Datasheet

56F807 Technical Data Technical Data, Rev. 16
48 Freescale Semiconductor
Part 4 Packaging
4.1 Package and Pin-Out Information 56F807
This section contains package and pin-out information for the 56F807. This device comes in two case
types: low-profile quad flat pack (LQFP) or mold array process ball grid assembly (MAPBGA).
Figure 4-1 shows the package outline for the LQFP case, Figure 4-2 shows the mechanical parameters
for the LQFP case, and Table 4-1 lists the pinout for the LQFP case. Figure 4-3 shows the mechanical
parameters for the MAPBGA case, and Table 4-2 lists the pinout for the MAPBGA package.
Figure 4-1 Top View, 56F807 160-pin LQFP Package
A0
A1
A2
A3
A4
A5
A6
A7
V
DD
A8
A9
A10
A11
A12
A13
A14
A15
V
SS
PS
DS
WR
RD
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
V
DD
D11
D12
Pin 1
Orientation Mark
121
41
D13
D14
D15
GPIOB0
RXD0
TXD0
CLKO
V
SS
VPP
HOME1
INDEX1
V
DD
PHB1
PHA1
HOME0
INDEX0
PHB0
PHA0 MOSI0
MISO0 SCLK
SS
MSCAN_RX
V
SS
V
DD
MSCAN_TX
VCAPC2
TDO
TDI
TMS
TCK TCS
TRST
TC1
TC0
TD3 TD2
TD1 TD0 ISA2
ISA1
ISA0
V
SS
DE
GPIOB1
GPIOB2
GPIOB3
GPIOB4
GPIOB5
GPIOB6
GPIOB7
V
SS
GPIOD0
GPIOD1
GPIOD2
GPIOD3
GPIOD4
GPIOD5
TXD1
RXD1
PWMB0
PWMB1
PWMB2
PWMB3
PWMB4
PWMB5
V
DD
ISB0
VCAPC1
ISB1
ISB2
VPP2
IRQA
IRQB
FAULTB0
FAULTB1 FAULTB2
FAULTB3
PWMA0
V
SS
PWMA1
PWMA2
PWMA3 PWMA4
ANB7
ANB6
ANB5
ANB4
ANB3
ANB2
ANB1
ANB0
V
SSA
V
DDA
V
REF2
ANA7
ANA6
ANA5
ANA4
ANA3
ANA2
ANA1
ANA0
V
SSA
V
DDA
V
REF
RESET
RSTO
V
DD
V
SS
V
DD
EXTAL
XTAL
V
SS
V
SS
V
DD
V
DDA
V
SSA
EXTBOOT
FAULTA3
FAULTA2
FAULTA1
FAULTA0
PWMA5
81