R 603 Pin Socket Design Guidelines Order Number: 249672-001 May 2001
603 Pin Socket Design Guidelines R Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document.
603 Pin Socket Design Guidelines R Contents 1. Introduction................................................................................................................................... 6 1.1. 1.2. 1.3. 2. Processor Pin Field Description: .................................................................................................. 8 2.1. 2.2. 3. Processor pin field without Heatsink:............................................................................... 8 Pin Dimensions:..............
603 Pin Socket Design Guidelines R 4.4. 4.5. 4.6. 4.7. 5. Environmental Requirements..................................................................................................... 24 5.1. 5.2. 5.3. 5.4. 5.5. 6. 4.3.1. Design Procedure for Inductance Measurements:...................................... 22 Pin-to-Pin Capacitance:................................................................................................. 23 Dielectric Withstand Voltage ............................................
603 Pin Socket Design Guidelines R Figures Figure 3-1: Typical Reflow Profile for 63Sn/37Pb solder.........................................................14 Figure 4-1: Methodology for Measuring Total Electrical Resistance. ......................................17 Figure 4-2: Methodology for Measuring Electrical Resistance of the Jumper.........................17 Figure 4-3: Electrical Resistance Fixtures superimposed. ......................................................
03 Pin Socket Design Guidelines R 1. 1.1. Introduction Objective: This document defines a ZIF (Zero Insertion Force) socket intended for workstation and server platforms based on future Intel microprocessors. The socket provides I\O, power and ground contacts. The socket must be low cost, low risk, robust, high volume manufacturable (HVM), and multisourceable. The socket has 603 contacts with solder balls/surface mount features for surface mounting with the motherboard.
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603 Pin Socket Design Guidelines R 2. Processor Pin Field Description: Information provided in this section is to ensure dimensional compatibility of the 603 Pin Socket with that of the Intel Xeon processor. The processor must be inserted into the 603 Pin Socket with zero insertion force when the socket is not actuated. 2.1. Processor pin field without Heatsink: The outline of the processor that can be used with the 603 Pin Socket is illustrated in Figure 9-1 (Appendix A.1).
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603 Pin Socket Design Guidelines R 3. Mechanical Requirements 3.1. Pin-Out and Orientation Diagram: The pin-out for the 603 Pin Socket is shown in Figure 9-2 (Appendix A.2). This diagram is viewed from the TOP of the SOCKET. 3.2. Mechanical Supports: A retention system needs to isolate any load in excess of 50lbf, compressive, from the socket during the shock and vibration conditions outlined in Sections 5.
603 Pin Socket Design Guidelines R 3.3.3.2. Lock (closed) and Unlock (open) Markings For lock an unlock positions on the socket they are to be marked with the universal symbol of the locked and unlocked pictures. Clear indicator marks must be located on the actuation mechanism that identifies the lock (closed) and unlock (open) positions of the cover as well as the actuation direction. These marks should still be visible after a package is inserted into the socket. Lock (closed) 3.3.3.3.
603 Pin Socket Design Guidelines R 3.3.4.3. Contact Area Plating: 76.2µmm (min) gold plating over 127µmm (min) nickel underplate in critical contact areas (area on socket contacts where processor pins will mate). No contamination by solder in the contact area is allowed during solder reflow. 3.3.4.4. Solder Ball/Surface Mount Feature Attachment Area Plating: 381µmm (min) Tin/Lead (typically 85±5Sn/15Pb). 3.3.4.5. Solder Ball/Surface Mount Feature Characteristics: Tin/Lead (63/37 ± 0.5% Sn),. 3.3.4.6.
603 Pin Socket Design Guidelines R actuation must meet or exceed SEMI S8-95 Safety Guidelines for Ergonomics/Human Factors Engineering of Semiconductor Manufacturing Equipment, example Table R2-7 (Maximum Grip Forces) 3.5.3. Visual Aids: The socket top will have markings identifying open and closed positions for the handle. The socket top will have markings identifying Pin 1. This marking will be represented by a triangular symbol. See Figure 9-5 (Appendix A.5). 3.5.4.
