Datasheet

ManualsBrandsNXP SEMICONDUCTORS ManualsLogic ICsLogic IC - Buffer, driver SO 14

1. General description

The 74AHC126; 74AHCT126 is a high-speed Si-gate CMOS device and is pin compatible

with Low-power Schottky TTL (LSTTL). It is speciﬁed in compliance with JEDEC standard

No. 7-A.

The 74AHC126; 74AHCT126 provides four non-inverting buffer/line drivers with 3-state

outputs. The 3-state outputs (nY) are controlled by the output enable input (nOE).

A LOW-level at pin nOE causes the outputs to assume a high-impedance OFF-state.

The 74AHC126; 74AHCT126 is identical to the 74AHC125; 74AHCT125 but has active

HIGH output enable inputs.

2. Features

n Balanced propagation delays

n All inputs have Schmitt-trigger action

n Inputs accept voltages higher than V

n Input levels:

u For 74AHC126: CMOS level

u For 74AHCT126: TTL level

n ESD protection:

u HBM JESD22-A114E exceeds 2000 V

u MM JESD22-A115-A exceeds 200 V

u CDM JESD22-C101C exceeds 1000 V

n Multiple package options

n Speciﬁed from −40 °C to +85 °C and from −40 °C to +125 °C

74AHC126; 74AHCT126

Quad buffer/line driver; 3-state

Rev. 04 — 12 August 2009 Product data sheet

Summary of content (15 pages)

PAGE 1
74AHC126; 74AHCT126 Quad buffer/line driver; 3-state Rev. 04 — 12 August 2009 Product data sheet 1. General description The 74AHC126; 74AHCT126 is a high-speed Si-gate CMOS device and is pin compatible with Low-power Schottky TTL (LSTTL). It is specified in compliance with JEDEC standard No. 7-A. The 74AHC126; 74AHCT126 provides four non-inverting buffer/line drivers with 3-state outputs. The 3-state outputs (nY) are controlled by the output enable input (nOE).
PAGE 2
74AHC126; 74AHCT126 NXP Semiconductors Quad buffer/line driver; 3-state 3. Ordering information Table 1. Ordering information Type number 74AHC126D Package Temperature range Name Description Version −40 °C to +125 °C SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 −40 °C to +125 °C TSSOP14 plastic thin shrink small outline package; 14 leads; body width 4.
PAGE 3
74AHC126; 74AHCT126 NXP Semiconductors Quad buffer/line driver; 3-state 5. Pinning information 5.
PAGE 4
74AHC126; 74AHCT126 NXP Semiconductors Quad buffer/line driver; 3-state 6. Functional description Table 3. Function table[1] Control Input Output nOE nA nY H L L H H H L X Z [1] H = HIGH voltage state; L = LOW voltage state; X = don’t care; Z = high-impedance OFF-state. 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
PAGE 5
74AHC126; 74AHCT126 NXP Semiconductors Quad buffer/line driver; 3-state 8. Recommended operating conditions Table 5. Operating conditions Symbol Parameter Conditions Min Typ Max Unit 74AHC126 VCC supply voltage 2.0 5.0 5.5 V VI input voltage 0 - 5.5 V VO output voltage 0 - VCC V Tamb ambient temperature −40 +25 +125 °C ∆t/∆V input transition rise and fall rate VCC = 3.0 V to 3.6 V - - 100 ns/V VCC = 4.5 V to 5.5 V - - 20 ns/V 74AHCT126 VCC supply voltage 4.
PAGE 6
74AHC126; 74AHCT126 NXP Semiconductors Quad buffer/line driver; 3-state Table 6. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter 25 °C Conditions −40 °C to +85 °C −40 °C to +125 °C Unit Min Typ Max Min Max Min Max II input leakage current VI = 5.5 V or GND; VCC = 0 V to 5.5 V - - 0.1 - 1.0 - 2.0 µA IOZ OFF-state VI = VIH or VIL; output current VO = VCC or GND; VCC = 5.5 V - - ±0.25 - ±2.
PAGE 7
4AHC126; 74AHCT126 NXP Semiconductors Quad buffer/line driver; 3-state 10. Dynamic characteristics Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8. Symbol Parameter 25 °C Conditions −40 °C to +85 °C −40 °C to +125 °C Unit Min Typ[1] Max Min Max Min Max CL = 15 pF - 4.7 8.0 1.0 9.5 1.0 10.0 ns CL = 50 pF - 6.7 11.5 1.0 13.0 1.0 14.5 ns - 3.3 5.5 1.0 6.5 1.0 7.0 ns - 4.7 7.5 1.0 8.5 1.0 9.
PAGE 8
74AHC126; 74AHCT126 NXP Semiconductors Quad buffer/line driver; 3-state [1] Typical values are measured at nominal supply voltage (VCC = 3.3 V and VCC = 5.0 V). [2] tpd is the same as tPLH and tPHL. [3] ten is the same as tPZL and tPZH. [4] tdis is the same as tPLZ and tPHZ. [5] CPD is used to determine the dynamic power dissipation (PD in µW).
PAGE 9
74AHC126; 74AHCT126 NXP Semiconductors Quad buffer/line driver; 3-state Table 8. Measurement points Type Input Output VM VM VX VY 74AHC126 0.5 × VCC 0.5 × VCC VOL + 0.3 V VOH − 0.3 V 74AHCT126 1.5 V 0.5 × VCC VOL + 0.3 V VOH − 0.3 V VI tW 90 % negative pulse VM 0V tf tr tr tf VI 90 % positive pulse 0V VM 10 % VM VM 10 % tW VCC VCC G VI VO RL S1 open DUT RT CL 001aad983 Test data is given in Table 9.
PAGE 10
74AHC126; 74AHCT126 NXP Semiconductors Quad buffer/line driver; 3-state 12. Package outline SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 D E A X c y HE v M A Z 8 14 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 7 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.
PAGE 11
74AHC126; 74AHCT126 NXP Semiconductors Quad buffer/line driver; 3-state TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1 E D A X c y HE v M A Z 8 14 Q (A 3) A2 A A1 pin 1 index θ Lp L 1 7 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.1 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.
PAGE 12
74AHC126; 74AHCT126 NXP Semiconductors Quad buffer/line driver; 3-state DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT762-1 14 terminals; body 2.5 x 3 x 0.85 mm A B D A A1 E c detail X terminal 1 index area terminal 1 index area C e1 e 2 6 y y1 C v M C A B w M C b L 1 7 Eh e 14 8 13 9 Dh X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max. A1 b 1 0.05 0.00 0.30 0.
PAGE 13
74AHC126; 74AHCT126 NXP Semiconductors Quad buffer/line driver; 3-state 13. Abbreviations Table 10. Abbreviations Acronym Description CDM Charged Device Model CMOS Complementary Metal-Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model LSTTL Low-power Schottky Transistor-Transistor Logic MM Machine Model 14. Revision history Table 11.
PAGE 14
74AHC126; 74AHCT126 NXP Semiconductors Quad buffer/line driver; 3-state 15. Legal information 15.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.
PAGE 15
NXP Semiconductors 74AHC126; 74AHCT126 Quad buffer/line driver; 3-state 17. Contents 1 2 3 4 5 5.1 5.2 6 7 8 9 10 11 12 13 14 15 15.1 15.2 15.3 15.4 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . .