DISCRETE SEMICONDUCTORS DATA SHEET dbook, halfpage M3D109 BCV29; BCV49 NPN Darlington transistors Product data sheet Supersedes data of 1999 Apr 08 2004 Dec 06
NXP Semiconductors Product data sheet NPN Darlington transistors BCV29; BCV49 FEATURES PINNING • High current (max. 500 mA) PIN DESCRIPTION • Low voltage (max. 60 V) 1 emitter • High DC current gain (min. 20 000). 2 collector 3 base APPLICATIONS • Preamplifier input applications. 3 2 DESCRIPTION NPN small-signal Darlington transistor in a surface mount SOT89 plastic package. PNP complements: BCV28 and BCV48.
NXP Semiconductors Product data sheet NPN Darlington transistors BCV29; BCV49 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VCBO PARAMETER CONDITIONS collector-base voltage MAX. UNIT open emitter − 40 V − 80 V BCV29 − 30 V BCV49 − 60 V BCV29 BCV49 VCES MIN.
NXP Semiconductors Product data sheet NPN Darlington transistors BCV29; BCV49 CHARACTERISTICS Tamb = 25 °C unless otherwise specified. SYMBOL ICBO PARAMETER CONDITIONS MIN. TYP. MAX.
NXP Semiconductors Product data sheet NPN Darlington transistors BCV29; BCV49 MGD837 80000 handbook, full pagewidth hFE 60000 40000 20000 0 10−1 1 10 VCE = 2 V. Fig.2 DC current gain; typical values.
NXP Semiconductors Product data sheet NPN Darlington transistors BCV29; BCV49 PACKAGE OUTLINE Plastic surface-mounted package; collector pad for good heat transfer; 3 leads SOT89 B D A bp3 E HE Lp 1 2 3 c bp2 w M bp1 e1 e 0 2 4 mm scale DIMENSIONS (mm are the original dimensions) UNIT A bp1 bp2 bp3 c D E e e1 HE Lp w mm 1.6 1.4 0.48 0.35 0.53 0.40 1.8 1.4 0.44 0.23 4.6 4.4 2.6 2.4 3.0 1.5 4.25 3.75 1.2 0.8 0.
NXP Semiconductors Product data sheet NPN Darlington transistors BCV29; BCV49 DATA SHEET STATUS DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1.
NXP Semiconductors Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com © NXP B.V. 2009 All rights are reserved.
