Dual-Core Intel® Xeon® Processor 2.
Notice: This document contains information on products in the design phase of development. The information here is subject to change without notice. Do not finalize a design with this information. Contact your local Intel sales office or your distributor to obtain the latest specification before placing your product order. INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS.
Contents 1 Introduction......................................................................................................................... 7 1.1 Objective ............................................................................................................... 7 1.2 Scope .................................................................................................................... 7 1.3 References ............................................................................................
Figures 2-1 2-2 2-3 2-4 2-5 2-6 2-7 2-8 2-9 2-10 2-11 2-12 2-13 2-14 2-15 2-16 2-17 2-18 A-1 A-2 A-3 A-4 A-5 A-6 A-7 A-8 A-9 A-10 A-11 A-12 A-13 A-14 A-15 A-16 A-17 C-1 C-2 4 Dual-Core Intel® Xeon® Processor 2.80 GHz Mechanical Drawing................... 13 Thermal Profile Diagram ..................................................................................... 16 TCONTROL and Thermal Profile Interaction ..................................................... 17 Dual Thermal Profile Diagram ............
Tables 1-1 1-2 2-1 2-2 2-3 2-4 2-5 2-6 2-7 A-1 D-1 References ............................................................................................................ 7 Terms and Definitions ........................................................................................... 8 Processor Mechanical Parameters Table ........................................................... 11 Intel Reference Heatsink Performance Targets for the Dual-Core Intel Xeon Processor 2.80 GHz ............................
Revision History Reference Number Revision Number 309160 -001 Description • Initial release of the document. Date October 2005 § 6 Dual-Core Intel® Xeon® Processor 2.
1 Introduction 1.1 Objective The purpose of this guide is to describe the reference thermal solution and design parameters required for the Dual-Core Intel® Xeon® processor 2.80 GHz. It is also the intent of this document to comprehend and demonstrate the processor cooling solution features and requirements.
Introduction Table 1-1. References (Sheet 2 of 2) Document Comment Thin Electronics Bay Specification (A Server System Infrastructure (SSI) Specification for Thin Servers www.ssiforum.com European Blue Angel Recycling Standards http://www.blauer-engel.de NOTE: Contact your Intel field sales representative for the latest revision and order number of this document. 1.4 Definition of Terms Table 1-2.
Introduction Table 1-2. Terms and Definitions (Sheet 2 of 2) Term Description Thermal Profile Line that defines case temperature specification of a processor at a given power level. TIM Thermal Interface Material: The thermally conductive compound between the heatsink and the processor case. This material fills the air gaps and voids, and enhances the transfer of the heat from the processor case to the heatsink. TLA The measured ambient temperature locally surrounding the processor.
Introduction 10 Dual-Core Intel® Xeon® Processor 2.
2 Thermal/Mechanical Reference Design 2.1 Mechanical Requirements The mechanical performance of the processor cooling solution must satisfy the requirements described in this section. 2.1.1 Processor Mechanical Parameters Table 2-1. Processor Mechanical Parameters Table Parameter Minimum Maximum Unit Volumetric Requirements and Keepouts Refer to drawings in Appendix A Heatsink Mass Static Compressive Load Dynamic Compressive Load 1000 g 2.
Thermal/Mechanical Reference Design 2.1.2 Dual-Core Intel® Xeon® Processor 2.80 GHz Package The Dual-Core Intel® Xeon® processor 2.80 GHz is packaged using the flip-chip micro pin grid array 4 (FC-mPGA4) package technology. Please refer to the Dual-Core Intel® Xeon® Processor 2.80 GHz Datasheet for detailed mechanical specifications. The Dual-Core Intel Xeon processor 2.80 GHz Mechanical drawing, Figure 2-1, provides the mechanical information for Dual-Core Intel Xeon processor 2.80 GHz.
Thermal/Mechanical Reference Design Figure 2-1. Dual-Core Intel® Xeon® Processor 2.80 GHz Mechanical Drawing The package includes an integrated heat spreader (IHS). The IHS transfers the non-uniform heat from the die to the top of the IHS, out of which the heat flux is more uniform and spread over a larger surface area (not the entire IHS area). This allows more efficient heat transfer out of the package to an attached cooling device. The IHS is designed to be the interface for contacting a heatsink.
