Technical data

E-2 Computer Group Literature Center Web Site
Thermal Analysis
E
The preferred temperature measurement location for a component may be:
❏ junction - refers to the temperature measured by an on-chip thermal
device
❏ case - refers to the temperature at the top, center surface of the
component
❏ air - refers to the ambient temperature near the component
Table E-1. Thermally Significant Components on the MVME5100 Single
Board Computer
Reference
Designator? Generic Description
Maximum
Allowable
Component
Temperature
(degrees C)
1
Measurement
Location
U8 Hawk ASIC 105 Junction
U9 ECC DRAM (NEC D4564841G5) 70 Ambient
U4 Intel 82559ER 85 Case
U5 Intel 82559ER 85 Case
U3 Universe 2 125 Junction
U29 L2 cache 512K (MCM69P7377P) 70 Ambient
U30 L2 cache 512K (MCM69P7377P) 70 Ambient
U31 MPC952 125 Junction
U32 MPC972 125 Junction
U21 ECC DRAM (NEC D4564841G5) 70 Ambient
U16 ECC DRAM (NEC D4564841G5) 70 Ambient
U19 PPC7400@400 MHz (Max) 105 Junction
U53 Pulse H0009.2 9942-C 85 Ambient
1
maximum temperature for reliable operation specified by the component manufacturer.