Datasheet

BGA7124 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 3 — 9 September 2010 25 of 33
NXP Semiconductors
BGA7124
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
[1] MSL1 to MSL8 dimensions specified as Width (W), Spacing (S) and Length (L).
12.2.2 2405 MHz to 2485 MHz
MSL6
[1]
micro stripline 1.14 mm × 0.8 mm × 2.4 mm output match
MSL7
[1]
micro stripline 1.14 mm × 0.8 mm × 2.3 mm output match
MSL8
[1]
micro stripline 1.14 mm × 0.8 mm × 10.95 mm output match
R1 resistor 0 Ω Multicomp MC 0.063W 0603 0R
R2 resistor (trimmer) 2 kΩ bias adjustment Bourns 3214W-1-202E
Table 18. 3.3 V/130 mA application list of components; 920 MHz to 960 MHz
…continued
See Figure 29 and Figure 34 for component layout. Printed-Circuit Board (PCB): Rogers RO4003C stack; height = 0.508 mm;
copper plating thickness = 35 μ m.
Component Description Value Function Remarks
See Table 19 for a list of components.
PCB board specification: Rogers RO4003C; Height = 0.508 mm; ε
r
= 3.38; Copper thickness = 35 μm
Fig 35. 3.3 V/130 mA application schematic; 2405 MHz to 2485 MHz
RF_OUT
C3
C5
C7
C8
C6
R1
R2
ICQ_ADJ
SHDN
enable
L1
C2
C1
MSL1 MSL2 MSL4MSL3 MSL5
RF_IN
BGA7124
50 Ω 50 Ω
V
CC
C4
014aab08
1
V
CC(BIAS)
V
CC(RF)
J1
J3
J2