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Material Declaration Data Sheet
Product: Server Chassis SR1500/Server System SR1500AL Refresh Manufacturer: Intel Corporation
Date: September 28, 2007
Notes:
This declaration applies to all associated product codes noted on following pages
This product and its associated spares and accessories noted on following pages comply with the EU RoHS Directive 2002/95/EC.
Restriction on Hazardous Substances (RoHS) Compliance
RoHS Definition
• Quantity limit of 0.1% by mass (1000PPM) for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls
(PBB), Polybrominated Diphenyl Ethers (PBDE)
• Quantity limit of 0.01% by mass (100 PPM) for: Cadmium
Intel understands RoHS requires: Lead and other materials banned in the RoHS Directive are either (1) below all applicable
substance thresholds as proposed by the EU or (2) an approved/pending exemption applies. (Note: RoHS implementing
details are not fully defined and may change.)
RoHS Declaration
1. Lead in glass of cathode ray tubes, electronic components and fluorescent tubes.
2. Lead as an alloying element in steel containing up to 0.35 % lead by weight.
3. Lead as an alloying element in aluminum containing up to 0.4 % lead by weight.
4. Lead as an alloying element in copper containing up to 4 % lead by weight.
5. Lead in high melting temperature type solders (i.e. lead based alloys containing 85 % by weight or more lead)
6. Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching,
signaling, transmission as well as network management for telecommunications.
7. Lead in electronic ceramic parts (e.g. piezoelectronic devices).
8. Lead used in compliant pin connector systems.
9. Lead as a coating material for the thermal conduction module c-ring.
10. Lead in optical and filter glass.
11. Lead in solders consisting of more than two parts for the connection between the pins and the package of
microprocessors with a lead content of more than 80% and less than 85% by weight.
12. Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated
circuit Flip Chip packages.
13. Cadmium in optical and filter glass.
14. Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under
Directive 91/338/EEC (*) amending Directive 76/769/EEC (**) relating to restrictions on the marketing and use of
certain dangerous substances and preparations.
15. Lead in bronze bearing shells and brushes.
16. Other
Where the product is declared to meet RoHS requirements, it has been verified to be in conformance with
2002/95/EC as we currently understand the requirements. Intel has systems in place to verify
conformance with all applicable environmental requirements and to the best of our knowledge the
information is true and correct.
INTEL ACCEPTS NO DUTY TO UPDATE THIS DECLARATION OR TO NOTIFY USERS OF THIS DECLARATION
OF UPDATES OR CHANGES TO THIS DECLARATION. INTEL SHALL NOT BE LIABLE FOR ANY DAMAGES,
DIRECT OR INDIRECT, CONSEQUENTIAL OR OTHERWISE, SUFFERED BY USERS OR THIRD PARTIES AS A
RESULT OF THE USERS RELIANCE ON INFORMATION IN THIS DECLARATION THAT HAS BEEN
UPDATEDOR CHANGED.