Thermal/Mechanical Reference Design The processor connects to the baseboard through a 604-pin surface mount, zero insertion force (ZIF) socket. A description of the socket can be found in the mPGA604 Socket Design Guidelines. The processor package has mechanical load limits that are specified in the processor datasheet and in Table 2-1. These load limits should not be exceeded during heatsink installation, removal, mechanical stress testing, or standard shipping conditions.
Thermal/Mechanical Reference Design 2.2 Thermal Requirements The operating thermal limits of the processor are defined by the Thermal Profile. The intent of the Thermal Profile specification is to support acoustic noise reduction through fan speed control and ensure the long-term reliability of the processor. This specification requires that the temperature at the center of the processor IHS, known as (TCASE) remains within a certain temperature specification.
Thermal/Mechanical Reference Design Figure 2-2. Thermal Profile Diagram TTCASE MAX CASEMAX CASE MAX TCASETMAX @ Pcontrol_base Thermal Profile @Pcontrol_Base TCASE Pcontrol_Base TDP Power The higher end point of the Thermal Profile represents the processor’s TDP and the associated maximum case temperature (TCASEMAX).
Thermal/Mechanical Reference Design Dual-Core Intel Xeon processor 2.80 GHz, the TCONTROL value is obtained by reading a processor model specific register (MSR) and adding this offset value to a base value. The equation for calculating TCONTROL is: Equation 2-2. TCONTROL = TCONTROL_BASE + Offset Where: TCONTROL_BASE = Offset = A fixed base value defined for a given processor generation as published in the processor datasheet.
Thermal/Mechanical Reference Design Refer to Section 2.3.1 for the implementation of the TCONTROL value in support of fan speed control (FSC) design to achieve better acoustic performance. 2.2.3 Dual Thermal Profile Concept for the Dual-Core Intel Xeon Processor 2.80 GHz The Dual-Core Intel Xeon processor 2.80 GHz is designed to go into various form factors, including the volumetrically constrained 1U and custom blade form factors. Due to certain limitations of such form factors (i.e.
Thermal/Mechanical Reference Design Although designing to Thermal Profile B results in increased TCASE temperatures compared to Thermal Profile A at a given power level, both of these Thermal Profiles ensure that Intel’s longterm processor reliability requirements are satisfied. In other words, designing to Thermal Profile B does not impose any additional risk to Intel’s long-term reliability requirements.
Thermal/Mechanical Reference Design Table 2-2. Intel Reference Heatsink Performance Targets for the Dual-Core Intel Xeon Processor 2.80 GHz 2.2.5 Thermal Solution Type Target Thermal Profile TLA Assumption (°C) TDP (W) Thermal Performance Target, Ψca (Mean + 3σ) (°C/W) 2U+ Form Factor Thermal Profile A 40°C 135 0.234 1U Form Factor Thermal Profile B 40°C 135 0.290 Altitude The reference heatsink solutions will be evaluated at sea level (0 meters).
Thermal/Mechanical Reference Design Figure 2-6. TCONTROL and Fan Speed Control MAX CASEMAX TTCASE TCASEMAX@T TCASE @CONTROL T CONTROL 2 Thermal Profile 1 TCASE @ TTCASE CASEMAX@ Pcontrol_base Pcontrol_base Fan speed control region Pcontrol_base Pcontrol Power TDP Once the TCONTROL value is determined as explained earlier, the thermal diode temperature reading from the processor can be compared to this TCONTROL value.
Thermal/Mechanical Reference Design θ (theta), is calculated using actual power dissipated between two points. Measuring actual power dissipated into the heatsink is difficult, since some of the power is dissipated via heat transfer into the socket and board. Be aware, however, of the limitations of lumped parameters such as Ψ when it comes to a real design. Heat transfer is a three-dimensional phenomenon that can rarely be accurately and easily modeled by lump values.
