Datasheet

KMZ60 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2014. All rights reserved.
Product data sheet Rev. 2 — 7 February 2014 21 of 30
NXP Semiconductors
KMZ60
Angle sensor with integrated amplifier
13.6 Temperature reference output
On pin VTEMP a temperature dependent reference voltage V
O(TEMP)
is available.
This voltage is derived from an internal PTAT reference. For measurement with the
proposed ADC the voltage is tracking ratiometric with V
CC
. The reference can be used for
a temperature dependent offset and angular error calibration.
The output can be left open or connected to ground or preferably to V
CC
if not used.
13.7 Switching into Power-down mode
The Power-down mode can be activated by switching pin POWERDOWN_EN to V
CC
.
Within this mode the output pin VOUT1 and pin VOUT2 are set to high impedance to
avoid current consumption across the load resistors.
Pin VTEMP will be drawn to the ground level via an internal resistance.
The Power-down mode can be entered if pin TCC_EN is connected to V
CC
or ground.
13.8 Circuit behavior in case of broken bond wires
The output voltages V
o(VOUT1)
and V
o(VOUT2)
will be drawn to the ground level if the
implemented broken bond wire detection for all internal connections to the MR sensor is
activated.
With a broken bond wire on pin TCC_EN the pad will be drawn internally to V
CC
.
This activates the TC compensation for both signal outputs on pin VOUT1 and
pin VOUT2.
A broken bond wire on pin VTEMP will interrupt the output signal on pin VTEMP.
A broken bond wire on pin POWERDOWN_EN will disable the Power-down mode and
keep the device active via an internal pull-down.
13.9 Signal dependence on air-gap distance
KMZ60 measures the direction of the external magnetic field within its x-y plane.
The result is widely independent of the field strength as far as it is above the specified
minimum value. Within a homogeneous field in x-y direction the result is independent of its
placement in z direction (air-gap).
The nominal z distance of the internal x-y plane to the top surface of the plastic package is
405 m.
14. Test information
14.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q100 Rev-G - Failure mechanism based stress test qualification for
integrated circuits, and is suitable for use in automotive applications.