Datasheet

DS2430A
19 of 19
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reserves the right to change the circuitry and specifications without notice at any time.
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REVISION HISTORY
REVISION
DATE
DESCRIPTION
PAGES
CHANGED
4/3/95 Initial release —
8/26/96
Changed “C-lead” package to “TSOC” package. Deleted V
IHmax
specification
value. Note “Under certain low voltage conditions V
ILMAX
may have to be
reduced to as much as 0.5V to always guarantee a presence pulse.” added to
V
IL
specification, changed V
CC
to V
PUP
in Note 6.
Various
3/26/97 Changed “Touch Memory” to “iButton”. Various
12/8/98
Programming time changed from 100ms to 10ms, change V
DD
to V
PUP
, revised
note below Figure 7, programming current changed from 600µA to 500µA, Q
OP
removed from EC table, deleted from Note 5 “and will remain valid for 14µs
minimum (15µs total from falling edge on 1-wire bus).” Endurance added to EC
table with note “The Copy Scratchpad takes 10 ms maximum, during which the
voltage on the 1-Wire bus must not fall below 2.8V.”
Various
1/20/99 Chip scale package added to ordering information 1
5/20/99 Deleted duplicate t
PDL
and contradicting t
PROG
spec from EC table 15
10/21/99
Template conversion, style changes (capitalization of command names, “Write-
one” to “Write-1”, “Write-zero” to “Write-0”)
All
2/2/02
Part number corrections, style corrections, note below figure 7 revised explain-
ing the appropriate R
PUP
range, corrections in the Memory Functions Example
(removed Read Memory section at the beginning), changed solder spec from
260°C to JEDEC reference, added notes 11, 12, 13 to EC table, changed
t
RSTLmax
from 5000µs to 960µs, revised text of EC table note 8.
Various
11/1/05 NRFND watermark added All
1/16/07
Lead free part numbers added; added flip chip graphic with bump electrical
assignment, orientation mark and marking; Added flip chip 56-level drawing
number, changed "Chip Scale" name to "Flip Chip"; replaced references to the
Book of iButton Standards with the corresponding application notes.
Various
8/8/07
Note on formed leads for TO-92 TRL and URL to 56-G0006-003 added, I
Lmin
and I
Lmax
spec values added to EC table. Data retention added to EC table.
1, 15
4/10
Ordering information for standard and flip chip versions deleted, pin assignment
for flip chip version deleted, data rate changed from 16.3kbps to 15.3 kbps.
Style corrections and minor text updates for clarification.
New 1-Wire front end, improved EEPROM and related EC table with notes.
Package information section added.
1
Various
12-14, 16-17
18
2/12
Reformatted the Ordering Information, deleted the reference to the UCSP
package.
1
Revised EC table notes 1 and 18; added the Land Pattern No. to the Package
Information section.
17, 18
NOT RECOMMENDED FOR NEW DESIGNS