Datasheet

11
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
®
Thin Film Chip Inductors
NTI Series
Case Size 0201 0402 0603
Inductance Range 0.1nH ~ 10nH 0.2nH ~ 33nH 1.0nH ~ 100nH
Available Tolerance ±0.1nH (B), ±0.2nH (C), ±0.3nH (D), ±1% (F), ±2% (G) & ±5% (J)
Temperature Range -40°C ~ +85°C
Resistance to Solder Heat 260°C ±5°C for 5 seconds
Temperature Cycling
ΔL <
10% after 10 cycles -40°C/+20°C/+85°C/+20°C
FEATURES
NTI 02 F 10N TR F
Pb-free/RoHS compliant
Tape & Reel Packaging
Inductance Value in nano-henries,
"N" indicates decimal point
Inductance Tolerance (see values tables)
Case Code
Series
PART NUMBER SYSTEM
• ULTRA-SMALL LOW PROFILE 0201, 0402 & 0603 SIZES
• HIGH CURRENT & HIGH SRF
• COMPATIBLE WITH Pb-FREE SOLDERING
• RoHS COMPLIANT
CHARACTERISTICS
CASE DIMENSIONS (mm)
Case Sixe L W T P
0201 0.60 ± 0.05 0.30 ± 0.05 0.23 ± 0.05 0.15 ± 0.05
0402 1.0 ± 0.05 0.5 ± 0.05 0.32 ± 0.05 0.20 ± 0.10
0603 1.6 ± 0.10 0.8 ± 0.10 0.45 ± 0.10 0.30 ± 0.20
L
P
T
W
CONSTRUCTION
Nickel-Chromium (Ni-Cr)
Termination Base
Nickel (Ni) Barrier
Tin (Sn) Outerplating
Alumina Substrate
Etched Copper Coil
LAND PATTERN DIMENSIONS (mm)
Case Sixe A B C D
0201 0.2 ~ 0.3 0.8 ~ 0.9 0.2 ~ 0.3 0.3 ~ 0.4
0402 0.5 ~ 0.6 1.5 ~ 1.8 0.5 ~ 0.6 0.5 ~ 0.6
0603 0.6 ~ 1.0 2.4 ~ 2.8 0.7 ~ 0.9 0.9 ~ 1.1
A
B
C
D
90 ~ 120 sec.
260°C max.
10 sec. max.
130°C ~ 180°C
REFLOW SOLDERING PROFILE
220°C
Time above 220°C -
60 sec. max.
50°C
100°C
150°C
200°C
250°C
Time (seconds)
Temperature °C
*See Part Number System for Details
RoHS
Compliant
includes all homogeneous materials