Datasheet

BGA7124 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 3 — 9 September 2010 28 of 33
NXP Semiconductors
BGA7124
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
[1] MSL1 to MSL5 dimensions specified as Width (W), Spacing (S) and Length (L).
12.3 PCB stack
MSL5
[1]
micro stripline 1.14 mm × 0.8 mm × 10.95 mm output match
R1 resistor 2.2 Ω Multicomp MC 0.063W 0603 2R2
R2 resistor (trimmer) 2 kΩ bias adjustment Bourns 3214W-1-202E
Table 19. 3.3 V/130 mA application list of components; 2405 MHz to 2485 MHz
…continued
See Figure 35 and Figure 40 for component layout. Printed-Circuit Board (PCB): Rogers RO4003C stack; height = 0.508 mm;
copper plating thickness = 35 μ m.
Component Description Value Function Remarks
(1) Pre-pregnated
RO4003Cdielectric constant ε
r
= 3.38
Fig 41. PCB stack
through via
RF and analog ground
RF and analog routing
analog routing
RF and analog ground
35 μm (1 oz.) copper + 0.3 μm
gold plating
RO4003C, 0.51 mm (20 mil)
35 μm (1 oz.) copper
(1)
0.2 mm (8 mil)
FR4, 0.15 mm (6 mil)
35 μm (1 oz.) copper
35 μm (1 oz.) copper
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