Datasheet

ManualsBrandsNXP SEMICONDUCTORS ManualsLogic ICsLogic IC - Buffer, driver TSOP 5

1. General description

The 74LVC1G34 provides a low-power, low-voltage single buffer.

The input can be driven from either 3.3 V or 5 V devices. This feature allows the use of

this device in a mixed 3.3 V and 5 V environment.

This device is fully specified for partial power-down applications using I

OFF

. The I

OFF

circuitry disables the output, preventing the damaging backflow current through the device

when it is powered down.

Schmitt trigger action at all inputs makes the circuit highly tolerant of slower input rise and

fall times.

2. Features and benefits

 Wide supply voltage range from 1.65 V to 5.5 V

 5 V tolerant inputs for interfacing with 5 V logic

 High noise immunity

 Complies with JEDEC standard:

 JESD8-7 (1.65 V to 1.95 V)

 JESD8-5 (2.3 V to 2.7 V)

 JESD8-B/JESD36 (2.7 V to 3.6 V).

 ESD protection:

 HBM JESD22-A114F exceeds 2000 V

 MM JESD22-A115-A exceeds 200 V

 24 mA output drive (V

=3.0V)

 CMOS low power consumption

 Latch-up performance exceeds 250 mA

 Direct interface with TTL levels

 Inputs accept voltages up to 5 V

 Multiple package options

 Specified from 40 Cto+85C and 40 Cto+125C

74LVC1G34

Single buffer

Rev. 5 — 2 July 2012 Product data sheet

Summary of content (19 pages)

