Datasheet
LT1083/LT1084/LT1085
17
108345fg
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
.170
(4.32)
MAX
.325
(8.255)
.580
(14.732)
.560
(14.224)
.170 – .2OO
(4.32 – 5.08)
MOUNTING HOLE
.115 – .145
(2.92 – 3.68)
DIA
.580 – .6OO
(14.73 – 15.24)
.830 – .870
(21.08 – 22.10)
.780 – .800
(19.81 – 20.32)
.620 – .64O
(15.75 – 16.26)
.215
(5.46)
BSC
.113 – .123
(2.87 – 3.12)
.042 – .052
(1.07 – 1.32)
.074 – .084
(1.88 – 2.13)
.187 – .207
(4.75 – 5.26)
.060 – .080
(1.52 – 2.03)
18° – 22°
3° – 7°
.087 – .102
(2.21 – 2.59)
.020 – .040
(0.51 – 1.02)
EJECTOR PIN MARKS
.105 – .125
(2.67 – 3.18)
DIA
P3 0801
.098
(2.489)
.124
(3.149)
.700
(17.780)
.275
(6.985)
BOTTOM VIEW OF TO-3P
HATCHED AREA IS SOLDER PLATED
COPPER HEAT SINK
.100
(2.540)
BSC
.028 – .038
(0.711 – 0.965)
T3 (TO-220) 0801
.045 – .055
(1.143 – 1.397)
.165 – .180
(4.191 – 4.572)
.095 – .115
(2.413 – 2.921)
.013 – .023
(0.330 – 0.584)
.520 – .570
(13.208 – 14.478)
.980 – 1.070
(24.892 – 27.178)
.218 – .252
(5.537 – 6.401)
.050
(1.270)
TYP
.147 – .155
(3.734 – 3.937)
DIA
.390 – .415
(9.906 – 10.541)
.330 – .370
(8.382 – 9.398)
.460 – .500
(11.684 – 12.700)
.570 – .620
(14.478 – 15.748)
.230 – .270
(5.842 – 6.858)
P Package
3-Lead Plastic TO-3P (Similar to TO-247)
(Reference LTC DWG # 05-08-1450)
T Package
3-Lead Plastic TO-220
(Reference LTC DWG # 05-08-1420)
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