Brochure

Table Of Contents
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 03/03/17
Surface Mount Fuses
NANO
> 160 Fuse and Clip Series
Average Time Current Curves
Reflow Condition Pb-free assembly
Pre Heat
- Temperature Min (T
s(min)
) 150°C
- Temperature Max (T
s(max)
) 200°C
- Time (Min to Max) (t
s
) 60 – 180 seconds
Average Ramp-up Rate (Liquidus Temp
(T
L
) to peak)
5°C/second max.
T
S(max)
to T
L
- Ramp-up Rate 5°C/second max.
Reflow
- Temperature (T
L
) (Liquidus) 217°C
- Temperature (t
L
) 60 – 150 seconds
Peak Temperature (T
P
) 260
+0/–5
°C
Time within 5°C of actual peak
Temperature (t
p
)
20 – 40 seconds
Ramp-down Rate 5°C/second max.
Time 25°C to peak Temperature (T
P
) 8 minutes max.
Do not exceed 260°C
Soldering Parameters
Temperature Re-rating Curve
0.001
0.01
0.1
1
10
100
0.1 1 10 100 1000
TIME IN SECONDS
CURRENT IN AMPS
5A
4A
2A
1.5A
1A
.750A
.500A
3.5A
3A
2.5A
Time
Temperature
T
P
T
L
T
S
min
25
t
S
t 25ºC to Peak
t
L
t
P
Preheat
T
S
max
Ramp-down
Ramp-up
Critical Zone
T
L
to T
P
Note:
1. Rerating depicted in this curve is in addition to the standard derating of 25% for continuous
operation.