Thermal/Mechanical Reference Design Figure 2-7. Processor Thermal Characterization Parameter Relationships TLA ΨSA HEATSINK TS TIM PROCESSOR TCASE C IHS ΨCA ΨCS SOCKET 2.3.2.1 Example The cooling performance, ΨCA, is then defined using the principle of thermal characterization parameter described above: • Define a target case temperature TCASE-MAX and corresponding TDP at a target frequency, F, given in the processor datasheet. • Define a target local ambient temperature at the processor, TLA.
Thermal/Mechanical Reference Design Equation 2-7. ΨCA = (TCASE – TLA) / TDP = (68 – 40) / 85 = 0.33 °C/W It is evident from the above calculations that, a reduction in the local processor ambient temperature has a significant positive effect on the case-to-ambient thermal resistance requirement. 2.3.3 Chassis Thermal Design Considerations 2.3.3.
Thermal/Mechanical Reference Design effective heat transfer surface area by conducting heat out of the IHS and into the surrounding air through fins attached to the heatsink base. • The conduction path from the heat source to the heatsink fins - Providing a direct conduction path from the heat source to the heatsink fins and selecting materials with higher thermal conductivity typically improves heatsink performance.
Thermal/Mechanical Reference Design 2.4.3 Summary In summary, considerations in heatsink design include: • The local ambient temperature TLA at the heatsink, airflow (CFM), the power being dissipated by the processor, and the corresponding maximum TCASE. These parameters are usually combined in a single lump cooling performance parameter, ΨCA (case to air thermal characterization parameter). More information on the definition and the use of ΨCA is given in Section 2.4 and Section 2.3.2. • • • • • • 2.
Thermal/Mechanical Reference Design 2.4.4.2 Assembly Drawing Figure 2-8. Exploded View of CEK Thermal Solution Components The CEK reference thermal solution is designed to extend air-cooling capability through the use of larger heatsinks with minimal airflow blockage and bypass. CEK retention solution can allow the use of much heavier heatsink masses compared to the legacy limits by using a load path directly attached to the chassis pan.
Thermal/Mechanical Reference Design Refer to Appendix A for drawings of the heatsinks and CEK spring. The screws and standoffs are standard components that are made captive to the heatsink for ease of handling and assembly. Contact your Intel field sales representative for an electronic version of mechanical and thermal models of the CEK (Pro Engineer*, IGES and Icepak*, Flotherm* formats). Pro Engineer, Icepak and Flotherm models are available on Intel Business Link (IBL).
Thermal/Mechanical Reference Design Figure 2-9. 2U+ CEK Heatsink Thermal Performance 0.45 0.80 0.40 0.70 0.35 0.60 0.30 0.50 0.25 0.40 0.20 0.30 0.15 0.20 Mean Ψca = 0.1435 + 1.2225*CFM -0.9397 σ = 0.008 C/W 0.10 0.10 0.05 0 10 20 30 40 50 60 70 80 ∆P, inch water Ψca , C/W ∆P = 5.52e-05CFM2 + 5.24e-03CFM 90 0.00 100 CFM Through Fins If other custom heatsinks are intended for use with the Dual-Core Intel Xeon processor 2.
Thermal/Mechanical Reference Design 0.45 0.80 0.40 0.70 0.35 0.60 ∆P = 6.12e-04CFM2+ 1.59e-02CFM Ψca, C/W 0.30 0.50 0.25 0.40 0.20 0.30 -0.8135 MeanΨca = 0.1481 + 1.0692*CFM σ = 0.008 C/W 0.15 ∆P, inch water Figure 2-10. 1U CEK Heatsink Thermal Performance 0.20 0.10 0.10 0.05 0.00 0 10 20 30 40 50 CFM Through Fins 2.4.6 Thermal Profile Adherence The 2U+ CEK Intel reference thermal solution is designed to meet the Thermal Profile A for the Dual-Core Intel Xeon processor 2.80 GHz.
Thermal/Mechanical Reference Design Figure 2-11. 2U+ CEK Thermal Adherence to Dual-Core Intel Xeon Processor 2.80 GHz Thermal Profile A 90 80 TCASE MAX_B@ 70 Thermal Profile A y=0.211*x+43.1 TDP 60 TCASE MAX_B@ PCONTROL_BASE 2U+ CEK Reference Solution 50 y=0.
