DISCRETE SEMICONDUCTORS DATA SHEET handbook, halfpage M3D087 BSP50; BSP51; BSP52 NPN Darlington transistors Product data sheet Supersedes data of 1997 Apr 22 1999 Apr 23
NXP Semiconductors Product data sheet NPN Darlington transistors BSP50; BSP51; BSP52 FEATURES PINNING • High current (max. 1 A) PIN • Low voltage (max. 80 V) 1 • Integrated diode and resistor. DESCRIPTION base 2,4 3 collector emitter APPLICATIONS • Industrial high gain amplification. 4 2, 4 DESCRIPTION 1 NPN Darlington transistor in a SOT223 plastic package. PNP complements: BSP60, BSP61 and BSP62. 1 2 Top view 3 3 MAM265 Fig.1 Simplified outline (SOT223) and symbol.
NXP Semiconductors Product data sheet NPN Darlington transistors BSP50; BSP51; BSP52 THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS Rth j-a thermal resistance from junction to ambient Rth j-s thermal resistance from junction to solder point VALUE UNIT 96 K/W 17 K/W note 1 Note 1. Device mounted on a printed-circuit board, single sided copper, tinplated, mounting pad for collector 1 cm2.
NXP Semiconductors Product data sheet NPN Darlington transistors BSP50; BSP51; BSP52 MGD838 5000 handbook, full pagewidth hFE 4000 3000 2000 1000 0 10−1 102 10 1 VCE = 10 V. Fig.2 DC current gain; typical values. VBB handbook, full pagewidth RB VCC RC Vo (probe) oscilloscope 450 Ω (probe) 450 Ω R2 Vi DUT R1 MLB826 Vi = 10 V; T = 200 μs; tp = 6 μs; tr = tf ≤ 3 ns. R1 = 56 Ω; R2 = 10 kΩ; RB = 10 kΩ; RC = 18 Ω. VBB = −1.8 V; VCC = 10.7 V. Oscilloscope: input impedance Zi = 50 Ω.
NXP Semiconductors Product data sheet NPN Darlington transistors BSP50; BSP51; BSP52 PACKAGE OUTLINE Plastic surface mounted package; collector pad for good heat transfer; 4 leads D SOT223 E B A X c y HE v M A b1 4 Q A A1 1 2 3 Lp bp e1 w M B detail X e 0 2 4 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 bp b1 c D E e e1 HE Lp Q v w y mm 1.8 1.5 0.10 0.01 0.80 0.60 3.1 2.9 0.32 0.22 6.7 6.3 3.7 3.3 4.6 2.3 7.3 6.7 1.1 0.7 0.95 0.
NXP Semiconductors Product data sheet NPN Darlington transistors BSP50; BSP51; BSP52 DATA SHEET STATUS DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1.
NXP Semiconductors Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com © NXP B.V. 2009 All rights are reserved.