603 Pin Socket Design Guidelines R Figure 3-1: Typical Reflow Profile for 63Sn/37Pb solder 3.6.3. Overall Assembly Sequence: Step 1 - Mount 603 Pin Socket to the motherboard using a surface mount process Step 2 - Install retention mechanism Step 3 - Install processor Step 4 - Install heat sink 3.7. Critical To Function Dimensions: The 603 Pin Socket shall accept a 603 pin processor pin field. All dimensions are Metric.
603 Pin Socket Design Guidelines R Dimension Index Minimum mm Solder Ball Maximum mm 0.20 True Position of Balls N/A 0.41 True Position of Lead / Surface Mount Feature (X,Y) N/A 0.41 Actuation Distance (Cover Travel) N/A 1.52 Cover Thickness Design Specific Design Specific Cover Hole Diameter (Must guarantee ZIF) Design Specific Design Specific Cover Hole Virtual Condition (Pattern Locating) 0.
603 Pin Socket Design Guidelines R 4. Electrical Requirements Table 4-1: Electrical Requirements for Sockets *1 Mat11 loop inductance, Lloop <4.33nH Refer to Table 4-2 section 1 2 Mated partial mutual inductance, L NA Refer to Table 4-2 section 2a *3 Maximum mutual capacitance, C <1pF Refer to Table 4-2 section 3 4 Maximum Ave Contact Resistance ≤ 25mΩ Refer to Table 4-2 section 4 Refer to Section 4.
603 Pin Socket Design Guidelines R Socket electrical requirements are measured from the socket-seating plane of the processor test vehicle (PTV) to the component side of the socket PCB to which it is attached. All specifications are maximum values (unless otherwise stated) for a single socket pin, but includes effects of adjacent pins where indicated. Pin and socket inductance includes exposed pin from mated contact to bottom of the processor pin field. 4.1.
603 Pin Socket Design Guidelines R Figure 4-3 shows the resistance test fixtures separately and superimposed. The upper left figure (blue traces) is the interposer. The upper right figure(red traces) is the baseboard. There are 31 daisy chain configurations on resistance test board. The bottom center view is the two pa1ts superimposed. Table 4-3 shows these configurations with the number of pins per each chain and netlist.
603 Pin Socket Design Guidelines R Table 4-3 DC Endpoints Edgefingers: Hi Edgefingers: Low Daisy Chain # of pins per chain Hi Low +I +V -V -I 1 24 A1 AD1 A61 A62 A84 A85 2 26 A2 AE3 A59 A60 A88 A89 3 24 A3 AD3 A57 A58 A86 A87 4 26 A4 AE5 A55 A56 A92 A93 5 24 A5 AD5 A53 A54 A90 A91 6 26 A6 AE7 A51 A52 A96 A97 7 24 A7 AD7 A49 A50 A94 A95 8 26 A8 AE9 A47 A48 A100 A101 9 24 A9 AD9 A45 A46 A98 A99 10 12 A10 AE10 A43 A44 A10
603 Pin Socket Design Guidelines R 4.2. Determination of Maximum Electrical Resistance: This section provides a guideline for the instruments used to take the measurements. Note: The instrument selection should consider the guidelines in EIA 364-23A. a) These measurements use a 4-wire technique, where the instruments provide two separate circuits. One is a precision current source to deliver the test current.
