Dual-Core Intel® Xeon® processor LV and ULV Thermal Design Guide August 2006 Reference Number: 311374-002
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Contents 1.0 Introduction .............................................................................................................. 6 1.1 Design Flow ........................................................................................................ 6 1.2 Definition of Terms ..............................................................................................7 1.3 Reference Documents .......................................................................................... 8 1.
5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 Package Dimensions (Front View) ...............................................................................12 Dimension Information for Package.............................................................................13 Package Dimensions (Top and Side View: Two of Two) ..................................................14 Package Dimensions (Bottom View: Two of Two) ..........................................................
Revision History Date Revision March 2006 001 Initial public release August 2006 002 Added support for the Dual-Core Intel® Xeon® Processor ULV.
Introduction 1.0 Introduction The power dissipation of electronic components has risen along with the increase in complexity of computer systems. To ensure quality, reliability, and performance goals are met over the product’s life cycle, the heat generated by the device must be properly dissipated. Typical methods to improve heat dissipation include selective use of airflow ducting and/or the use of heatsinks.
Introduction Figure 1. Thermal Design Process Step 1: Thermal Simulation • Package Level Thermal Models • Thermal Model User’s Guide Step 2: Heatsink Design and Selection • Reference Heatsinks • Reference Mounting Hardware • Vendor Contacts Step 3: Thermal Validation • Thermal Testing Software • Thermal Test Vehicle • User Guides 1.2 Definition of Terms Table 1. Definition of Terms Term CFM DP FCPGA LFM LV PCB TJUNCTION MAX Definition Volumetric airflow rate in cubic feet per minute.
Introduction 1.3 Reference Documents The reader of this specification should also be familiar with material and concepts presented in the following documents: • Intel® Mobile Processor Micro-FCPGA Socket (mPGA479M) Design Guidelines • Dual-Core Intel® Xeon® processor LV and ULV Datasheet Note: Unless otherwise noted, these documents are available through your Intel field sales representative. 1.
Package Information 2.0 Package Information The component utilizes a 35 mm x 35 mm, micro FCPGA package (see Figure 2 through Figure 8). The data is provided for reference only. Refer to the device’s most recent datasheet for up-to-date data. In the event of conflict, the device’s datasheet supersedes data shown. The processor connects to the baseboard through a 479-pin surface mount, zero insertion force (ZIF) socket.
Package Information Figure 3. Package Dimensions (Top and Side View: One of Two) Notes: 1. Dimensions are in millimeters [inches]. 2. Refer to Figure 6 for details.
Package Information Figure 4. Package Dimensions (Bottom View: One of Two) Notes: 1. Dimensions are in millimeters [inches]. 2. Refer to Figure 6 for details.
Package Information Figure 5. Package Dimensions (Front View) Notes: 1. Dimensions are in millimeters [inches]. 2. Refer to Figure 6 for details.
Package Information Figure 6.
Package Information Figure 7. Package Dimensions (Top and Side View: Two of Two) Notes: 1. Dimensions are in millimeters [inches].
Package Information Figure 8. Package Dimensions (Bottom View: Two of Two) Notes: 1. Dimensions are in millimeters [inches].
Thermal Specifications 3.0 Thermal Specifications 3.1 Thermal Design Power The Thermal Design Power (TDP) specification is listed in Table 2. Heat transfer through the micro FCPGA package and into the base board is negligible. The cooling capacity without a thermal solution is also limited, so Intel recommends the use of a heatsink for all usage conditions. 3.2 Maximum Allowed Component Temperature The device must maintain a maximum temperature at or below the value specified in Table 2.
Mechanical Specifications 4.0 Mechanical Specifications 4.1 Package Mechanical Requirements The package level requirement are detailed in Section 2.0 including the maximum pressure allowed on the bare die package. More information may be available in the Dual-Core Intel® Xeon® processor LV and ULV Datasheet. 4.2 Package Keep-Out Zones Requirements The heatsink should not touch the package in the areas shown in Figure 7.
Mechanical Specifications Figure 9. Board Level Primary Side Keep-Out Zone Requirements X Y Y Notes: 1. Dimensions are in millimeters [inches]. 2. X and Y depend on the dimensions of the heatsink.
Mechanical Specifications Figure 10. Board Level Secondary Side Keep-Out Zone Requirements Notes: 1. Dimensions are in millimeters [inches].
Thermal Solution Requirements 5.0 Thermal Solution Requirements 5.1 Characterizing the Thermal Solution Requirement The idea of a “thermal characterization parameter” Ψ (pronounced Psi), is a convenient way to characterize the performance needed for the thermal solution and to compare thermal solutions in identical situations (i.e., heating source, local ambient conditions, etc.).
Thermal Solution Requirements ΨSA is a measure of the thermal characterization parameter from the bottom of the heatsink to the local ambient air. ΨSA is dependent on the heatsink material, thermal conductivity, and geometry. It is also strongly dependent on the air velocity through the fins of the heatsink. Figure 11 illustrates the combination of the different thermal characterization parameters. Figure 11.