Thermal/Mechanical Reference Design Figure 2-12. 1U CEK Thermal Adherence to Dual-Core Intel Xeon Processor 2.80 GHz Thermal Profile B 90 TCASE MAX_B@ 80 70 TDP TCASE MAX_B@ Tcase [°C] PCONTROL_BASE Thermal Profile B y=0.261*x+44 60 1U CEK Reference Solution 50 y=0.290*x+40 40 30 20 10 0 0 10 20 30 40 50 PCONTROL_BASE 60 70 80 90 Power [W] 2.4.7 Components Overview 2.4.7.
Thermal/Mechanical Reference Design Figure 2-13. Isometric View of the 2U+ CEK Heatsink Note: Refer to Appendix A for more detailed mechanical drawings of the heatsink. Figure 2-14. Isometric View of the 1U CEK Heatsink Note: Refer to Appendix A for more detailed mechanical drawings of the heatsink. The function of the standoffs is to provide a bridge between the chassis and the heatsink for attaching and load carrying.
Thermal/Mechanical Reference Design performance of the heatsink due to air blockage. Any fastener (i.e. head configuration) can be used as long as it is of steel construction; the head does not interfere with the heatsink fins, and is of the correct length of 20.64 mm [0.8125 in.]. Although the CEK heatsink fits into the legacy volumetric keep-in, it has a larger footprint due to the elimination of retention mechanism and clips used in the older enabled thermal/mechanical components.
Thermal/Mechanical Reference Design 2.4.7.3 CEK Spring The CEK spring, which is attached on the secondary side of the baseboard, is made from 0.80 mm [0.0315 in.] thick 301 stainless steel half hard. Any future versions of the spring will be made from a similar material. The CEK spring has four embosses which, when assembled, rest on the top of the chassis standoffs. The CEK spring is located between the chassis standoffs and the heatsink standoffs.
Thermal/Mechanical Reference Design 2.4.8 Boxed Active Thermal Solution for the Dual-Core Intel Xeon Processor 2.80 GHz In addition to the 1U and 2U passive CEK heatsinks, Intel is developing an active heatsink solution. This heatsink solution is primarily designed to be used in a pedestal chassis where sufficient air inlet space is present and side directional airflow is not an issue. All three heatsinks will be offered as part of boxed Dual-Core Intel Xeon processor 2.80 GHz products.
Thermal/Mechanical Reference Design 2.4.8.1 Fan Power Supply The active heatsink includes a fan, which requires a +12 V power supply. Platforms must provide a matched fan power header to support the boxed processor. Table 2-6 contains specifications for the input and output signals at the heatsink fan connector. The fan outputs a SENSE signal, an open-collector output, which pulses at a rate of two pulses per fan revolution.
Thermal/Mechanical Reference Design Table 2-7. Fan Cable Connector Pin Out (Active CEK) Pin Number 2.4.8.2 Signal Color 1 Ground (Constant) Black 2 Power (+12V) Yellow 3 Signal: 2 pulses per revolution Green 4 Control Blue Systems Considerations Associated with the Active CEK This heatsink was designed to help pedestal chassis users to meet the thermal processor requirements without the use of chassis ducting.
A Mechanical Drawings The mechanical drawings included in this appendix refer to the thermal mechanical enabling components for the Dual-Core Intel Xeon processor 2.80 GHz Processor. Note: Intel reserves the right to make changes and modifications to the design as necessary. Table A-1.
Mechanical Drawings Figure A-1. 2U CEK Heatsink (Sheet 1 of 4) 40 Dual-Core Intel® Xeon® Processor 2.
Mechanical Drawings Figure A-2. 2U CEK Heatsink (Sheet 2 of 4) Dual-Core Intel® Xeon® Processor 2.
Mechanical Drawings Figure A-3. 2U CEK Heatsink (Sheet 3 of 4) 42 Dual-Core Intel® Xeon® Processor 2.
Mechanical Drawings Figure A-4. 2U CEK Heatsink (Sheet 4 of 4) Dual-Core Intel® Xeon® Processor 2.
