. Since that value is small and we only use half of that value, we will neglect it for equation 8. 4.2.2. Loop Inductance: To qualify, the socket must meet the loop inductance (LLoop) as shown in equation 9.
® 423 Pin Socket Design Guidelines Figure 17: Contact Current Rating Measurement 4.5. Dielectric Withstand Voltage: Dielectric withstand voltage shall be a minimum requirement of 400VRMS as measured per EIA 364, Test Procedure 20A, Method B. Dielectric withstand voltage will be measured at 8 test points between adjacent pins (D4 and E5, D36 and C37, AT4 and AR5, AT36 and AU37, D20 and C19, AT20 and AR19, Y4 and W5, Y36 and AA37). 4.6.
® 423 Pin Socket Design Guidelines 5.1.2. Shipping and Storage: -40ºC to + 70ºC 5.1.3. Operating Humidity 55ºC/85% RH (non-condensing) 5.2. Durability: Mate and unmate samples for 50 cycles at a rate of 500cph (max), using the same socket. One package is to be used for 1st and 51st cycles. Measure electrical resistance when mated in 1st and 51st cycles. A spare package shall be used for 2nd through 50th cycles. A pair of new packages are to be used for each of the socket samples. 5.3.
® 423 Pin Socket Design Guidelines Vibration test to be performed for two durations: Duration 1: 10min/axis (derived from Intel® Corporation customary board vibration specifications). Power Spectral Density (PSD) Profile: 3.13GRMS. Figure 19 presents the PSD curves used for the vibration testing. Sample Size: 9 for contact resistance, 9 for electrical discontinuity. Input Accelerometer Location: Input (Control) accelerometer to be mounted on the vibration table.
® 423 Pin Socket Design Guidelines Figure 20: Mechanical Shock and Vibration Fixture Note: Dimensions shown in inches 32
® 423 Pin Socket Design Guidelines Figure 21: ATX Motherboard Layout Details Note: Dimensions shown in inches 33
423 Pin Socket Design Guidelines 5.5. ® Temperature Shock: Test per EIA 364 TP 32B, Test Condition ( I ) for 5 cycles. 5.6. Cyclic Humidity: Test per EIA 364 Test Procedure 31 and Test Condition B for 240 hours. 5.7. Temperature Life (Bake Test): Test per EIA 364 Test Procedure 17 at 85 °C for 500 hours. Precondition samples with three insertion/extractions (min). 5.8. Solder Withstand Temperature: Test per EIA 364, Test Procedure 56A, Procedure 5. 5.9. Porosity Test: 5.9.1.
® 5.13. 423 Pin Socket Design Guidelines Post Reliability Testing Inspection of Package pin field: In case of electrical failures post shock and vibration testing: remove the package from the socket. Inspect for visual evidence of fretting corrosion on the pins. When a pass/fail decision cannot be made based on the visual inspection of the package pin field, the part may be sent out for SEM analysis. Requirement: No visual evidence of fretting corrosion on any package pins. 6.
423 Pin Socket Design Guidelines 6.6. Process Changes: ® Any significant change to the socket will require submission of a detailed explanation of the change at least 60 days prior to the planned implementation. Intel® will review the modification and establish the necessary re-qualification procedure that the socket must pass. Any testing that is required MUST be completed before the change is implemented.
® 6.9. 423 Pin Socket Design Guidelines to procure electrical test vehicles and required mechanical components from Intel®. Socket Qualification Notification: Upon completion of the test plan, the test facility will prepare a summary report for the socket supplier that will provide notification as to whether the socket has passed or failed. A copy of the test report will be provided to Intel and the socket supplier. 6.10.
423 Pin Socket Design Guidelines Table 3: Test Group and Test Flow Diagram Group 1 (for socket attach) 9 Group 2 (for board RM attach) 9 Group 3 Group 4 Group 5 Group 6 Group 7 Group 8 Group 9 4 4 2 1 4 4 1 LLCR LLCR Precondition DWV SWT Current Rating Mech. Shock LLCR IR Solvent Resistance Visual Inspection Porosity Mated Loop inductance Mech.
® 7. 423 Pin Socket Design Guidelines SAFETY REQUIREMENTS Design, including materials, shall be consistent with the manufacture of units that meet the following safety standards: UL 1950 most current editions CSA 950 most current edition EN60 950 most current edition and amendments IEC60 950 most current edition and amendments 8. DOCUMENTATION REQUIREMENTS The socket supplier shall provide Intel® with the following documentation: Multi-Line Coupled SPICE models for socket.
