Datasheet

KMZ60 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2014. All rights reserved.
Product data sheet Rev. 2 — 7 February 2014 22 of 30
NXP Semiconductors
KMZ60
Angle sensor with integrated amplifier
15. Package information
15.1 Sensor reference position
Definition of angle reference related to the edges of pin 2 and pin 7 is shown in Figure 16.
Distance of sensor plane related to plastic top of the package is shown in Figure 17
.
The nominal distance is 405 m (minimum 290 m and maximum 513 m).
Distance between MR top surface and package top surface = (package top
thickness + downset)  (die thickness + glue line thickness).
15.2 Note
The package outline SOT96-1 (see Figure 18) allows a general wide tolerance for the
lead frame thickness and the lead width. The actual reference for KMZ60 is:
c = 0.203 mm  0.008 mm; b
p
=0.380mm 0.020 mm and e value does not vary
Fig 16. Definition of angle reference position
Fig 17. Distance between the MR top surface and the package top surface
001aan792
all leads
pin 1
2° max
all leads
+
0°
A
A
B
0.2
B0.5
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