Datasheet

BGA7124 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 3 — 9 September 2010 16 of 33
NXP Semiconductors
BGA7124
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
[1] MSL1 to MSL6 dimensions specified as Width (W), Spacing (S) and Length (L).
12.1.3 2110 MHz to 2170 MHz
Table 15. 5 V/130 mA application list of components; 1930 MHz to 1990 MHz
See Figure 11 and Figure 16 for component layout. Printed-Circuit Board (PCB): Rogers RO4003C stack; height = 0.508 mm;
copper plating thickness = 35 μ m.
Component Description Value Function Remarks
C1, C4 capacitor 15 pF DC blocking Murata GRM1885C1H150JA01D
C2 capacitor 2.2 pF input match Murata GRM1885C1H2R2CZ01D
C3 capacitor 1.2 pF output match Murata GRM1885C1H1R2CZ01D
C5 capacitor 15 pF RF decoupling Murata GRM1885C1H150JA01D
C6 capacitor 100 nF DC decoupling AVX 0603YC104KAT2A
C7 capacitor 10 μF DC decoupling AVX 1206ZG106ZAT2A
J1, J2 RF connector SMA Emerson Network Power
142-0701-841
J3 DC connector 6-pins MOLEX
L1 inductor 22 nH DC feed Tyco electronics 36501J022JTDG
MSL1
[1]
micro stripline 1.14 mm × 0.8 mm × 10.95 mm input match
MSL2
[1]
micro stripline 1.14 mm × 0.8 mm × 10.8 mm input match
MSL3
[1]
micro stripline 1.14 mm × 0.8 mm × 5.8 mm output match
MSL4
[1]
micro stripline 1.14 mm × 0.8 mm × 2.2 mm output match
MSL5
[1]
micro stripline 1.14 mm × 0.8 mm × 3.7 mm output match
MSL6
[1]
micro stripline 1.14 mm × 0.8 mm × 10.95 mm output match
R1 resistor 0 Ω Multicomp MC 0.063W 0603 0R
R2 resistor (trimmer) 2 kΩ bias adjustment Bourns 3214W-1-202E
See Table 16 for a list of components.
PCB board specification: Rogers RO4003C; Height = 0.508 mm; ε
r
= 3.38; Copper thickness = 35 μm.
Fig 17. 5 V/130 mA application schematic; 2110 MHz to 2170 MHz
RF_OUT
C3
C4
C6
C7
C5
R1
R2
ICQ_ADJ
SHDN
enable
L1
C2
C1
MSL1 MSL2 MSL6
MSL4
MSL5
RF_IN
BGA7124
50 Ω 50 Ω
V
CC
014aab06
3
MSL3
V
CC(BIAS)
V
CC(RF)
J1
J3
J2