DISCRETE SEMICONDUCTORS DATA SHEET dbook, halfpage M3D087 BSP31; BSP32; BSP33 PNP medium power transistors Product data sheet Supersedes data of 1997 Apr 08 1999 Apr 26
NXP Semiconductors Product data sheet PNP medium power transistors BSP31; BSP32; BSP33 FEATURES PINNING • High current (max. 1 A) PIN • Low voltage (max. 80 V). DESCRIPTION 1 base 2, 4 APPLICATIONS collector 3 emitter • Telephony and general industrial applications. DESCRIPTION 4 handbook, halfpage 2, 4 PNP medium power transistor in a SOT223 plastic package. NPN complements: BSP41 and BSP43. 1 3 1 2 3 Top view MAM288 Fig.1 Simplified outline (SOT223) and symbol.
NXP Semiconductors Product data sheet PNP medium power transistors BSP31; BSP32; BSP33 THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS Rth j-a thermal resistance from junction to ambient Rth j-s thermal resistance from junction to soldering point VALUE UNIT 93 K/W 12 K/W note 1 Note 1. Device mounted on a printed-circuit board, single sided copper, tinplated, mounting pad for collector 1 cm2.
NXP Semiconductors Product data sheet PNP medium power transistors BSP31; BSP32; BSP33 PACKAGE OUTLINE Plastic surface mounted package; collector pad for good heat transfer; 4 leads D SOT223 E B A X c y HE v M A b1 4 Q A A1 1 2 3 Lp bp e1 w M B detail X e 0 2 4 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 bp b1 c D E e e1 HE Lp Q v w y mm 1.8 1.5 0.10 0.01 0.80 0.60 3.1 2.9 0.32 0.22 6.7 6.3 3.7 3.3 4.6 2.3 7.3 6.7 1.1 0.7 0.95 0.
NXP Semiconductors Product data sheet PNP medium power transistors BSP31; BSP32; BSP33 DATA SHEET STATUS DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1.
NXP Semiconductors Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com © NXP B.V. 2009 All rights are reserved.
