INTEGRATED CIRCUITS DATA SHEET HTRC11001T HITAG reader chip Product specification Supersedes data of 1999 Jan 01 File under Integrated Circuits, IC11 2001 Nov 23
Philips Semiconductors Product specification HITAG reader chip HTRC11001T CONTENTS 13 PACKAGE OUTLINE 14 SOLDERING 14.1 Introduction to soldering surface mount packages Reflow soldering Wave soldering Manual soldering Suitability of surface mount IC packages for wave and reflow soldering methods 1 FEATURES 2 APPLICATIONS 3 GENERAL DESCRIPTION 4 QUICK REFERENCE DATA 5 ORDERING INFORMATION 6 BLOCK DIAGRAM 7 PINNING 15 DATA SHEET STATUS 8 FUNCTIONAL DESCRIPTION 16 DEFINITIONS 8.
Philips Semiconductors Product specification HITAG reader chip 1 HTRC11001T FEATURES • Combines all analog RFID reader hardware in one single chip • Optimized for HITAG transponder family • Robust antenna coil power driver stage with modulator The receiver parameters (gain factors and filter cut-off frequencies) can be optimized to system and transponder requirements. The HTRC11001T is designed for easy integration into RF identification readers.
Philips Semiconductors Product specification HITAG reader chip 6 HTRC11001T BLOCK DIAGRAM VDD handbook, full pagewidth 3 TX1 TX2 RX 6 4 2 14 ANTENNA DRIVERS SYNCHRONOUS DEMODULATOR MODULATOR OSCILLATOR BANDPASS FILTER AMPLIFIER CONTROL UNIT 7 8 9 SERIAL INTERFACE 10 DYNAMIC CONTROL DIGITIZER PHASE MEASUREMENT HTRC11001T CONTROL REGISTER 13 12 1 QGND CEXT VSS 5 11 MGW265 Fig.1 Block diagram. 2001 Nov 23 4 MODE n.c.
Philips Semiconductors Product specification HITAG reader chip 7 HTRC11001T PINNING SYMBOL PIN DESCRIPTION VSS 1 ground supply TX2 2 antenna driver output 2 VDD 3 supply voltage (5 V stabilized) TX1 4 antenna driver output 1 MODE 5 control input to enable filtering of serial clock and data input; for active antenna applications XTAL1 6 oscillator input 1 XTAL2 7 oscillator input 2 SCLK 8 serial clock input of microcontroller interface DIN 9 serial data input of microcontroll
Philips Semiconductors Product specification HITAG reader chip 8 8.1 HTRC11001T 8.5 FUNCTIONAL DESCRIPTION The demodulator senses the absorption modulation applied by a transponder when inserted into the field. The signal is picked up at the antenna tap point between La and Ca. It is divided by Rv and the internal resistor Rint to a level on pin RX below 8 V (peak value) with respect to pin QGND (see Fig.4). Internally the signal is filtered with a second-order low-pass filter.
Philips Semiconductors Product specification HITAG reader chip 8.6 HTRC11001T All commands transmitted to the HTRC11001T serial interface start with the Most Significant Bit (MSB). Idle and Power-down mode The HTRC11001T can be switched into the Idle mode via setting bit PD = 1 and resetting bit PD_MODE = 0 (see Table 3). In this Idle mode, only the oscillator and a few other system components are active. Input DIN and output DOUT are valid when pin SCLK is at HIGH level. 8.7.
Philips Semiconductors Product specification HITAG reader chip 8.
Philips Semiconductors Product specification HITAG reader chip 8.8.3 HTRC11001T COMMAND WRITE_TAG NAME Command bits BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 1 1 0 − − − − − This is the 3-bit short form of the previously described command WRITE_TAG_N. It allows to switch into the WRITE_TAG mode with a minimum communication time.
Philips Semiconductors Product specification HITAG reader chip 8.8.7 HTRC11001T COMMAND SET_CONFIG_PAGE NAME BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 0 1 P1 P0 D3 D2 D1 D0 Command This command is used to set the filter and amplifier parameters (cut-off frequencies and gain factors) and to select the operation mode. Bits P1 and P0 select one of four configuration pages.
Philips Semiconductors Product specification HITAG reader chip BIT NAME VALUE PD_MODE FREEZE1, FREEZE0 0 Idle mode 1 Power-down mode INITIAL VALUE 0 facility to achieve fast settling times (MSB and LSB) 00 normal operation 01 main low-pass is frozen; main high-pass is pre-charged to level on pin QGND 10 main low-pass is frozen; time constant of main high-pass is reduced by a factor of 16 for bit FILTERH = 0 and by a factor of 8 for bit FILTERH = 1 11 main high-pass time constant is reduce
Philips Semiconductors Product specification HITAG reader chip 8.8.8 HTRC11001T COMMAND GET_CONFIG_PAGE ? NAME BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 Command bits 0 0 0 0 0 1 P1 P0 Response bits X3 X2 X1 X0 D3 D2 D1 D0 This command has three functions: 1. Reading back the configuration parameters set by command SET_CONFIG_PAGE 2. Reading back the transmit pulse width programmed with command WRITE_TAG_N 3. Reading the system status information.
Philips Semiconductors Product specification HITAG reader chip HTRC11001T 9 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); note 1. SYMBOL PARAMETER MIN. MAX. UNIT Vn voltage at any pin (except pin RX) −0.3 +6.5 Vn(max) maximum voltage at any pin with respect to VDD (except pin RX) −0.3 VDD + 0.3 V VRX voltage at pin RX −10 +12 V Tj(max) maximum junction temperature − 140 °C Tstg storage temperature −65 +125 °C V Note 1.
Philips Semiconductors Product specification HITAG reader chip HTRC11001T 11 AC CHARACTERISTICS Tamb = −40 to +85 °C. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Oscillator inputs (pins XTAL1 and XTAL2) 4 − 16 MHz start-up time − 4 10 ms input capacitance on pin XTAL1 − 5 − pF between pins XTAL1 and XTAL2 0.9 1.3 3.
Philips Semiconductors Product specification HITAG reader chip HTRC11001T Alternatively to a crystal, a ceramic resonator can be used or an external clock source can be connected to pin XTAL1. 12 APPLICATION INFORMATION Figure 4 shows a minimal application circuitry for the HTRC11001T. The reader coil La together with the capacitor Ca forms a series resonant LC circuit (f0 = 125 kHz).
Philips Semiconductors Product specification HITAG reader chip HTRC11001T 13 PACKAGE OUTLINE SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 D E A X c y HE v M A Z 8 14 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 7 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.
Philips Semiconductors Product specification HITAG reader chip HTRC11001T If wave soldering is used the following conditions must be observed for optimal results: 14 SOLDERING 14.1 Introduction to soldering surface mount packages • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. This text gives a very brief insight to a complex technology.
Philips Semiconductors Product specification HITAG reader chip 14.5 HTRC11001T Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, HBGA, LFBGA, SQFP, TFBGA not suitable suitable(2) HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS not PLCC(3), SO, SOJ suitable LQFP, QFP, TQFP SSOP, TSSOP, VSO REFLOW(1) suitable suitable suitable not recommended(3)(4) suitable not recommended(5) suitable Notes 1.
Philips Semiconductors Product specification HITAG reader chip HTRC11001T 15 DATA SHEET STATUS DATA SHEET STATUS(1) PRODUCT STATUS(2) DEFINITIONS Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Preliminary data Qualification This data sheet contains data from the preliminary specification.
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