Thermal Solution Requirements If the local processor ambient temperature is relaxed to 35 °C, the same calculation can be carried out to determine the new case-to-ambient thermal resistance: ΨJA = o TJ − TLA 100 − 35 = = 2.09 C W TDP 31 It is evident from the above calculations that a reduction in the local ambient temperature has a significant effect on the junction-to-ambient thermal resistance requirement.
Reference Thermal Solutions 6.0 Reference Thermal Solutions Intel has developed reference thermal solutions designed to meet the cooling needs of the processor in embedded form factor applications. This chapter describes the overall requirements for the reference thermal solution including critical-to-function dimensions, operating environment, and verification criteria.
Reference Thermal Solutions Figure 12. CompactPCI* Reference Heatsink Assembly 6.2.1 Keep-Out Zone Requirements The keep-out zone requirements on the PCB to use this heatsink are detailed in Appendix A, “Reference Heatsink”. It is critical for the board designer to allocate space on the board for the heatsink since it extends beyond the footprint of the socket. 6.2.2 Thermal Performance The CompactPCI* reference heatsink should be made from copper to achieve the necessary thermal performance.
Reference Thermal Solutions Figure 13. CompactPCI* Reference Heatsink Thermal Performance vs. Volumetric Airflow Rate 6.3 AdvancedTCA* Reference Heatsink The reference thermal solution compatible with the AdvancedTCA* form factor is designed assuming a maximum ambient temperature (as measured outside the chassis) of 40 °C with a minimum volumetric airflow rate through the AdvancedTCA slot of 30 CFM.
Reference Thermal Solutions 6.3.1 Mechanical Design The AdvancedTCA reference thermal solution is shown in Figure 14. The maximum component height for this form factor is 21.33 mm, so the maximum heatsink height is constrained to 16.27 mm. The heatsink uses the fastener assembly (refer to Section 6.2) to mount to the PCB. Detailed drawings of this heatsink are provided in Appendix B, “Mechanical Drawings”. Figure 14. AdvancedTCA* Reference Heatsink Assembly * 6.3.
Reference Thermal Solutions Figure 15. AdvancedTCA* Reference Heatsink Thermal Performance vs. Volumetric Airflow Rate 6.4 1U+ Reference Heatsink The reference thermal solution compatible with the 1U and larger form factor is designed assuming a maximum ambient temperature (as measured outside the chassis) of 40 °C with a minimum volumetric airflow rate through the heatsink fins of 5 CFM.
Reference Thermal Solutions Figure 16. 1U Reference Heatsink Assembly 6.4.2 Keep-Out Zone Requirements The keep-out zone requirements on the PCB to use this heatsink are detailed in Appendix B, “Mechanical Drawings”. It is critical for the board designer to allocate space on the board for the heatsink since it extends beyond the footprint of the socket. 6.4.3 Thermal Performance The 1U reference heatsink should be made from copper to achieve the necessary thermal performance.
Reference Thermal Solutions Figure 17. 1U Reference Heatsink Thermal Performance versus Volumetric Airflow Rate 6.5 Thermal Interface Material (TIM) The thermal interface material provides improved conductivity between the die and heatsink. It is important to understand and consider the impact of the interface between the die and heatsink base to the overall thermal solution.
Reference Thermal Solutions It is important to realize that the thermal interface material degrades over time and exposure to environmental effects. Figure 13, Figure 15, and Figure 17 show the junction-to-ambient thermal performance assuming the “end of life” performance for the reference TIM. End of life usually occurs in to 5 to 7 years. Actual test data may differ from the values shown since the TIM thermal resistance will be comparable to the “beginning of life” impedance.
Reference Thermal Solutions Figure 18.
Thermal Metrology 7.0 Thermal Metrology The system designer must make measurements to accurately determine the performance of the thermal solution. The heatsink designs must be validated using a thermal test vehicle. The thermal test vehicle is a device that simulates the thermal characteristics of the processor. It is also recommended to perform a final verification test of the heatsink with an actual processor in a real working environment.
Reliability Guidelines 8.0 Reliability Guidelines Each motherboard, heatsink and attach combination may vary the mechanical loading of the component. The user should carefully evaluate the reliability of the completed assembly prior to use in high volume. Some general recommendations are shown in Table 4. Table 4. Reliability Requirements Test Requirement Pass/Fail Criteria Mechanical Shock 50 g, board level, 11 msec, 3 shocks/axis Visual Check and Electrical Functional Test Random Vibration 7.
Thermal Solution Component Suppliers Appendix A Thermal Solution Component Suppliers A.1 Reference Heatsink Table 5. Reference Heatsink Part Supplier (Part Number) AdvancedTCA* Heatsink CompactPCI* Heatsink ECC-00177-01-GP ECC-00178-01-GP 1U Passive Heatsink ECC-00179-01-GP Active Heatsink EEP-N41CS-I1-GP Thermal Interface Material PCM45F Note: PCM45F Contact Information Cooler Master* Wendy Lin 510-770-8566, x211 Wendy@coolermaster.com Honeywell* Paula Knoll 858-279-2956 paula.
Mechanical Drawings Appendix B Mechanical Drawings Table 6 lists the mechanical drawings included in this appendix. Table 6.
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