Mechanical Drawings Figure A-5. CEK Spring (Sheet 1 of 3) 44 Dual-Core Intel® Xeon® Processor 2.
Mechanical Drawings Figure A-6. CEK Spring (Sheet 2 of 3) Dual-Core Intel® Xeon® Processor 2.
Mechanical Drawings Figure A-7. CEK Spring (Sheet 3 of 3) 46 Dual-Core Intel® Xeon® Processor 2.
Mechanical Drawings Figure A-8. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 1 of 6) Dual-Core Intel® Xeon® Processor 2.
Mechanical Drawings Figure A-9. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 2 of 6) 48 Dual-Core Intel® Xeon® Processor 2.
Mechanical Drawings Figure A-10. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 3 of 6) Dual-Core Intel® Xeon® Processor 2.
Mechanical Drawings Figure A-11. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 4 of 6) 50 Dual-Core Intel® Xeon® Processor 2.
Mechanical Drawings Figure A-12. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 5 of 6) Dual-Core Intel® Xeon® Processor 2.
Mechanical Drawings Figure A-13. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 6 of 6) 52 Dual-Core Intel® Xeon® Processor 2.
Mechanical Drawings Figure A-14. 1U CEK Heatsink (Sheet 1 of 4) C84175 Rev. 01 Dual-Core Intel® Xeon® Processor 2.
Mechanical Drawings Figure A-15. 1U CEK Heatsink (Sheet 2 of 4) C84175 Rev. 01 54 Dual-Core Intel® Xeon® Processor 2.
Mechanical Drawings Figure A-16. 1U CEK Heatsink (Sheet 3 of 4) Dual-Core Intel® Xeon® Processor 2.
Mechanical Drawings Figure A-17. 1U CEK Heatsink (Sheet 4 of 4) § 56 Dual-Core Intel® Xeon® Processor 2.
B Dual-Core Intel® Xeon® Processor 2.80 GHz Safety Requirements Heatsink and attachment assemblies shall be consistent with the manufacture of units that meet the safety standards: 1. UL Recognition-approved for flammability at the system level. All mechanical and thermal enabling components must be a minimum UL94V-2 approved. 2. CSA Certification. All mechanical and thermal enabling components must have CSA certification. 3. Heatsink fins must meet the test requirements of UL1439 for sharp edges.
Dual-Core Intel® Xeon® Processor 2.80 GHz Safety Requirements 58 Dual-Core Intel® Xeon® Processor 2.
C Quality and Reliability Requirements C.1 Intel Verification Criteria for the Reference Designs C.1.1 Reference Heatsink Thermal Verification The Intel reference heatsinks will be verified within specific boundary conditions based on the methodology described in Intel® Xeon® Processor Family Thermal Test Vehicle User’s Guide.
Quality and Reliability Requirements C.1.2.3 Shock Test Procedure Recommended performance requirement for a baseboard: • Quantity: 3 drops for + and – directions in each of 3 perpendicular axes (i.e. total 18 drops). • Profile: 50 G trapezoidal waveform, 11 ms duration, 4.32 m/sec minimum velocity change. • Setup: Mount sample board on test fixture. Figure C-2. Shock Acceleration Curve 60 Accelration (g) 50 40 30 20 10 0 0 2 4 6 8 10 12 Time (Milliseconds) C.1.2.
Quality and Reliability Requirements C.1.2.6 Recommended BIOS/Processor/Memory Test Procedures This test is to ensure proper operation of the product before and after environmental stresses, with the thermal mechanical enabling components assembled. The test shall be conducted on a fully operational baseboard that has not been exposed to any battery of tests prior to the test being considered.
Quality and Reliability Requirements 62 Dual-Core Intel® Xeon® Processor 2.
D Supplier Information D.1 Intel Enabled Suppliers The Intel reference solutions have been verified to meet the criteria outlined in Table D-1. Customers can purchase the Intel reference thermal solution components from the suppliers listed in Table D-1. Table D-1. Assembly CEK604-2U-01 Suppliers for the Dual-Core Intel Xeon Processor 2.
Supplier Information 64 Dual-Core Intel® Xeon® Processor 2.
