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1. Product profile

1.1 General description

NPN general-purpose double transistors in a small SOT143B Surface-Mounted

Device (SMD) plastic package.

1.2 Features

 Low current (max. 100 mA)

 Low voltage (max. 30 V)

 Matched pairs

1.3 Applications

 Applications with working point independent of temperature

 Current mirrors

2. Pinning information

BCV61

NPN general-purpose double transistors

Rev. 04 — 18 December 2009 Product data sheet

Table 1. Product overview

Type number Package PNP complement

NXP JEITA

BCV61 SOT143B - BCV62

BCV61A BCV62A

BCV61B BCV62B

BCV61C BCV62C

Table 2. Pinning

Pin Description Simplified outline Graphic symbol

1 collector TR2;

base TR1 and TR2

2 collector TR1

3emitterTR1

4emitterTR2

006aaa84

TR2

TR1

Summary of content (13 pages)

PAGE 1
BCV61 NPN general-purpose double transistors Rev. 04 — 18 December 2009 Product data sheet 1. Product profile 1.1 General description NPN general-purpose double transistors in a small SOT143B Surface-Mounted Device (SMD) plastic package. Table 1. Product overview Type number Package BCV61 PNP complement NXP JEITA SOT143B - BCV62 BCV61A BCV62A BCV61B BCV62B BCV61C BCV62C 1.2 Features Low current (max. 100 mA) Low voltage (max. 30 V) Matched pairs 1.
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BCV61 NXP Semiconductors NPN general-purpose double transistors 3. Ordering information Table 3. Ordering information Type number BCV61 Package Name Description Version - plastic surface-mounted package; 4 leads SOT143B BCV61A BCV61B BCV61C 4. Marking Table 4. Marking codes Marking code[1] Type number BCV61 1M* BCV61A 1J* BCV61B 1K* BCV61C 1L* [1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 5.
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BCV61 NXP Semiconductors NPN general-purpose double transistors 6. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Rth(j-a) [1] Conditions Min Typ Max Unit - - 500 K/W Conditions Min Typ Max Unit VCB = 30 V; IE = 0 A - - 15 nA VCB = 30 V; IE = 0 A; Tj = 150 °C - - 5 μA nA thermal resistance from junction in free air to ambient [1] Device mounted on an FR4 PCB. 7. Characteristics Table 7. Characteristics Tj = 25 °C unless otherwise specified.
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BCV61 NXP Semiconductors NPN general-purpose double transistors Table 7. Characteristics …continued Tj = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VCB = 0 V; IE = −250 mA - - −1.
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BCV61 NXP Semiconductors NPN general-purpose double transistors mgt723 400 mgt724 1200 VBE (mV) 1000 hFE (1) 300 (1) 800 (2) (2) 200 600 (3) 400 (3) 100 200 0 10−1 1 10 102 0 10−1 103 1 10 102 I C (mA) VCE = 5 V VCE = 5 V (1) Tamb = 150 °C (1) Tamb = −55 °C (2) Tamb = 25 °C (2) Tamb = 25 °C (3) Tamb = −55 °C (3) Tamb = 150 °C Fig 1. BCV61A: DC current gain as a function of collector current; typical values mgt725 103 103 I C (mA) Fig 2.
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BCV61 NXP Semiconductors NPN general-purpose double transistors mgt727 600 VBE (mV) 1000 hFE (1) 500 mgt728 1200 (1) 400 800 (2) (2) 300 600 200 400 (3) (3) 100 200 0 10−1 1 10 102 0 10−2 103 10−1 1 10 I C (mA) VCE = 5 V VCE = 5 V (1) Tamb = 150 °C (1) Tamb = −55 °C (2) Tamb = 25 °C (2) Tamb = 25 °C (3) Tamb = −55 °C (3) Tamb = 150 °C Fig 5. BCV61B: DC current gain as a function of collector current; typical values mgt729 104 Fig 6.
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BCV61 NXP Semiconductors NPN general-purpose double transistors mgt731 1200 VBE (mV) 1000 hFE 1000 mgt732 1200 (1) 800 (1) 800 (2) (2) 600 400 600 (3) 400 (3) 200 200 0 10−1 1 10 102 103 0 10−2 10−1 1 10 I C (mA) VCE = 5 V VCE = 5 V (1) Tamb = 150 °C (1) Tamb = −55 °C (2) Tamb = 25 °C (2) Tamb = 25 °C (3) Tamb = −55 °C (3) Tamb = 150 °C Fig 9. BCV61C: DC current gain as a function of collector current; typical values mgt733 104 102 103 I C (mA) Fig 10.
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BCV61 NXP Semiconductors NPN general-purpose double transistors mbk082 30 IE2 = 1 mA VCE1max (V) 20 5 mA 10 mA 10 50 mA 0 10−1 1 10 RE (Ω) 102 IC1/IE2 = 1.3 Fig 13. Maximum collector-emitter voltage as a function of emitter resistance 8. Test information A IC1 VCE1 2 TR1 1 TR2 3 IE2 = constant 4 006aaa831 Fig 14. Test circuit current matching A IC1 VCE1 2 TR1 3 RE 1 TR2 IE2 = constant 4 RE 006aab977 Fig 15. BCV61 with emitter resistors BCV61_4 Product data sheet © NXP B.
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BCV61 NXP Semiconductors NPN general-purpose double transistors 9. Package outline 3.0 2.8 1.1 0.9 1.9 4 2.5 2.1 3 0.45 0.15 1.4 1.2 1 2 0.88 0.78 0.48 0.38 0.15 0.09 1.7 Dimensions in mm 04-11-16 Fig 16. Package outline SOT143B 10. Packing information Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.
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BCV61 NXP Semiconductors NPN general-purpose double transistors 11. Soldering 3.25 0.6 (3×) 0.5 (3×) 1.9 solder lands 0.7 0.6 (3×) (3×) solder resist 2 solder paste 3 occupied area 0.7 0.6 Dimensions in mm 0.75 0.95 0.9 1 sot143b_fr Fig 17. Reflow soldering footprint SOT143B 4.45 2.2 1.2 (3×) 1.425 (3×) solder lands solder resist 4.6 2.575 occupied area Dimensions in mm 1.425 preferred transport direction during soldering 1 1.2 sot143b_fw Fig 18.
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BCV61 NXP Semiconductors NPN general-purpose double transistors 12. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes BCV61_4 20091218 Product data sheet - BCV61_3 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • • • • • • • • Legal texts have been adapted to the new company name where appropriate.
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BCV61 NXP Semiconductors NPN general-purpose double transistors 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.
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BCV61 NXP Semiconductors NPN general-purpose double transistors 15. Contents 1 1.1 1.2 1.3 2 3 4 5 6 7 8 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information .