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Material Declaration Data Sheet
Model: Server System MFSYS25, MFSYS35 Manufacturer: Intel Corporation
Note: This declaration applies to all associated product codes noted on Page 2
Lead Free (Pb) Product: No Date: February 27, 2009
Restriction on Hazardous Substances (RoHS) Compliance
RoHS Definition
• Quantity limit of 0.1% by mass (1000PPM) for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated
Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE)
• Quantity limit of 0.01% by mass (100 PPM) for: Cadmium
Intel understands RoHS requires: Lead and other materials banned in the RoHS Directive are either (1) below all applicable
substance thresholds as proposed by the EU or (2) an approved/pending exemption applies. (Note: RoHS implementing details
are not fully defined and may change.)
RoHS Declaration
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Lead in glass of cathode ray tubes, electronic components and fluorescent tubes.
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Lead as an alloying element in steel containing up to 0.35 % lead by weight.
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Lead as an alloying element in aluminum containing up to 0.4 % lead by weight.
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Lead as an alloying element in copper containing up to 4 % lead by weight.
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Lead in high melting temperature type solders (i.e. lead based alloys containing 85 % by weight or more lead)
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Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission as well as
network management for telecommunications.
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Lead in electronic ceramic parts (e.g. piezoelectronic devices).
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Lead used in compliant pin connector systems.
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Lead as a coating material for the thermal conduction module c-ring.
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Lead in optical and filter glass.
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Lead in solders consisting of more than two parts for the connection between the pins and the package of microprocessors with a lead content of
more than 80% and less than 85% by weight.
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Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
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Cadmium in optical and filter glass.
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Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under
Directive 91/338/EEC (*) amending Directive 76/769/EEC (**) relating to restrictions on the marketing and use of
certain dangerous substances and preparations.
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Lead in bronze bearing shells and brushes.
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Lead in printing inks for application of enamels on borosilicate glass
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Cadmium in printing inks for application of enamels on borosilicate glass
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Lead in Finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with NiFe lead frames and and lead in finishes of fine
pitch components other than connectors with a pitch of 0.65 mm or less with copper lead frames
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Lead in solders for the soldering to machined through hole discoidal and planar array ceramic capacitors
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Lead oxide in plasma display panels (PDP) and surface conduction electron emitter displays (SED) used in structural elements: notably in the front
and rear glass dielectric layer, the bus electrode, the black stripe, the address electrode, the barrier ribs, the seal frit, and frit ring as well as in print
pastes.
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Other
Where the product is declared to meet RoHS requirements, it has been verified to be in conformance with 2002/95/EC as we
currently understand the requirements. Intel has systems in place to verify conformance with all applicable environmental
requirements and to the best of our knowledge the information is true and correct.
INTEL ACCEPTS NO DUTY TO UPDATE THIS DECLARATION OR TO NOTIFY USERS OF THIS DECLARATION OF
UPDATES OR CHANGES TO THIS DECLARATION. INTEL SHALL NOT BE LIABLE FOR ANY DAMAGES, DIRECT OR
INDIRECT, CONSEQUENTIAL OR OTHERWISE, SUFFERED BY USERS OR THIRD PARTIES AS A RESULT OF THE USERS
RELIANCE ON INFORMATION IN THIS DECLARATION THAT HAS BEEN UPDATED OR CHANGED.