Datasheet

56F807 Technical Data Technical Data, Rev. 16
52 Freescale Semiconductor
Figure 4-3 160 MAPBGA Mechanical Information
Please see www.freescale.com for the most current case outline.
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND
TOLERANCES PER ASME Y14.5M, 1994.
3. DIMENSION b IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO DATUM PLANE Z.
4. DATUM Z (SEATING PLANE) IS DEFINED BY
THE SPHERICAL CROWNS OF THE SOLDER
BALLS.
5. PARALLELISM MEASUREMENT SHALL
EXCLUDE ANY EFFECT OF MARK ON TOP
SURFACE OF PACKAGE.
CASE 1268-01
ISSUE O
X
0.20
LASER MARK FOR PIN 1
IDENTIFICATION IN
THIS AREA
e 13X
D
E
M
S
A1
A2
A
0.15 Z
0.30 Z
Z
ROTATED 90 CLOCKWISE
DETAIL K
°
5
VIEW M-M
e 13X
S
X0.30 YZ
0.10 Z
3
b
160X
METALIZED MARK FOR
PIN 1 IDENTIFICATION
IN THIS AREA
14 13 12 11 10 9 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
4
160X
DIM MIN MAX
MILLIMETERS
A 1.32 1.75
A1 0.27 0.47
A2 1.18 REF
b 0.35 0.65
D 15.00 BSC
E 15.00 BSC
e 1.00 BSC
S 0.50 BSC
Y
K