603 Pin Socket Design Guidelines R Probing pads surface 40 mils Interposer No features or plane on this layer Socket Interposer pin No plane on this layer Motherboard Short all L pins (using a solid plane) Full plane on this layer No features or plane on this layer Interposer Interposer shoulder Short all L pins (using a solid plane) Motherboard Figure 4-4: Inductance Measurement Fixture Cross-Section A B 1 4 AC AD 5 8 2 1 2 3 6 7 29 30 Figure 4-5: Inductance and Capacitance Fixture 21
603 Pin Socket Design Guidelines R 4.3.1. Design Procedure for Inductance Measurements: The measurement equipment required to perform the validation is: • Equipment - HP8753D Vector Network Analyzer or equivalent • Robust Probe Station (GTL4040) or equivalent • Probes - GS1250 & GSG1250 Air-Co-Planar or equivalent • Calibration – Cascade Calibration Substrates or equivalent • Measurement objects - Interposers, Sockets, Motherboards Measurement Steps: a) Equipment setup 1.
603 Pin Socket Design Guidelines R L sandwich . 4. Calculate 5. For each socket unit, calculate L socket = L socket assembly − L sandwich It means L sandwich will be subtracted from each L socket assembly and the result will be compared with spec value for each individual socket unit. 4.4. Pin-to-Pin Capacitance: Pin-to-pin capacitance shall be measured using configuration 4, with the motherboard not connected and only the measurements with the interposer mounted on the socket will be taken.
603 Pin Socket Design Guidelines R 5. Environmental Requirements Design, including materials, shall be consistent with the manufacture of units that meet the following environmental reference points. The reliability targets in this section are based on the expected field use environment for a desktop product. The test sequence for new sockets will be developed using the knowledge-based reliability evaluation methodology, which is acceleration factor dependent.
603 Pin Socket Design Guidelines R Use Environment Shipping & Handling Speculative Stress Condition Mechanical Shock 50g trapezoidal profile; 170”/sec Velocity change; 11 msec duration pulse Shipping & Handling Random Vibration 3.13 gRMS, random, 5 Hz - 20 Hz .01 g2/Hz sloping up to .02 g2/Hz 20 Hz - 500 Hz .02 g2/Hz 5.1. Porosity Test 5.1.1.
603 Pin Socket Design Guidelines R 6. Validation Testing Requirements This section of the document outlines the tests that must be successfully completed in order for the supplier's socket to pass the design guidelines validation. It provides the test plan and procedure required for validation. 6.1. Applicable Documents: EIA-364-C. Intel Xeon Processor at 1.40 GHz, 1.50 GHz and 1.70 GHz1 (datasheet) Intel Xeon Processor Thermal Design Guidelines1 Note: 6.2.
603 Pin Socket Design Guidelines R Typical examples of significant changes include, but are not limited to, the following: Plastic material changes including base material or color; contact changes including base material, plating material or thickness; and design modifications. 6.7. Quality Assurance Requirements: The OEM’s will work with the socket supplier(s) they choose to ensure socket quality. 6.8. Socket Test Plan: 6.8.1.
603 Pin Socket Design Guidelines R 7.
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603 Pin Socket Design Guidelines R 8. Documentation Requirements The socket supplier shall provide Intel with the following documentation: • Multi-Line Coupled SPICE models for socket. • Product design guideline incorporating the requirements of these design guidelines. • Recommended board layout guidelines for the socket consistent with low cost, high volume printed circuit board technology.
9. Appendix A Appendixes R 9.1.
Figure 9-1. - Appendix A.
R Figure 9-2. - Appendix A.
Figure 9-3. - Appendix A.
R Figure 9-4. - Appendix A.
Figure 9-5. - Appendix A.
R 12.7 Max Centered 54.61 Max Centered Ideal Centerline of Socket on Motherboard Figure 9-6. - Appendix A.6 603 Pin Socket Keep-In Zone Motherboard Component Keep in 3.81 Max Height Socket keep in 6.35 Max Height Center Pivot Actuation Point Ideal Centerline of Socket on Motherboard Lever Keep in 603 Pin Socket Design Guidelines 13.61 Centered 4.0m 2.49 64.36 Max Centered 12.60 37 Lever Closed Position 69.