PAGE 1
74LVC1G34 Single buffer Rev. 5 — 2 July 2012 Product data sheet 1. General description The 74LVC1G34 provides a low-power, low-voltage single buffer. The input can be driven from either 3.3 V or 5 V devices. This feature allows the use of this device in a mixed 3.3 V and 5 V environment. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.
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74LVC1G34 NXP Semiconductors Single buffer 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74LVC1G34GW 40 C to +125 C TSSOP5 plastic thin shrink small outline package; 5 leads; body width 1.25 mm SOT353-1 74LVC1G34GV 40 C to +125 C SC-74A plastic surface-mounted package; 5 leads SOT753 74LVC1G34GM 40 C to +125 C XSON6 plastic extremely thin small outline package; no leads; SOT886 6 terminals; body 1  1.
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74LVC1G34 NXP Semiconductors Single buffer 6. Pinning information 6.1 Pinning 74LVC1G34 74LVC1G34 n.c. 1 A 2 GND 3 5 4 n.c. 1 6 VCC A 2 5 n.c. GND 3 4 Y VCC Y 001aag504 Transparent top view 001aag503 Fig 4. Pin configuration SOT353-1 and SOT753 Fig 5. Pin configuration SOT886 74LVC1G34 74LVC1G34 1 n.c. n.c. 1 6 VCC A 2 5 n.c. GND 3 4 Y VCC 4 Y 3 GND 2 A 001aag505 aaa-003027 Transparent top view Transparent top view Fig 6.
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74LVC1G34 NXP Semiconductors Single buffer 7. Functional description Table 4. Function table[1] Input Output A Y L L H H [1] H = HIGH voltage level; L = LOW voltage level. 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
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74LVC1G34 NXP Semiconductors Single buffer 10. Static characteristics Table 7. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter Tamb = 40 C to +85 VIH VIL VOH VOL Conditions Min Typ Max Unit VCC = 1.65 V to 1.95 V 0.65  VCC - - V VCC = 2.3 V to 2.7 V 1.7 - - V VCC = 2.7 V to 3.6 V 2.0 - - V VCC = 4.5 V to 5.5 V 0.7  VCC - - V VCC = 1.65 V to 1.95 V - - 0.35  VCC V VCC = 2.3 V to 2.
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74LVC1G34 NXP Semiconductors Single buffer Table 7. Static characteristics …continued At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions VOH VI = VIH or VIL HIGH-level output voltage LOW-level output voltage VOL Min Typ Max Unit IO = 100 A; VCC = 1.65 V to 5.5 V VCC  0.1 - - V IO = 4 mA; VCC = 1.65 V 0.95 - - V IO = 8 mA; VCC = 2.3 V 1.7 - - V IO = 12 mA; VCC = 2.7 V 1.9 - - V IO = 24 mA; VCC = 3.0 V 2.
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4LVC1G34 NXP Semiconductors Single buffer 11. Dynamic characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 9. Symbol Parameter 40 C to +85 C Conditions power dissipation capacitance CPD Unit Min Max Min Max VCC = 1.65 V to 1.95 V 1.0 4.0 8.6 1.0 11.0 ns VCC = 2.3 V to 2.7 V 0.5 2.6 4.4 0.5 5.6 ns VCC = 2.7 V 0.5 2.3 4.5 0.5 5.6 ns VCC = 3.0 V to 3.6 V 0.5 2.0 4.1 0.5 5.2 ns VCC = 4.5 V to 5.
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74LVC1G34 NXP Semiconductors Single buffer Table 9. Measurement points Supply voltage Input Output VCC VM VM 1.65 V to 1.95 V 0.5  VCC 0.5  VCC 2.3 V to 2.7 V 0.5  VCC 0.5  VCC 2.7 V 1.5 V 1.5 V 3.0 V to 3.6 V 1.5 V 1.5 V 4.5 V to 5.5 V 0.5  VCC 0.5  VCC VEXT VCC VI RL VO G DUT RT CL RL mna616 Test data is given in Table 10. Definitions for test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance.
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74LVC1G34 NXP Semiconductors Single buffer 13. Package outline TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm E D SOT353-1 A X c y HE v M A Z 5 4 A2 A (A3) A1 θ 1 Lp 3 L e w M bp detail X e1 0 1.5 3 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(1) e e1 HE L Lp v w y Z(1) θ mm 1.1 0.1 0 1.0 0.8 0.15 0.30 0.15 0.25 0.08 2.25 1.85 1.35 1.15 0.65 1.3 2.25 2.0 0.425 0.46 0.21 0.
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74LVC1G34 NXP Semiconductors Single buffer Plastic surface-mounted package; 5 leads SOT753 D E B y A X HE 5 v M A 4 Q A A1 c 1 2 3 Lp detail X bp e w M B 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 bp c D E e HE Lp Q v w y mm 1.1 0.9 0.100 0.013 0.40 0.25 0.26 0.10 3.1 2.7 1.7 1.3 0.95 3.0 2.5 0.6 0.2 0.33 0.23 0.2 0.2 0.
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74LVC1G34 NXP Semiconductors Single buffer SOT886 XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm b 1 2 3 4x (2) L L1 e 6 5 e1 4 e1 6x A (2) A1 D E terminal 1 index area 0 1 2 mm scale Dimensions (mm are the original dimensions) Unit mm max nom min A(1) 0.5 A1 b D E 0.04 0.25 1.50 1.05 0.20 1.45 1.00 0.17 1.40 0.95 e e1 0.6 0.5 L L1 0.35 0.40 0.30 0.35 0.27 0.32 Notes 1. Including plating thickness. 2.
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74LVC1G34 NXP Semiconductors Single buffer XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm 1 SOT891 b 3 2 4× (1) L L1 e 6 5 e1 4 e1 6× A (1) A1 D E terminal 1 index area 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max A1 max b D E e e1 L L1 mm 0.5 0.04 0.20 0.12 1.05 0.95 1.05 0.95 0.55 0.35 0.35 0.27 0.40 0.32 Note 1. Can be visible in some manufacturing processes.
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74LVC1G34 NXP Semiconductors Single buffer XSON6: extremely thin small outline package; no leads; 6 terminals; body 0.9 x 1.0 x 0.35 mm 1 SOT1115 b 3 2 (4×)(2) L L1 e 6 5 4 e1 e1 (6×)(2) A1 A D E terminal 1 index area 0 0.5 scale Dimensions Unit mm 1 mm A(1) A1 b D E e e1 max 0.35 0.04 0.20 0.95 1.05 nom 0.15 0.90 1.00 0.55 min 0.12 0.85 0.95 0.3 L L1 0.35 0.40 0.30 0.35 0.27 0.32 Note 1. Including plating thickness. 2.
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74LVC1G34 NXP Semiconductors Single buffer XSON6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1.0 x 0.35 mm 1 SOT1202 b 3 2 (4×)(2) L L1 e 6 5 4 e1 e1 (6×)(2) A1 A D E terminal 1 index area 0 0.5 scale Dimensions Unit mm 1 mm A(1) A1 b D E e e1 L L1 max 0.35 0.04 0.20 1.05 1.05 0.35 0.40 nom 0.15 1.00 1.00 0.55 0.35 0.30 0.35 min 0.12 0.95 0.95 0.27 0.32 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology.
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74LVC1G34 NXP Semiconductors Single buffer X2SON5: plastic thermal enhanced extremely thin small outline package; no leads; 5 terminals; body 0.8 x 0.8 x 0.35 mm B A D SOT1226 X A E A1 A3 detail X terminal 1 index area e C v w b 1 2 terminal 1 index area C A B C y1 C y k D h 3 L 5 4 0 1 mm scale Dimensions Unit mm A(1) A1 A3 D Dh E b e k L max 0.35 0.04 0.128 0.85 0.30 0.85 0.27 0.27 nom 0.80 0.25 0.80 0.22 0.48 0.22 min 0.20 0.17 0.040 0.75 0.20 0.75 0.17 v 0.
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74LVC1G34 NXP Semiconductors Single buffer 14. Abbreviations Table 11. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 15. Revision history Table 12. Revision history Document ID Release date Data sheet status Change notice Supersedes 74LVC1G34 v.5 20120702 Product data sheet - 74LVC1G34 v.4 Modifications: 74LVC1G34 v.
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74LVC1G34 NXP Semiconductors Single buffer 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.
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74LVC1G34 NXP Semiconductors Single buffer Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use.
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74LVC1G34 NXP Semiconductors Single buffer 18. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . .