Datasheet

ManualsBrandsNXP SEMICONDUCTORS ManualsDiodesBAP51-06W,115

1. Product proﬁle

1.1 General description

Two planar PIN diodes in common anode conﬁguration in a SOT323 small SMD plastic

package.

1.2 Features

n Two elements in common anode conﬁguration in a small SMD plastic package

n Low diode capacitance

n Low diode forward resistance

1.3 Applications

n general RF application

2. Pinning information

3. Ordering information

BAP51-06W

General purpose PIN diode

Rev. 01 — 26 May 2008 Product data sheet

Table 1. Discrete pinning

Pin Description Simpliﬁed outline Graphic symbol

1 cathode 1

2 cathode 2

3 common connection

mgu320

Table 2. Ordering information

Type number Package

Name Description Version

BAP51-06W - plastic surface-mounted package; 3 leads SOT323

Summary of content (8 pages)

PAGE 1
BAP51-06W General purpose PIN diode Rev. 01 — 26 May 2008 Product data sheet 1. Product profile 1.1 General description Two planar PIN diodes in common anode configuration in a SOT323 small SMD plastic package. 1.2 Features n Two elements in common anode configuration in a small SMD plastic package n Low diode capacitance n Low diode forward resistance 1.3 Applications n general RF application 2. Pinning information Table 1.
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BAP51-06W NXP Semiconductors General purpose PIN diode 4. Marking Table 3. Marking Type number Marking Description BAP51-06W W7* * = p: made in Hong Kong * = t : made in Malaysia 5. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).
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BAP51-06W NXP Semiconductors General purpose PIN diode Table 6. Characteristics …continued Tj = 25 °C unless otherwise specified. Symbol Parameter Conditions ISL isolation VR = 0 V insertion loss Lins Min Typ Max Unit f = 900 MHz - 17 - dB f = 1800 MHz - 13 - dB f = 2450 MHz - 12 - dB f = 900 MHz - 0.44 - dB f = 1800 MHz - 0.50 - dB f = 2450 MHz - 0.54 - dB f = 900 MHz - 0.33 - dB f = 1800 MHz - 0.39 - dB f = 2450 MHz - 0.43 - dB f = 900 MHz - 0.
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BAP51-06W NXP Semiconductors General purpose PIN diode 001aai135 0 001aai136 0 Lins (dB) ISL (dB) −0.5 −10 (1) (2) (3) −1 −20 −1.5 −30 −2 −40 −2.5 0.5 1 1.5 2 2.5 3 f (GHz) −50 0.5 1 1.5 2 2.5 3 f (GHz) Diode zero biased and inserted in series with a 50 Ω stripline circuit; Tamb = 25 °C. (1) IF = 10 mA (2) IF = 1 mA (3) IF = 0.5 mA Diode inserted in series with a 50 Ω stripline circuit and biased via the analyzer Tee network. Fig 3.
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BAP51-06W NXP Semiconductors General purpose PIN diode 8. Package outline Plastic surface-mounted package; 3 leads SOT323 D E B A X HE y v M A 3 Q A A1 c 1 2 e1 bp Lp w M B e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp c D E e e1 HE Lp Q v w mm 1.1 0.8 0.1 0.4 0.3 0.25 0.10 2.2 1.8 1.35 1.15 1.3 0.65 2.2 2.0 0.45 0.15 0.23 0.13 0.2 0.2 OUTLINE VERSION REFERENCES IEC SOT323 Fig 5.
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BAP51-06W NXP Semiconductors General purpose PIN diode 9. Abbreviations Table 7. Abbreviations Acronym Description AQL Acceptable Quality Level PIN P-type, Intrinsic, N-type SMD Surface Mounted Device RF Radio Frequency S4 Special inspection level 4 10. Revision history Table 8. Revision history Document ID Release date Data sheet status Change notice Supersedes BAP51-06W_1 20080526 Product data sheet - - BAP51-06W_1 Product data sheet © NXP B.V. 2008. All rights reserved.
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BAP51-06W NXP Semiconductors General purpose PIN diode 11. Legal information 11.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.
PAGE 8
BAP51-06W NXP Semiconductors General purpose PIN diode 13. Contents 1 1.1 1.2 1.3 2 3 4 5 6 7 8 9 10 11 11.1 11.2 11.3 11.4 12 13 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . General description. . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . .