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© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 03/03/17
Radial Lead Fuses
MICRO™ > Very Fast-Acting Fuse > 262/268/269 Series
Temperature Re-rating Curve
Soldering Parameters - Wave Soldering
Dwell Time
0
20
40
60
80
100
120
140
160
180
200
220
240
260
280
300
0
10 20 30 40 50 60 70 80 90
100 110 120 130 140 150 160 170 180 190 200 210 220 230
240
Time (Seconds)
Temperature (°C) - Measured on bottom side of board
Cooling Time
Preheat Time
Wave Parameter Lead-Free Recommendation
Preheat:
(Depends on Flux Activation Temperature)
(Typical Industry Recommendation)
Temperature Minimum:
100
° C
Temperature Maximum:
150
° C
Preheat Time: 60-180 seconds
Solder Pot Temperature:
260
° C Maximum
Solder Dwell Time: 2-5 seconds
Recommended Hand-Solder Parameters:
Solder Iron Temperature: 350° C +/- 5°C
Heating Time: 5 seconds max.
Note: These devices are not recommended for IR or
Convection Reflow process.
Recommended Process Parameters:
Notes:
1. Rerating depicted in this curve is in addition to the standard derating of 25% for
continuous operation.
2. Please contact Littelfuse for average time current curve.