Assembling Intel Reference Components for the Intel® Pentium® 4 Processor in 478-Pin Package September 2001 Order Number: 298590-001 Copyright © 2001, Intel Corporation 1
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Thermal Mechanical Solutions for the Intel® Pentium® 4 Processor in the 478-Pin Package Intel has developed a reference design for OEM solutions. This reference design provides a baseline for OEM thermal solutions. OEMs are responsible for all design, sourcing, and validation of components in their system configuration. Reference designs for other variations of the Intel® Pentium® 4 Processor in the 478-pin package form factor may differ.
mPGA478 Platforms Mechanical Reference Solution Benefits This solution provides structural robustness to assure mechanical and electrical integrity of the motherboard during shock and vibration events(**) described in the Intel® Pentium® 4 Processor in the 478Pin Package Thermal Design Guidelines available on http://www.developer.intel.com/design/pentium4 website .
Intel Thermal Mechanical Solutions for the Intel® Pentium® 4 Processor in the 478-Pin Package Heatsink attach clips Heatsink Shroud and fan assembly Retention Mechanism Intel Reference heatsink assembly Uses reference RM and clip Boxed Intel processor heatsink assembly Changes in enabled components of the Reference Design or Boxed Processor assembly must be qualified by the system vendor. Intel reference designs were tested in conjunction with the reference MCH heatsink assembly.
Assembly Steps Overview Intel Reference Design Example Whenever possible, it is recommended to attach the board to the chassis before installing the heatsink. The clip, heatsink, fan, and shroud should arrive from the supplier as an assembly. Different heatsinks may use different clips This assembly process is valid for the Intel Reference components only. The heatsink should have TIM (thermal interface material) pre-applied to its base.
Board Bow after Assembly Intel µATX Board and Intel Reference Design The reference mechanical design for mPGA478 platforms is designed to place a compressive load on the CPU package and socket. It is normal to observe a bow to the board as shown below in the case of an Intel board and the Intel reference design. The level of bow depends on the motherboard material properties and component layout.
Assembly Steps Overview Boxed Intel® Processor Example Whenever possible, it is recommended to attach the board to the chassis before installing the heatsink. The clip, heatsink, fan, and shroud arrive as an assembly. This assembly process is valid for the Boxed Intel® Processor components only. The heatsink has TIM (thermal interface material) pre-applied to its base. Ensure that clip levers are in open position prior to installation on the motherboard.
Board Bow after Assembly Boxed Intel® Processor Example The boxed Intel® processor mechanical design for mPGA478 platforms is designed to place a compressive load on the CPU package and socket. It is normal to observe a bow to the board as shown below in the case of an Intel board and boxed Intel processor solution. The level of bow depends on the motherboard material properties and component layout.
Part numbers may change. Make sure you are using the latest revision available. *Other names and brands may be claimed as the property of others.
Boxed Intel® Processor Enabling Information The fan heatsink assembly for the boxed Intel® Pentium® 4 processor in the 478-pin package currently comes in two different versions: Sanyo* A38001-001 Nidec* A42816-001 The clip is delivered within the box, and should be used exclusively with these assemblies. *Other names and brands may be claimed as the property of others.
Conclusion This presentation provides basic information on how to manufacture with the Intel reference thermal mechanical design and the boxed Intel® processor solution available for the Intel® Pentium® 4 processor in the 478-pin package. Contact your local Intel representative for any further information.
