Datasheet

2PD2150_2 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 02 — 2 January 2007 10 of 13
NXP Semiconductors
2PD2150
20 V, 3 A NPN low V
CEsat
(BISS) transistor
10. Soldering
SOT89 standard mounting conditions for reflow soldering
Fig 15. Reflow soldering footprint SOT89 (SC-62/TO-243)
Not recommended for wave soldering
Fig 16. Wave soldering footprint SOT89 (SC-62/TO-243)
msa442
1.00
(3x)
4.85
4.60
1.20
4.75
0.60 (3x)
0.70 (3x)
3.70
3.95
1.20
0.50
1.70
132
0.20
0.85
1.20
1.20
1.90
2.00
2.25
solder lands
solder resist
occupied area
solder paste
Dimensions in mm
msa423
preferred transport direction during soldering
3.00
7.60
6.60
1.20
5.30
1.50
0.50
3.50
2.40
13
2
0.70
solder lands
solder resist
occupied area
Dimensions in mm