Technical Advisory

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This Technical Advisory describes an issue which may or may not affect the customer’s product

Intel Technical Advisory TA-1040-01

5200 NE Elam Young Parkway

Hillsboro, OR 97124

November 01, 2013

Copyright © 2013 Intel Corporation. * Other names and brands may be claimed as the property of others.

Customers may experience an Over Current Protection (OCP) fault

associated with certain Hot Swap Back Planes (HSBP) that can result

in damage to the HSBP.

Products Affected

Description

During an investigation into a customer reported issue on the 2U 2.5" Hot Swap Back Plane (HSBP)

(G15232-451); Intel identified an excursion with the raw Printed Circuit Board (PCB) material. Due to a low

impedance short in the HSBP a system may:

a) Experience an Over Current Protection (OCP) event which will be logged in the System Event

Log (SEL) and the system will shut down.

b) Alternatively an OCP may occur in the 5V or 3.3V subsystem and an event will be logged into the SEL

and the system may continue to function.

The OCP SEL for either instance would show:

P4208CP4MHGC

P4208CP4MHGC

R2208BB4GC

R2208GZ4GS9

P4208XXMHDR

P4208IP4LHGC

R2208GL4DS9

R2208IP4LHPC

P4208XXMHEN

P4208XXMHDR

R2208GL4GS

R2216GZ4GCLX

P4208XXMHGR

P4208XXMHEN

R2208GZ4GC

R2216IP4LHPC

P4216XXMHGC

P4208XXMHGC

R2208GZ4GS9

R2224GZ4GCSAS

P4216XXMHJC

P4208XXMHGR

R2208IP4LHPC

R2224IP4LHPC

P4208XXMHDRNA

P4216IP4LHJC

R2216BB4GC

R2224IP4LHPC9

P4208XXMHENNA

P4216IP4LHKC

R2216GZ4GCLX

P4208XXMHGRNA

P4216XXMHEN

R2224BB4GCSAS

P4216XXMHJCNA

P4216XXMHGC

R2224GZ4GCSAS

P4208XXMHDRNA

P4216XXMHGR

R2224IP4LHPC9

P4208XXMHENNA

P4216XXMHJC

R2208GL4DS9

P4208XXMHGCNA

P4224IP4LHKC

R2208GL4GS

P4216XXMHJCNA

R2208GZ4GC

Summary of content (4 pages)

PAGE 1
This Technical Advisory describes an issue which may or may not affect the customer’s product Intel Technical Advisory TA-1040-01 5200 NE Elam Young Parkway Hillsboro, OR 97124 November 01, 2013 Customers may experience an Over Current Protection (OCP) fault associated with certain Hot Swap Back Planes (HSBP) that can result in damage to the HSBP.
PAGE 2
Text dump: SensorName:Pwr Unit Status Sensor Type:Power Unit suffered a failure –Asserted Description: reports the power unit has Hex dump: GID:0020 ER:04 ST:09 S#:01 ET:6F ED:06 FF FF Depending on the severity of the short the HSBP may exhibit various levels of damage ranging from discoloration to an exothermic event contained within the chassis. Root Cause There was an excursion with the laminate used in a specific lot code of the HSBP bare fabs.
PAGE 3
HSBP Serial Number Label (Picture) Please contact Intel using your normal warranty process, indicating that you are calling regarding TA/AA # 1040-x. Have the following information when you call: the serial number(s) of the affected board(s) and the part number of the affected item needed. . Please contact your Intel Sales Representative if you require more specific information about this issue. INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS.
PAGE 4
PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined".